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MT48LC16M16A2P-6A IT:G

Description
DRAM Chip SDR SDRAM 256Mbit 16Mx16 3.3V 54-Pin TSOP-II Tray
File Size1MB,94 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Download Datasheet Parametric View All

MT48LC16M16A2P-6A IT:G Overview

DRAM Chip SDR SDRAM 256Mbit 16Mx16 3.3V 54-Pin TSOP-II Tray

MT48LC16M16A2P-6A IT:G Parametric

Parameter NameAttribute value
EU restricts the use of certain hazardous substancesCompliant
ECCN (US)EAR99
Part StatusActive
HTS8542.32.00.24
DRAM TypeSDR SDRAM
Chip Density (bit)256M
Organization16Mx16
Number of Internal Banks4
Number of Words per Bank4M
Number of Bits/Word (bit)16
Data Bus Width (bit)16
Maximum Clock Rate (MHz)167
Maximum Access Time (ns)17|5.4|7.5
Address Bus Width (bit)15
Process TechnologyCMOS
Interface TypeLVTTL
Minimum Operating Supply Voltage (V)3
Typical Operating Supply Voltage (V)3.3
Maximum Operating Supply Voltage (V)3.6
Operating Current (mA)100
Minimum Operating Temperature (°C)-40
Maximum Operating Temperature (°C)85
Supplier Temperature GradeIndustrial
Number of I/O Lines (bit)16
PackagingTray
Supplier PackageTSOP-II
Pin Count54
Standard Package NameSOP
MountingSurface Mount
Package Height1(Max)
Package Length22.22
Package Width10.16
PCB changed54
Lead ShapeGull-wing
256Mb: x4, x8, x16 SDRAM
Features
SDR SDRAM
MT48LC64M4A2 – 16 Meg x 4 x 4 banks
MT48LC32M8A2 – 8 Meg x 8 x 4 banks
MT48LC16M16A2 – 4 Meg x 16 x 4 banks
Features
• PC100- and PC133-compliant
• Fully synchronous; all signals registered on positive
edge of system clock
• Internal, pipelined operation; column address can
be changed every clock cycle
• Internal banks for hiding row access/precharge
• Programmable burst lengths: 1, 2, 4, 8, or full page
• Auto precharge, includes concurrent auto precharge
and auto refresh modes
• Self refresh mode (not available on AT devices)
• Auto refresh
– 64ms, 8192-cycle refresh (commercial and
industrial)
– 16ms, 8192-cycle refresh (automotive)
• LVTTL-compatible inputs and outputs
• Single 3.3V ±0.3V power supply
Options
• Configurations
– 64 Meg x 4 (16 Meg x 4 x 4 banks)
– 32 Meg x 8 (8 Meg x 8 x 4 banks)
– 16 Meg x 16 (4 Meg x 16 x 4 banks)
• Write recovery (
t
WR)
t
WR = 2 CLK
• Plastic package – OCPL
1
– 54-pin TSOP II OCPL
1
(400 mil)
(standard)
– 54-pin TSOP II OCPL
1
(400 mil)
Pb-free
– 60-ball TFBGA (x4, x8) (8mm x
16mm)
– 60-ball TFBGA (x4, x8) (8mm x
16mm) Pb-free
– 54-ball VFBGA (x16) (8mm x 14 mm)
– 54-ball VFBGA (x16) (8mm x 14 mm)
Pb-free
– 54-ball VFBGA (x16) (8mm x 8 mm)
– 54-ball VFBGA (x16) (8mm x 8 mm)
Pb-free
• Timing – cycle time
– 6ns @ CL = 3 (x8, x16 only)
– 7.5ns @ CL = 3 (PC133)
– 7.5ns @ CL = 2 (PC133)
• Self refresh
– Standard
– Low power
• Operating temperature range
– Commercial (0˚C to +70˚C)
– Industrial (–40˚C to +85˚C)
– Automotive (–40˚C to +105˚C)
• Revision
Notes:
1.
2.
3.
4.
Off-center parting line.
Only available on Revision D.
Only available on Revision G.
Contact Micron for availability.
Marking
64M4
32M8
16M16
A2
TG
P
FB
BB
FG
2
BG
2
F4
3
B4
3
-6A
-75
2
-7E
None
L
2
,
4
None
IT
AT
4
:D/:G
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. W 05/15 EN
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 1999 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.

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