MM100E422L-5D datasheet, PDF - EEWORLD Datasheet

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MM100E422L-5D: DescriptionStandard SRAM, 256X4, 5ns, ECL100K, CDIP24,; Categorystorage storage; File Size251KB，6 Pages; ManufacturerAtmel (Microchip)

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MM100E422L-5D Overview

Standard SRAM, 256X4, 5ns, ECL100K, CDIP24,

MM100E422L-5D Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Atmel (Microchip)
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	5 ns
I/O type	SEPARATE
JESD-30 code	R-XDIP-T24
JESD-609 code	e0
memory density	1024 bit
Memory IC Type	STANDARD SRAM
memory width	4
Negative supply voltage rating	-4.5 V
Number of terminals	24
word count	256 words
character code	256
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature
organize	256X4
Output characteristics	OPEN-EMITTER
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.4
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
power supply	-4.5 V
Certification status	Not Qualified
Maximum slew rate	0.15 mA
surface mount	NO
technology	ECL100K
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

MM100E422L-5D Related Products

	MM100E422L-5D	MM10E422-5D	MM10E422L-5D	MM10E422L-7D	MM100E422-3D	MM100E422-5D	MM100E422L-7D	MM10E422-3D
Description	Standard SRAM, 256X4, 5ns, ECL100K, CDIP24,	Standard SRAM, 256X4, 5ns, ECL10K, CDIP24,	Standard SRAM, 256X4, 5ns, ECL10K, CDIP24,	Standard SRAM, 256X4, 7ns, ECL10K, CDIP24,	Standard SRAM, 256X4, 3ns, ECL100K, CDIP24,	Standard SRAM, 256X4, 5ns, ECL100K, CDIP24,	Standard SRAM, 256X4, 7ns, ECL100K, CDIP24,	Standard SRAM, 256X4, 3ns, ECL10K, CDIP24,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	5 ns	5 ns	5 ns	7 ns	3 ns	5 ns	7 ns	3 ns
I/O type	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE
JESD-30 code	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
memory density	1024 bit	1024 bit	1024 bit	1024 bit	1024 bit	1024 bit	1024 bit	1024 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	4	4	4	4	4	4	4	4
Negative supply voltage rating	-4.5 V	-5.2 V	-5.2 V	-5.2 V	-4.5 V	-4.5 V	-4.5 V	-5.2 V
Number of terminals	24	24	24	24	24	24	24	24
word count	256 words	256 words	256 words	256 words	256 words	256 words	256 words	256 words
character code	256	256	256	256	256	256	256	256
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	70 °C	70 °C	85 °C	85 °C	85 °C	70 °C
organize	256X4	256X4	256X4	256X4	256X4	256X4	256X4	256X4
Output characteristics	OPEN-EMITTER	OPEN-EMITTER	OPEN-EMITTER	OPEN-EMITTER	OPEN-EMITTER	OPEN-EMITTER	OPEN-EMITTER	OPEN-EMITTER
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP24,.4	DIP24,.4	DIP24,.4	DIP24,.4	DIP24,.4	DIP24,.4	DIP24,.4	DIP24,.4
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	-4.5 V	-5.2 V	-5.2 V	-5.2 V	-4.5 V	-4.5 V	-4.5 V	-5.2 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	0.15 mA	0.22 mA	0.15 mA	0.15 mA	0.22 mA	0.22 mA	0.15 mA	0.22 mA
surface mount	NO	NO	NO	NO	NO	NO	NO	NO
technology	ECL100K	ECL10K	ECL10K	ECL10K	ECL100K	ECL100K	ECL100K	ECL10K
Temperature level	OTHER	COMMERCIAL	COMMERCIAL	COMMERCIAL	OTHER	OTHER	OTHER	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	-

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