SN74LVC1G00YZAR datasheet, PDF

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SN74LVC1G00YZAR: DescriptionLogic Gates Single 2-Input Pos; Categorylogic logic; File Size323KB，13 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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SN74LVC1G00YZAR Overview

Logic Gates Single 2-Input Pos

SN74LVC1G00YZAR Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	DSBGA
package instruction	VFBGA, BGA5,2X3,20
Contacts	5
Reach Compliance Code	compli
Factory Lead Time	1 week
series	LVC/LCX/Z
JESD-30 code	R-XBGA-B5
length	1.4 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	NAND GATE
MaximumI(ol)	0.024 A
Number of functions	1
Number of entries	2
Number of terminals	5
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	UNSPECIFIED
encapsulated code	VFBGA
Encapsulate equivalent code	BGA5,2X3,20
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packing	TAPE AND REEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Prop。Delay @ Nom-Su	4.7 ns
propagation delay (tpd)	9 ns
Certification status	Not Qualified
Schmitt trigger	NO
Maximum seat height	0.5 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.65 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	0.9 mm

SN74LVC1G00YZAR Related Products

	SN74LVC1G00YZAR	SN74LVC1G00YEAR	SN74LVC1G00YEPR
Description	Logic Gates Single 2-Input Pos	Logic Gates Single 2-Input Pos	IC GATE NAND 1CH 2-INP 5DSBGA
Is it Rohs certified?	conform to	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	DSBGA	DSBGA	BGA
package instruction	VFBGA, BGA5,2X3,20	VFBGA, BGA5,2X3,20	VFBGA, BGA5,2X3,20
Contacts	5	5	5
Reach Compliance Code	compli	_compli	not_compliant
Factory Lead Time	1 week	1 week	1 week
series	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z
JESD-30 code	R-XBGA-B5	R-XBGA-B5	R-XBGA-B5
length	1.4 mm	1.4 mm	1.4 mm
Load capacitance (CL)	50 pF	50 pF	50 pF
Logic integrated circuit type	NAND GATE	NAND GATE	NAND GATE
MaximumI(ol)	0.024 A	0.024 A	0.024 A
Number of functions	1	1	1
Number of entries	2	2	2
Number of terminals	5	5	5
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	VFBGA	VFBGA	VFBGA
Encapsulate equivalent code	BGA5,2X3,20	BGA5,2X3,20	BGA5,2X3,20
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
method of packing	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3.3 V	3.3 V	3.3 V
propagation delay (tpd)	9 ns	9 ns	9 ns
Certification status	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	NO	NO	NO
Maximum seat height	0.5 mm	0.5 mm	0.5 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.65 V	1.65 V	1.65 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	BALL	BALL
Terminal pitch	0.5 mm	0.5 mm	0.5 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	0.9 mm	0.9 mm	0.9 mm
Prop。Delay @ Nom-Su	4.7 ns	4.7 ns	-

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