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WED8LM32129C-17EIT

Description
SRAM Module, 128KX32, 17ns, CMOS, CQFP68, 23.88 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68
Categorystorage    storage   
File Size155KB,6 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

WED8LM32129C-17EIT Overview

SRAM Module, 128KX32, 17ns, CMOS, CQFP68, 23.88 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68

WED8LM32129C-17EIT Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicrosemi
package instruction23.88 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68
Reach Compliance Codeunknown
Maximum access time17 ns
Other featuresUSER CONFIGURABLE AS 512K X 8
Spare memory width16
JESD-30 codeS-CQFP-G68
length23.88 mm
memory density4194304 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals68
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height3.56 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width23.88 mm
WED8LM32129C
HI-RELIABILITY PRODUCT
128Kx32 SRAM MODULE
FEATURES
s
Access Times of 15, 17, 20, 25, 35, 45, 55ns
s
Packaging
PRELIMINARY*
• 68 lead, 23.88mm Low Profile CQFP, 3.56mm (0.140")
s
Organized as 128Kx32; User Configurable as 256Kx16 or
512Kx8
s
Commercial, Industrial and Military Temperature Ranges
s
5 Volt Power Supply
s
Low Power CMOS
s
TTL Compatible Inputs and Outputs
s
Built in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation
s
Device is upgradeable to 512Kx32
* This data sheet describes a product under development, not fully
characterized, and is subject to change without notice.
FIG. 1
PIN CONFIGURATION FOR WED8LM32129C-E
TOP VIEW
NC
A
0
A
1
A
2
A
3
A
4
A
5
CS
3
GND
CS
4
WE
1
A
6
A
7
A
8
A
9
A
10
V
CC
PIN DESCRIPTION
I/O
0-31
A
0-16
I/O
16
I/O
17
I/O
18
I/O
19
I/O
20
I/O
21
I/O
22
I/O
23
GND
I/O
24
I/O
25
I/O
26
I/O
27
I/O
28
I/O
29
I/O
30
I/O
31
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61
I/O
0
I/O
1
I/O
2
I/O
3
I/O
4
I/O
5
I/O
6
I/O
7
GND
I/O
8
I/O
9
I/O
10
I/O
11
I/O
12
I/O
13
I/O
14
I/O
15
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
WE
2
WE
3
WE
4
V
CC
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
CS
1
OE
A
11
A
12
A
13
A
14
A
15
A
16
NC
WE
1-4
CS
1-4
OE
0.940"
V
CC
GND
NC
The WEDC 68 lead CQFP fills
the same fit and function as the
JEDEC 68 lead CQFJ or 68
PLCC. But the CQFP has the
TCE and lead inspection
advantage of the CQFP form.
CS
2
NC
NC
NC
BLOCK DIAGRAM
WE
1
CS
1
OE
A
0-16
128K x 8
128K x 8
WE
2
CS
2
WE
3
CS
3
WE
4
CS
4
128K x 8
128K x 8
8
8
8
8
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
July 1999 Rev. 0
1
White Electronic Designs Corporation • (602) 437-1520 • www.whitedc.com

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