OP-AMP
| Parameter Name | Attribute value |
| state | ACTIVE |
| Amplifier type | Operational Amplifier |
| LMC6482MN | LMC6482 | LMC6482AIM | LMC6482AIN | LMC6482AMJ/883 | LMC6482IM | LMC6482IMM | LMC6482IN | |
|---|---|---|---|---|---|---|---|---|
| Description | OP-AMP | OP-AMP | OP-AMP | DUAL OP-AMP, 750 uV OFFSET-MAX, 1.5 MHz BAND WIDTH, PDIP8 | DUAL OP-AMP, 3000 uV OFFSET-MAX, 1.5 MHz BAND WIDTH, CDIP8 | OP-AMP | DUAL OP-AMP, 3000 uV OFFSET-MAX, 1.5 MHz BAND WIDTH, PDSO8 | DUAL OP-AMP, 3000 uV OFFSET-MAX, 1.5 MHz BAND WIDTH, PDIP8 |
| Amplifier type | Operational Amplifier | Operational Amplifier | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| Is it Rohs certified? | - | - | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | - | - | SOIC | DIP | DIP | SOIC | SOIC | DIP |
| package instruction | - | - | SOP, SOP8,.25 | PLASTIC, DIP-8 | DIP, DIP8,.3 | SO-8 | MSOP-8 | PLASTIC, DIP-8 |
| Contacts | - | - | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | - | - | _compli | _compli | _compli | _compli | _compli | _compli |
| ECCN code | - | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Architecture | - | - | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| Maximum average bias current (IIB) | - | - | 0.000004 µA | 0.000004 µA | 0.0001 µA | 0.000004 µA | - | 0.000004 µA |
| Nominal Common Mode Rejection Ratio | - | - | 82 dB | 82 dB | 82 dB | 82 dB | 82 dB | 82 dB |
| frequency compensation | - | - | YES | YES | YES | YES | YES | YES |
| Maximum input offset voltage | - | - | 750 µV | 750 µV | 3000 µV | 3000 µV | 3000 µV | 3000 µV |
| JESD-30 code | - | - | R-PDSO-G8 | R-PDIP-T8 | R-GDIP-T8 | R-PDSO-G8 | S-PDSO-G8 | R-PDIP-T8 |
| JESD-609 code | - | - | e0 | e0 | e0 | e0 | e0 | e0 |
| length | - | - | 4.9 mm | 9.817 mm | - | 4.9 mm | 3 mm | 9.817 mm |
| low-bias | - | - | YES | YES | YES | YES | YES | YES |
| low-dissonance | - | - | NO | NO | NO | NO | NO | NO |
| micropower | - | - | YES | YES | NO | YES | YES | YES |
| Humidity sensitivity level | - | - | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of functions | - | - | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | - | - | 8 | 8 | 8 | 8 | 8 | 8 |
| Maximum operating temperature | - | - | 85 °C | 85 °C | 125 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | - | - | -40 °C | -40 °C | -55 °C | -40 °C | -40 °C | -40 °C |
| Package body material | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | - | - | SOP | DIP | DIP | SOP | TSSOP | DIP |
| Encapsulate equivalent code | - | - | SOP8,.25 | DIP8,.3 | DIP8,.3 | SOP8,.25 | TSSOP8,.19 | DIP8,.3 |
| Package shape | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | - | - | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE |
| method of packing | - | - | RAIL | RAIL | - | RAIL | RAIL | RAIL |
| Peak Reflow Temperature (Celsius) | - | - | 235 | 260 | 260 | 235 | 260 | 260 |
| power supply | - | - | 3/15 V | 3/15 V | 3/15 V | 3/15 V | 3/15 V | 3/15 V |
| Certification status | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | - | - | 1.75 mm | 5.08 mm | 5.08 mm | 1.75 mm | 1.1 mm | 5.08 mm |
| minimum slew rate | - | - | 0.7 V/us | 0.7 V/us | 0.6 V/us | 0.63 V/us | 0.63 V/us | 0.63 V/us |
| Nominal slew rate | - | - | 1.3 V/us | 1.3 V/us | 1.3 V/us | 1.3 V/us | 1.3 V/us | 1.3 V/us |
| Maximum slew rate | - | - | 1.9 mA | 1.9 mA | 2 mA | 1.9 mA | 1.9 mA | 1.9 mA |
| Supply voltage upper limit | - | - | 16 V | 16 V | 16 V | 16 V | 16 V | 16 V |
| Nominal supply voltage (Vsup) | - | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | - | - | YES | NO | NO | YES | YES | NO |
| technology | - | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | - | - | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | - | - | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
| Terminal pitch | - | - | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 0.65 mm | 2.54 mm |
| Terminal location | - | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | - | - | 30 | 40 | 40 | 30 | 40 | 40 |
| Nominal Uniform Gain Bandwidth | - | - | 1500 kHz | 1500 kHz | 1500 kHz | 1500 kHz | 1500 kHz | 1500 kHz |
| Minimum voltage gain | - | - | 13000 | 13000 | 13000 | 10000 | 10000 | 10000 |
| width | - | - | 3.9 mm | 7.62 mm | 7.62 mm | 3.9 mm | 3 mm | 7.62 mm |
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