VSM2110
Vishay Foil Resistors
SURFACE MOUNT
Bulk Metal
®
Foil Technology
Discrete Surface Mount Chip Resistors
FEATURES
• Temperature Coefficient of Resistance:
Nominal TCR: + 0.6ppm/°C (0°C to + 25°C)
- 0.6ppm/°C (+ 25°C to + 60°C)
+ 2.2ppm/°C (– 55°C to + 25°C)
- 1.8ppm/°C (+ 25°C to + 125°C)
Product may not
be to scale
•
Resistance Range: 5Ω to 100KΩ
•
Tolerance: to
±
0.01%
•
Load Life Stability:
±
0.025% Maximum
∆R
under full rated power @ + 70°C for 2,000 hours
•
Shelf Life Stability: 50ppm/year (0.005%) Maximum
∆R
non-hermetically sealed
•
Voltage Coefficient: < 0.00001%/volt (< 0.1ppm/V)
•
Current Noise: < 0.010µV(rms)/volt of applied voltage
•
Non Inductive: < 3.0nH
The VSM2110 Precision Surface Mount Chip Resistor utilizes
the Vishay Bulk Metal
®
Foil technology with its inherent low
TCR and stability which is an order of magnitude better than
Thin Film technology. The VSM2110 chip, at 0.2 watts at 70°C
and 100K ohms, provides the highest power/ohmic value to
footprint ratio of the VSM surface mount chip resistor series;
and is the same element utilized in other well established Vishay
Foil products. The VSM2110 is listed on DSCC specification
93078.
The VSM surface mount chip series provides a significant
improvement over other chip resistor technologies. Their
specifications exceed the requirements of MIL-PRF-55342.
The low TCR, tight tolerances, excellent stability and superior
performance specifications provide the ultimate resistor component
for analog applications.
A voltage divider can be fashioned using two arbitrarily selected
VSM2110 chips resulting in a tracking specification of < 3ppm/°C.
TABLE 1 - TOLERANCE VERSUS RESISTANCE VALUE
VALUE
(
Ω
)
250Ω to 100K
100Ω to < 250
50Ω to < 100
25Ω to < 50
10Ω to < 25
TIGHTEST
TOLERANCE (%)*
±
0.01
±
0.02
±
0.05
±
0.1
±
0.25
±
0.5
FIGURE 1 - NOMINAL TCR CURVE
5Ω to < 10
–55
–50
+500
+400
+300
+200
+100
–25
0
+25
+50
+75
+100
+125
*Tighter tolerances are available. Please contact Application
Engineering. Soldering temperatures used during installation may
cause resistance to shift up to 0.05%.
-5
pp
m
p
+5
pm
TABLE 2 - TYPICAL PERFORMANCE SPECIFICATIONS
TEST
MIL-PRF-55342G
CHARACTERISTIC E
∆
R LIMITS
±
0.10%
±
0.10%
±
0.10%
±
0.10%
±
0.20%
±
0.20%
±
0.50%
VSM2110
MAXIMUM
∆
R LIMITS*
±
0.02%
±
0.02%
±
0.02%
±
0.05%
±
0.05%
±
0.10%
±
0.025%
Nominal Resistance/
Temperature (RT) Curve
∆R
R
(ppm)
0
–100
–200
–300
–400
–500
Maximum
Spread
±2.3
ppm/°C
+2.2 ppm/°C
Nominal Chord
Slope (TCR)
–1.8 ppm/°C
Nominal Chord
Slope (TCR)
Standard
Spread
±2.0
ppm/°C
Thermal Shock
Low Temperature Operation
Short Time Overload
–55°C / +25°C / +125°C are the test points
with +25°C as the reference temperature
High Temperature Exposure
Resistance to Bonding
The TCR for values < 250Ω are influenced by the termination
composition and result in a deviation from this curve. Contact our
application engineering department for detailed specification on low
values
Moisture Resistance
Life 2,000 hours @ + 70
°
C
*As shown + 0.001 Ohms to allow for measurement errors at low values.
