Flash, 128MX16, PBGA63, BGA-63
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | SPANSION |
package instruction | BGA-63 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
JESD-30 code | R-PBGA-B63 |
length | 11 mm |
memory density | 2147483648 bit |
Memory IC Type | FLASH |
memory width | 16 |
Number of functions | 1 |
Number of terminals | 63 |
word count | 134217728 words |
character code | 128000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 128MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | VFBGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
Programming voltage | 1.8 V |
Maximum seat height | 1 mm |
Maximum supply voltage (Vsup) | 1.95 V |
Minimum supply voltage (Vsup) | 1.7 V |
Nominal supply voltage (Vsup) | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
type | SLC NAND TYPE |
width | 9 mm |