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BCW68G_11

Description
PNP Small Signal Transistor 330mW
File Size184KB,3 Pages
ManufacturerMCC
Websitehttp://www.mccsemi.com
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BCW68G_11 Overview

PNP Small Signal Transistor 330mW

MCC
Micro Commercial Components
TM
  omponents
20736 Marilla
Street Chatsworth

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$ %    !"#
BCW68G
PNP Small
Signal Transistor
330mW
SOT-23
A
D
Features
Lead Free Finish/RoHS Compliant ("P" Suffix designates
RoHS Compliant. See ordering information)
Ideally Suited for Automatic Insertion
150
o
C Junction Temperature
Low Current, Low Frequency
Epitaxial Planar Die Construction
Epoxy meets UL 94 V-0 flammability rating
Moisure Sensitivity Level 1
Mechanical Data
Case: SOT-23, Molded Plastic
Terminals: Solderable per MIL-STD-202, Method 208
Marking: DG
Weight: 0.008 grams ( approx.)
C
B
C
B
F
E
E
Maximum Ratings @ 25
o
C Unless Otherwise Specified
Charateristic
Collector-Emitter Voltage
Collector-Base Voltage
Emitter-Base Voltage
Collector Current(DC)
Peak Collector Current
Base Current(DC)
Peak Base Current
Power Dissipation@T
s
=79
o
C
Thermal Resistance, Junction to
Ambient Air
Thermal Resistance, Junction to
Soldering Point
Operating & Storage Temperature
Symbol
V
CEO
V
CBO
V
EBO
I
C
I
CM
I
B
I
BM
P
d
R
θJA
R
θJS
Value
-45
-60
-5
-800
-1000
-100
-200
330
285
(1)
215
Unit
V
V
V
mA
mA
mA
mA
mW
o
G
H
J
K
DIMENSIONS
INCHES
MIN
.110
.083
.047
.035
.070
.018
.0005
.035
.003
.015
MM
MAX
.120
.098
.055
.041
.081
.024
.0039
.044
.007
.020
MIN
2.80
2.10
1.20
.89
1.78
.45
.013
.89
.085
.37
MAX
3.04
2.64
1.40
1.03
2.05
.60
.100
1.12
.180
.51
NOTE
DIM
A
B
C
D
E
F
G
H
J
K
C/W
C/W
o
.035
.900
Suggested Solder
Pad Layout
.031
.800
o
T
j
, T
STG
-55~150
C
.079
2.000
inches
mm
Notes:
(1) Valid provided that leads are kept at
ambient temperature.
.037
.950
.037
.950
www.mccsemi.com
Revision:
A
1
of 3
2011/01/01

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