NPN resistor-equipped transistors; R1 = 4.7 kOHM, R2 = open
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | NXP |
| Parts packaging code | SC-101 |
| package instruction | 1 X 0.60 MM, 0.50 MM HEIGHT, LEADLESS, PLASTIC, SC-101, 3 PIN |
| Contacts | 3 |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| Other features | BUILT-IN BIAS RESISTORS |
| Shell connection | COLLECTOR |
| Maximum collector current (IC) | 0.1 A |
| Collector-emitter maximum voltage | 50 V |
| Configuration | SINGLE WITH BUILT-IN RESISTOR |
| Minimum DC current gain (hFE) | 200 |
| JESD-30 code | R-PBCC-N3 |
| JESD-609 code | e3 |
| Humidity sensitivity level | 1 |
| Number of components | 1 |
| Number of terminals | 3 |
| Maximum operating temperature | 150 °C |
| Package body material | PLASTIC/EPOXY |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | 260 |
| Polarity/channel type | NPN |
| Maximum power dissipation(Abs) | 0.25 W |
| Certification status | Not Qualified |
| surface mount | YES |
| Terminal surface | Tin (Sn) |
| Terminal form | NO LEAD |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | 30 |
| transistor applications | SWITCHING |
| Transistor component materials | SILICON |
| PDTC143TM | PDTC143T | PDTC143TE | PDTC143TEF | PDTC143TK | PDTC143TS | PDTC143TT | PDTC143TU | |
|---|---|---|---|---|---|---|---|---|
| Description | NPN resistor-equipped transistors; R1 = 4.7 kOHM, R2 = open | NPN resistor-equipped transistors; R1 = 4.7 kOHM, R2 = open | NPN resistor-equipped transistors; R1 = 4.7 kOHM, R2 = open | NPN resistor-equipped transistors; R1 = 4.7 kOHM, R2 = open | NPN resistor-equipped transistors; R1 = 4.7 kOHM, R2 = open | NPN resistor-equipped transistors; R1 = 4.7 kOHM, R2 = open | 100 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-236AB | NPN resistor-equipped transistors; R1 = 4.7 kOHM, R2 = open |
| Is it Rohs certified? | conform to | - | conform to | conform to | conform to | conform to | conform to | conform to |
| Maker | NXP | - | NXP | NXP | NXP | NXP | NXP | NXP |
| Parts packaging code | SC-101 | - | SC-75 | SC-89 | SOT-23 | TO-92 | SOT-23 | SC-70 |
| package instruction | 1 X 0.60 MM, 0.50 MM HEIGHT, LEADLESS, PLASTIC, SC-101, 3 PIN | - | PLASTIC, SC-75, 3 PIN | PLASTIC, SC-89, 3 PIN | PLASTIC, SC-59A, 3 PIN | PLASTIC, SC-43A, 3 PIN | PLASTIC PACKAGE-3 | PLASTIC, SC-70, 3 PIN |
| Contacts | 3 | - | 3 | 3 | 3 | 3 | 3 | 3 |
| Reach Compliance Code | compli | - | compli | unknow | unknow | unknown | compli | compli |
| ECCN code | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Other features | BUILT-IN BIAS RESISTORS | - | BUILT-IN BIAS RESISTORS | BUILT-IN BIAS RESISTORS | BUILT-IN BIAS RESISTORS | BUILT-IN BIAS RESISTORS | BUILT-IN BIAS RESISTORS | BUILT-IN BIAS RESISTORS |
| Maximum collector current (IC) | 0.1 A | - | 0.1 A | 0.1 A | 0.1 A | 0.1 A | 0.1 A | 0.1 A |
| Collector-emitter maximum voltage | 50 V | - | 50 V | 50 V | 50 V | 50 V | 50 V | 50 V |
| Configuration | SINGLE WITH BUILT-IN RESISTOR | - | SINGLE WITH BUILT-IN RESISTOR | SINGLE WITH BUILT-IN RESISTOR | SINGLE WITH BUILT-IN RESISTOR | SINGLE WITH BUILT-IN RESISTOR | SINGLE WITH BUILT-IN RESISTOR | SINGLE WITH BUILT-IN RESISTOR |
| Minimum DC current gain (hFE) | 200 | - | 200 | 200 | 200 | 200 | 200 | 200 |
| JESD-30 code | R-PBCC-N3 | - | R-PDSO-G3 | R-PDSO-F3 | R-PDSO-G3 | O-PBCY-T3 | R-PDSO-G3 | R-PDSO-G3 |
| JESD-609 code | e3 | - | e3 | e3 | e3 | e3 | e3 | e3 |
| Number of components | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 3 | - | 3 | 3 | 3 | 3 | 3 | 3 |
| Package body material | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package shape | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | ROUND | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | CYLINDRICAL | SMALL OUTLINE | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | 260 | - | 260 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 260 | 260 |
| Polarity/channel type | NPN | - | NPN | NPN | NPN | NPN | NPN | NPN |
| Maximum power dissipation(Abs) | 0.25 W | - | 0.15 W | 0.25 W | 0.25 W | 0.5 W | 0.25 W | 0.2 W |
| Certification status | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | YES | - | YES | YES | YES | NO | YES | YES |
| Terminal surface | Tin (Sn) | - | Tin (Sn) | Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Tin (Sn) | Tin (Sn) |
| Terminal form | NO LEAD | - | GULL WING | FLAT | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
| Terminal location | BOTTOM | - | DUAL | DUAL | DUAL | BOTTOM | DUAL | DUAL |
| Maximum time at peak reflow temperature | 30 | - | 30 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 30 | 30 |
| transistor applications | SWITCHING | - | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING |
| Transistor component materials | SILICON | - | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
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