RIAW16TTEB563GE datasheet, PDF

RIAW16TTEB563GE: DescriptionArray/Network Resistor, Isolated, Thin Film, 1W, 56000ohm, 100V, 2% +/-Tol, 25ppm/Cel, Surface Mount, 4141, SOIC, ROHS COMPLIANT; CategoryPassive components The resistor; File Size91KB，2 Pages; ManufacturerKOA Speer; Websitehttp://www.koaspeer.com/; Environmental Compliance

Download Datasheet Parametric View All

RIAW16TTEB563GE Overview

Array/Network Resistor, Isolated, Thin Film, 1W, 56000ohm, 100V, 2% +/-Tol, 25ppm/Cel, Surface Mount, 4141, SOIC, ROHS COMPLIANT

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
package instruction	SOIC, ROHS COMPLIANT
Reach Compliance Code	compliant
ECCN code	EAR99
structure	Chip
Component power consumption	0.1 W
The first element resistor	56000 Ω
JESD-609 code	e3
Manufacturer's serial number	RIA
Installation features	SURFACE MOUNT
Network Type	ISOLATED
Number of components	1
Number of functions	8
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package length	10.44 mm
Package shape	RECTANGULAR PACKAGE
Package form	SMT
Package width	10.44 mm
method of packing	TR, EMBOSSED PLASTIC, 13 INCH
Rated power dissipation(P)	1 W
Rated temperature	70 °C
resistance	56000 Ω
Resistor type	ARRAY/NETWORK RESISTOR
series	RIA16(T/E,GJ TOL)
size code	4141
surface mount	YES
technology	THIN FILM
Temperature Coefficient	25 ppm/°C
Temperature coefficient tracking	10 ppm/°C
Terminal surface	Matte Tin (Sn)
Terminal shape	GULL WING
Tolerance	2%
Operating Voltage	100 V

Digital tire pressure gauge system design information based on msp430 microcontroller + pressure sensor: [size=4][color=#252525]An article on the research and design of a digital tire pressure detector using a 430 single-chip microcomputer[/color] [color=#252525]Abstract: In view of the problem that impr...; fish001 Microcontroller MCU

[Audio recognizer based on GD32F350RB] 2. Test whether GD32F3xx can support edge computing: [i=s]This post was last edited by Beifang on 2018-9-20 11:56[/i] 1. In the design of the next generation of electronic products, edge computing is currently the most cutting-edge perspective. This is ...; 北方 GD32 MCU

EEWORLD University Hall----Principle and Operation of DC Bridge Fudan University: DC Bridge Principle and Operation Fudan University : https://training.eeworld.com.cn/course/5358DC Bridge Principle and Operation Fudan University...; 抛砖引玉 Test/Measurement

Learn how to place and retrieve materials using wireless controlled AGV: [size=18px] Now[/size][size=18px]With the progress of society, the shortage of labor and the increase in labor costs year by year, AGV intelligent automated vehicles are a way to replace manual produc...; dwzt Analog electronics

What is the packaging of integrated circuits? What are the common types of packaging? What are their respective characteristics?: [b][font=宋体][size=4] [/size][/font][/b][b][font=宋体][size=5][color=#0000ff]1. What is the package of integrated circuits? [/color][/size][/font][/b][font=宋体][size=4] [/size][/font] [align=left][color=r...; tiankai001 PCB Design

IC Industry Base: Entering the seventh year: China's three major IC industrial bases move from dream to reality 　　　　Author: He Xudong, Sun Changxu 　　　　　　In Shenzhen, more and more newly established IC companies want to...; hkn FPGA/CPLD

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components