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EPC1064LCI20

Description
Configuration Memory, 64KX1, PQCC20, PLASTIC, LCC-20
Categorystorage    storage   
File Size381KB,28 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
Download Datasheet Parametric Compare View All

EPC1064LCI20 Overview

Configuration Memory, 64KX1, PQCC20, PLASTIC, LCC-20

EPC1064LCI20 Parametric

Parameter NameAttribute value
MakerIntel
package instructionQCCJ, LCC20,.39SQ
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time75 ns
Maximum clock frequency (fCLK)8 MHz
JESD-30 codeS-PQCC-J20
length8.9662 mm
memory density65536 bit
Memory IC TypeCONFIGURATION MEMORY
memory width1
Number of functions1
Number of terminals20
word count65536 words
character code64000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize64KX1
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLCC20,.39SQ
Package shapeSQUARE
Package formCHIP CARRIER
Parallel/SerialSERIAL
Certification statusNot Qualified
Maximum seat height4.572 mm
Maximum standby current0.0002 A
Maximum slew rate0.05 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
width8.9662 mm
Configuration Devices for
®
ACEX, APEX, FLEX & Mercury Devices
Data Sheet
March 2001, ver. 11
Features
s
s
s
s
s
s
s
s
Serial device family for configuring ACEX
TM
, APEX
TM
(including
APEX 20K, APEX 20KC, and APEX 20KE), FLEX
®
(FLEX 10KE and
FLEX 10KA), and Mercury
TM
devices
Easy-to-use 4-pin interface to ACEX, APEX, FLEX, and Mercury
devices
Low current during configuration and near-zero standby current
5.0-V and 3.3-V operation
Software design support with the Altera
®
Quartus
TM
and
MAX+PLUS
®
II development systems for Windows-based PCs as
well as Sun SPARCstation, and HP 9000 Series 700/800
Programming support with Altera’s Master Programming Unit
(MPU) and programming hardware from Data I/O,
BP Microsystems, and other manufacturers
Available in compact plastic packages (see
Figures 1
and
2)
8-pin plastic dual in-line package (PDIP)
20-pin plastic J-lead chip carrier (PLCC) package
32-pin plastic thin quad flat pack (TQFP) package
EPC2 device has reprogrammable Flash configuration memory
5.0-V and 3.3-V in-system programmability (ISP) through the
built-in IEEE Std. 1149.1 Joint Test Action Group (JTAG)
interface
Built-in JTAG boundary-scan test (BST) circuitry compliant with
IEEE Std. 1149.1
ISP circuitry is compatible with IEEE Std. 1532 for EPC2
configuration device
Supports programming through Serial Vector Format Files
(.svf), Jam
TM
Standard Test and Programming Language
(STAPL) Files (.jam), Jam STAPL Byte-Code Files (.jbc), and the
MAX+PLUS II software via the MasterBlaster
TM
,
ByteBlasterMV
TM
, or BitBlaster
TM
download cable
nINIT_CONF
pin allows a JTAG instruction to initiate APEX,
FLEX, or Mercury device configuration
Can be programmed with Programmer Object Files (.pof) for
EPC1 and EPC1441 devices
Available in 20-pin PLCC and 32-pin TQFP packages
Altera Corporation
A-DS-EPROM-11
1

EPC1064LCI20 Related Products

EPC1064LCI20 EPC1064VLI20 EPC1441LCI20
Description Configuration Memory, 64KX1, PQCC20, PLASTIC, LCC-20 Configuration Memory, 64KX1, MOS, PQCC20, PLASTIC, LCC-20 Configuration Memory, 440800X1, PQCC20, PLASTIC, LCC-20
package instruction QCCJ, LCC20,.39SQ QCCJ, LCC20,.39SQ QCCJ, LCC20,.39SQ
Reach Compliance Code compliant compliant compliant
Maximum access time 75 ns 100 ns 75 ns
Maximum clock frequency (fCLK) 8 MHz 6 MHz 8 MHz
JESD-30 code S-PQCC-J20 S-PQCC-J20 S-PQCC-J20
length 8.9662 mm 8.9662 mm 8.9662 mm
memory density 65536 bit 65536 bit 440800 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY
memory width 1 1 1
Number of functions 1 1 1
Number of terminals 20 20 20
word count 65536 words 65536 words 440800 words
character code 64000 64000 440800
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C
organize 64KX1 64KX1 440800X1
Output characteristics 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QCCJ QCCJ QCCJ
Encapsulate equivalent code LCC20,.39SQ LCC20,.39SQ LCC20,.39SQ
Package shape SQUARE SQUARE SQUARE
Package form CHIP CARRIER CHIP CARRIER CHIP CARRIER
Parallel/Serial SERIAL SERIAL SERIAL
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 4.572 mm 4.572 mm 4.572 mm
Maximum standby current 0.0002 A 0.0002 A 0.0002 A
Maximum slew rate 0.05 mA 0.05 mA 0.05 mA
Maximum supply voltage (Vsup) 5.5 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 4.5 V 3 V 3 V
Nominal supply voltage (Vsup) 5 V 3.3 V 3.3 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form J BEND J BEND J BEND
Terminal pitch 1.27 mm 1.27 mm 1.27 mm
Terminal location QUAD QUAD QUAD
width 8.9662 mm 8.9662 mm 8.9662 mm
Maker Intel - Intel

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