PDTC143TU datasheet, PDF - EEWORLD Datasheet

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PDTC143TU: DescriptionNPN resistor-equipped transistors; R1 = 4.7 kOHM, R2 = open; CategoryDiscrete semiconductor The transistor; File Size98KB，14 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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PDTC143TU Overview

NPN resistor-equipped transistors; R1 = 4.7 kOHM, R2 = open

PDTC143TU Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	SC-70
package instruction	PLASTIC, SC-70, 3 PIN
Contacts	3
Reach Compliance Code	compli
ECCN code	EAR99
Other features	BUILT-IN BIAS RESISTORS
Maximum collector current (IC)	0.1 A
Collector-emitter maximum voltage	50 V
Configuration	SINGLE WITH BUILT-IN RESISTOR
Minimum DC current gain (hFE)	200
JESD-30 code	R-PDSO-G3
JESD-609 code	e3
Humidity sensitivity level	1
Number of components	1
Number of terminals	3
Maximum operating temperature	150 °C
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	260
Polarity/channel type	NPN
Maximum power dissipation(Abs)	0.2 W
Certification status	Not Qualified
surface mount	YES
Terminal surface	Tin (Sn)
Terminal form	GULL WING
Terminal location	DUAL
Maximum time at peak reflow temperature	30
transistor applications	SWITCHING
Transistor component materials	SILICON

PDTC143TU Related Products

	PDTC143TU	PDTC143T	PDTC143TE	PDTC143TEF	PDTC143TK	PDTC143TM	PDTC143TS	PDTC143TT
Description	NPN resistor-equipped transistors; R1 = 4.7 kOHM, R2 = open	NPN resistor-equipped transistors; R1 = 4.7 kOHM, R2 = open	NPN resistor-equipped transistors; R1 = 4.7 kOHM, R2 = open	NPN resistor-equipped transistors; R1 = 4.7 kOHM, R2 = open	NPN resistor-equipped transistors; R1 = 4.7 kOHM, R2 = open	NPN resistor-equipped transistors; R1 = 4.7 kOHM, R2 = open	NPN resistor-equipped transistors; R1 = 4.7 kOHM, R2 = open	100 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-236AB
Is it Rohs certified?	conform to	-	conform to	conform to	conform to	conform to	conform to	conform to
Maker	NXP	-	NXP	NXP	NXP	NXP	NXP	NXP
Parts packaging code	SC-70	-	SC-75	SC-89	SOT-23	SC-101	TO-92	SOT-23
package instruction	PLASTIC, SC-70, 3 PIN	-	PLASTIC, SC-75, 3 PIN	PLASTIC, SC-89, 3 PIN	PLASTIC, SC-59A, 3 PIN	1 X 0.60 MM, 0.50 MM HEIGHT, LEADLESS, PLASTIC, SC-101, 3 PIN	PLASTIC, SC-43A, 3 PIN	PLASTIC PACKAGE-3
Contacts	3	-	3	3	3	3	3	3
Reach Compliance Code	compli	-	compli	unknow	unknow	compli	unknown	compli
ECCN code	EAR99	-	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Other features	BUILT-IN BIAS RESISTORS	-	BUILT-IN BIAS RESISTORS	BUILT-IN BIAS RESISTORS	BUILT-IN BIAS RESISTORS	BUILT-IN BIAS RESISTORS	BUILT-IN BIAS RESISTORS	BUILT-IN BIAS RESISTORS
Maximum collector current (IC)	0.1 A	-	0.1 A	0.1 A	0.1 A	0.1 A	0.1 A	0.1 A
Collector-emitter maximum voltage	50 V	-	50 V	50 V	50 V	50 V	50 V	50 V
Configuration	SINGLE WITH BUILT-IN RESISTOR	-	SINGLE WITH BUILT-IN RESISTOR	SINGLE WITH BUILT-IN RESISTOR	SINGLE WITH BUILT-IN RESISTOR	SINGLE WITH BUILT-IN RESISTOR	SINGLE WITH BUILT-IN RESISTOR	SINGLE WITH BUILT-IN RESISTOR
Minimum DC current gain (hFE)	200	-	200	200	200	200	200	200
JESD-30 code	R-PDSO-G3	-	R-PDSO-G3	R-PDSO-F3	R-PDSO-G3	R-PBCC-N3	O-PBCY-T3	R-PDSO-G3
JESD-609 code	e3	-	e3	e3	e3	e3	e3	e3
Number of components	1	-	1	1	1	1	1	1
Number of terminals	3	-	3	3	3	3	3	3
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	ROUND	RECTANGULAR
Package form	SMALL OUTLINE	-	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	CHIP CARRIER	CYLINDRICAL	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	260	-	260	NOT SPECIFIED	NOT SPECIFIED	260	NOT SPECIFIED	260
Polarity/channel type	NPN	-	NPN	NPN	NPN	NPN	NPN	NPN
Maximum power dissipation(Abs)	0.2 W	-	0.15 W	0.25 W	0.25 W	0.25 W	0.5 W	0.25 W
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	YES	-	YES	YES	YES	YES	NO	YES
Terminal surface	Tin (Sn)	-	Tin (Sn)	Tin (Sn)	Matte Tin (Sn)	Tin (Sn)	Matte Tin (Sn)	Tin (Sn)
Terminal form	GULL WING	-	GULL WING	FLAT	GULL WING	NO LEAD	THROUGH-HOLE	GULL WING
Terminal location	DUAL	-	DUAL	DUAL	DUAL	BOTTOM	BOTTOM	DUAL
Maximum time at peak reflow temperature	30	-	30	NOT SPECIFIED	NOT SPECIFIED	30	NOT SPECIFIED	30
transistor applications	SWITCHING	-	SWITCHING	SWITCHING	SWITCHING	SWITCHING	SWITCHING	SWITCHING
Transistor component materials	SILICON	-	SILICON	SILICON	SILICON	SILICON	SILICON	SILICON

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