DUAL COMPARATOR, 8000 uV OFFSET-MAX, 4000 ns RESPONSE TIME, PDSO8
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | National Semiconductor(TI ) |
Parts packaging code | SOIC |
package instruction | SOIC-8 |
Contacts | 8 |
Reach Compliance Code | _compli |
ECCN code | EAR99 |
Amplifier type | COMPARATOR |
Maximum input offset voltage | 8000 µV |
JESD-30 code | R-PDSO-G8 |
JESD-609 code | e0 |
length | 4.9 mm |
Humidity sensitivity level | 1 |
Negative supply voltage upper limit | |
Nominal Negative Supply Voltage (Vsup) | |
Number of functions | 2 |
Number of terminals | 8 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Output type | OPEN-DRAIN |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Encapsulate equivalent code | SOP8,.25 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | 235 |
power supply | 2.7/15 V |
Certification status | Not Qualified |
Nominal response time | 4000 ns |
Maximum seat height | 1.75 mm |
Maximum slew rate | 0.025 mA |
Supply voltage upper limit | 16 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 30 |
width | 3.9 mm |
LMC6772AIMX | LMC6772 | LMC6772AIM | LMC6772AIN | LMC6772BIM | LMC6772BIMX | LMC6772BIN | |
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Description | DUAL COMPARATOR, 8000 uV OFFSET-MAX, 4000 ns RESPONSE TIME, PDSO8 | DUAL COMPARATOR, 8000 uV OFFSET-MAX, 4000 ns RESPONSE TIME, PDSO8 | DUAL COMPARATOR, 8000 uV OFFSET-MAX, 4000 ns RESPONSE TIME, PDSO8 | DUAL COMPARATOR, 8000 uV OFFSET-MAX, 4000 ns RESPONSE TIME, PDSO8 | DUAL COMPARATOR, 8000 uV OFFSET-MAX, 4000 ns RESPONSE TIME, PDSO8 | DUAL COMPARATOR, 8000 uV OFFSET-MAX, 4000 ns RESPONSE TIME, PDSO8 | DUAL COMPARATOR, 8000 uV OFFSET-MAX, 4000 ns RESPONSE TIME, PDSO8 |
Amplifier type | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR |
Maximum input offset voltage | 8000 µV | 8000 mV | 8000 µV | 15000 µV | 18000 µV | 18000 µV | 18000 µV |
Number of functions | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Maximum operating temperature | 85 °C | 85 Cel | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 Cel | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
Output type | OPEN-DRAIN | O-DRN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN |
surface mount | YES | Yes | YES | NO | YES | YES | NO |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal form | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Is it Rohs certified? | incompatible | - | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | National Semiconductor(TI ) | - | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) |
Parts packaging code | SOIC | - | SOIC | DIP | SOIC | SOIC | DIP |
package instruction | SOIC-8 | - | SOIC-8 | DIP, DIP8,.3 | SOP, SOP8,.25 | SOP, SOP8,.25 | DIP, DIP8,.3 |
Contacts | 8 | - | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | _compli | - | _compli | compli | _compli | _compli | _compli |
ECCN code | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
JESD-30 code | R-PDSO-G8 | - | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 |
JESD-609 code | e0 | - | e0 | e0 | e0 | e0 | e0 |
length | 4.9 mm | - | 4.9 mm | 9.817 mm | 4.9 mm | 4.9 mm | 9.817 mm |
Humidity sensitivity level | 1 | - | 1 | 1 | 1 | 1 | 1 |
Package body material | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOP | - | SOP | DIP | SOP | SOP | DIP |
Encapsulate equivalent code | SOP8,.25 | - | SOP8,.25 | DIP8,.3 | SOP8,.25 | SOP8,.25 | DIP8,.3 |
Package shape | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | - | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
Peak Reflow Temperature (Celsius) | 235 | - | 235 | 260 | 235 | 235 | 260 |
power supply | 2.7/15 V | - | 2.7/15 V | 2.7/15 V | 2.7/15 V | 2.7/15 V | 2.7/15 V |
Certification status | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Nominal response time | 4000 ns | - | 4000 ns | 4000 ns | 4000 ns | 4000 ns | 4000 ns |
Maximum seat height | 1.75 mm | - | 1.75 mm | 5.08 mm | 1.75 mm | 1.75 mm | 5.08 mm |
Maximum slew rate | 0.025 mA | - | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA |
Supply voltage upper limit | 16 V | - | 16 V | 16 V | 16 V | 16 V | 16 V |
Nominal supply voltage (Vsup) | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V |
technology | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS |
Terminal surface | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal pitch | 1.27 mm | - | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
Maximum time at peak reflow temperature | 30 | - | 30 | NOT SPECIFIED | 30 | 30 | 40 |
width | 3.9 mm | - | 3.9 mm | 7.62 mm | 3.9 mm | 3.9 mm | 7.62 mm |