VISHAY FOIL • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31
• GERMANY +49.9287.710 FAX: +49 9287.70435
• ISRAEL +972.3.557.0945 FAX: +972.3.558.9121
• ITALY + 39.2.300.11919 FAX: +39.2.300.11999
• JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433
• SINGAPORE +65.788.6668 FAX: +65.788.0988
• SWEDEN +46.8.594.70590 FAX: +46.8.594.70581
• UK +44 191 514 8237 FAX: +44 1953 457 722
• USA +1 610 407-4800 FAX: +1 610 640-9081
www.vishay.com
26
Document Number: 63074
Revision 15-Dec-03
VSM2110
Bulk Metal
®
Foil Technology
Discrete Surface Mount Chips
FIGURE 2 - POWER DERATING CURVE
Percent of Rated Power
125
100
Vishay Foil Resistors
SURFACE MOUNT
FIGURE 3 - RECOMMENDED MOUNTING
–55°C
+70°C
Rated Power
25% to 85% of T
75
50
25
0
-75
–50
–25
0
+25
+50
+75
+100 +125 +150 +175
Ambient Temperature (°C)
A low profile solder fillet is
recommended to avoid unnecessary
stresses along top edge of metallization.
IR and vapor phase reflow are best.
Avoid the use of cleaning agents which
could attack epoxy resins, which form part
of the resistor construction.
TABLE 3 - CHIP SIZES AND SPECIFICATIONS
in inches (millimeters)
Bottom View for Mounting
Uncoated
Ceramic
L
X
T
D
W
G
Z
Footprint
Recommended Land Pattern
CHIP
SIZE
POWER MAXIMUM RESISTANCE MAXIMUM
L
W
T
D
+ 70
°
C VOLTAGE RANGE
WEIGHT
Z*
G*
X*
±
0.005 (0.13)
±
0.005 (0.13) MAXIMUM
±
0.005 (0.13) (mW)
(V)
(
Ω
)
(mg)
±
0.004 (0.10)
±
0.004 (0.10)
±
0.004 (0.10)
0.095 (2.41) 0.025 (0.64) 0.018 (0.46)
200
140
5 - 100K
26
0.248 (6.29)
0.146 (3.71)
0.095 (2.41)
2110 0.205 (5.21)
*Land Pattern Dimensions (Z, G, X) are per IPC-782A
TABLE 4 - DSCC SPECIFICATIONS
Vishay resistors are listed on the following DSCC specification:
93078
VSM 2110
TABLE 5 - ORDERING INFORMATION
MODEL
VSM
CHIP SIZE
2110
RESISTANCE
RANGE
RESISTANCE VALUE
LETTER
DESIGNATOR
MULTIPLIER
FACTOR
x1.0
x10
3
TOLERANCE
T
Q
A
B
C
D
F
±
0.01%
±
0.02%
±
0.05%
±
0.1%
±
0.25%
±
0.5%
±
1.0%
TERMINATION
B - solderable
PACKAGING
T = Tape and Reel
W = Waffle Pack
5Ω to < 1KΩ
R
Example: 249R00 = 249Ω
1K to 100KΩ
K
Example: 24K900 = 24.9KΩ
Example: VSM 2110 5K1200 AB
VISHAY FOIL • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31
• GERMANY +49.9287.710 FAX: +49 9287.70435
• ISRAEL +972.3.557.0945 FAX: +972.3.558.9121
• ITALY + 39.2.300.11919 FAX: +39.2.300.11999
• JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433
• SINGAPORE +65.788.6668 FAX: +65.788.0988
• SWEDEN +46.8.594.70590 FAX: +46.8.594.70581
• UK +44 191 514 8237 FAX: +44 1953 457 722
• USA +1 610 407-4800 FAX: +1 610 640-9081
Document Number: 63074
Revision 15-Dec-03
www.vishay.com
27
Microchip MCU
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