|
SN74LVC1G00YEAR |
SN74LVC1G00YZAR |
SN74LVC1G00YEPR |
Description |
Logic Gates Single 2-Input Pos |
Logic Gates Single 2-Input Pos |
IC GATE NAND 1CH 2-INP 5DSBGA |
Is it Rohs certified? |
incompatible |
conform to |
incompatible |
Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Parts packaging code |
DSBGA |
DSBGA |
BGA |
package instruction |
VFBGA, BGA5,2X3,20 |
VFBGA, BGA5,2X3,20 |
VFBGA, BGA5,2X3,20 |
Contacts |
5 |
5 |
5 |
Reach Compliance Code |
_compli |
compli |
not_compliant |
Factory Lead Time |
1 week |
1 week |
1 week |
series |
LVC/LCX/Z |
LVC/LCX/Z |
LVC/LCX/Z |
JESD-30 code |
R-XBGA-B5 |
R-XBGA-B5 |
R-XBGA-B5 |
length |
1.4 mm |
1.4 mm |
1.4 mm |
Load capacitance (CL) |
50 pF |
50 pF |
50 pF |
Logic integrated circuit type |
NAND GATE |
NAND GATE |
NAND GATE |
MaximumI(ol) |
0.024 A |
0.024 A |
0.024 A |
Number of functions |
1 |
1 |
1 |
Number of entries |
2 |
2 |
2 |
Number of terminals |
5 |
5 |
5 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
Package body material |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
encapsulated code |
VFBGA |
VFBGA |
VFBGA |
Encapsulate equivalent code |
BGA5,2X3,20 |
BGA5,2X3,20 |
BGA5,2X3,20 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
method of packing |
TAPE AND REEL |
TAPE AND REEL |
TAPE AND REEL |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
power supply |
3.3 V |
3.3 V |
3.3 V |
propagation delay (tpd) |
9 ns |
9 ns |
9 ns |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Schmitt trigger |
NO |
NO |
NO |
Maximum seat height |
0.5 mm |
0.5 mm |
0.5 mm |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
1.65 V |
1.65 V |
1.65 V |
Nominal supply voltage (Vsup) |
1.8 V |
1.8 V |
1.8 V |
surface mount |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
BALL |
BALL |
BALL |
Terminal pitch |
0.5 mm |
0.5 mm |
0.5 mm |
Terminal location |
BOTTOM |
BOTTOM |
BOTTOM |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
0.9 mm |
0.9 mm |
0.9 mm |
Prop。Delay @ Nom-Su |
4.7 ns |
4.7 ns |
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