Typical circuit applications: HF/RF Power Amplifiers, Transmitters,
Antenna Tuning, Plasma Chambers and Medical (MRI coils).
ELECTRICAL AND MECHANICAL
SPECIFICATIONS
QUALITY FACTOR (Q):
Greater than 5,000 (3.3 pF to 1000 pF) @ 1 MHz.
Greater than 5,000 (1100 pF to 5100 pF) @ 1 KHz.
TEMPERATURE COEFFICIENT OF CAPACITANCE (TCC):
0 ±30 PPM/°C (-55°C to +125°C)
INSULATION RESISTANCE (IR):
10
5
Megohms min. @ +25°C at rated WVDC
10
4
Megohms min. @ +125°C at rated WVDC
Max. test voltage is 500 VDC.
WORKING VOLTAGE (WVDC):
See Capacitance Values Table, page 2
DIELECTRIC WITHSTANDING VOLTAGE (DWV):
120% of WVDC for 5 seconds..
ENVIRONMENTAL TESTS
ATC 800 E Series Capacitors are designed and manufactured to
meet and exceed the requirements of EIA-198, MIL-PRF-55681 and
MIL-PRF-123.
THERMAL SHOCK:
MIL-STD-202, Method 107, Condition A
MOISTURE RESISTANCE:
MIL-STD-202, Method 106
LOW VOLTAGE HUMIDITY:
MIL-STD-202, Method 103, Condition A, with 1.5 Volts DC applied
while subjected to an environment of 85°C with 85% relative
humidity for 240 hours min.
LIFE TEST:
RETRACE:
Less than ±(0.02% or 0.02 pF), whichever is greater
AGING EFFECTS:
None
PIEzOELECTRIC EFFECTS:
None
(No capacitance variation with voltage or pressure)
CAPACITANCE DRIFT:
±(0.02% or 0.02 pF), whichever is greater
OPERATING TEMPERATURE RANGE:
From -55°C to +125°C
TERMINATION STYLE:
See Mechanical Configurations, page 3
TERMINAL STRENGTH:
Terminations for chips withstand a pull of 10
lbs. min., 25 lbs. typical, for 5 seconds in direction perpendicular
to the termination surface of the capacitor. Test per MIL-STD-202,
method 211.
MIL-STD-202, Method 108, for 2000 hours, at 125°C.
Voltage applied.
120% of WVDC for capacitors rated at 1250 volts DC or less.
100% of WVDC for capacitors rated above 1250 volts DC
ISO 9001
REGISTERED
COMPANY
ATC # 001-1077 Rev. M, 6/13
ATC 800 E Capacitance Values
CAP.
CODE
3R3
3R6
3R9
4R3
4R7
5R1
5R6
6R2
6R8
7R5
8R2
9R1
100
110
120
130
150
160
180
200
220
240
270
300
330
CAP.
(pF)
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
11
12
13
15
16
18
20
22
24
27
30
33
TOL.
RATED WVDC
CAP.
CODE
360
390
430
470
510
560
620
680
750
820
910
101
111
121
131
151
161
181
201
221
241
271
301
331
361
CAP.
(pF)
36
39
43
47
51
56
62
68
75
82
91
100
110
120
130
150
160
180
200
220
240
270
300
330
360
TOL.
RATED WVDC
CAP.
CODE
391
431
471
511
561
621
681
751
821
911
102
112
122
132
152
162
182
202
222
242
272
302
332
392
472
512
CAP.
(pF)
390
430
470
510
560
620
680
750
820
910
1000
1100
1200
1300
1500
1600
1800
2000
2200
2400
2700
3000
3300
3900
4700
5100
TOL.
RATED WVDC
3600
B, C, D
7200
F, G, J, K
2500
7200
F, G, J, K
F, G, J, K
3600
G, J, K
2000
CAPACITANCE TOLERANCE
J
B
C
D
F
G
K
Code
±0.1 pF ±0.25 pF ±0.5 pF ±1% ±2% ±5% ±10%
Tol.
ATC PART NUMBER CODE
ATC800 E 22 0 J TN 7200 X
Series
Case Size
Capacitance Code:
First 2 significant digits for capacitance.
R=Decimal Point
Indicates number of zeros following digits
of capacitance in picofarads except for decimal values.
Capacitance Tolerance
Termination Code
Packaging
C - ATC Matrix Tray (Standard)
T - Tape and Reel, 250 pc. qty.
I - Special Packaging (Consult Factory)
Laser Marking
C
WVDC
The above part number refers to a 800 E Series (case size E) 22 pF capacitor, J tolerance (±5%), 7200 WVDC,
with TN termination (Tin Plated over Non-Magnetic Barrier Termination), laser marking and plastic Matrix Tray packaging.
ATC accepts orders for our parts using designations with or without the
“ATC” prefix. Both methods of defining the part number are equivalent, i.e.,
part numbers referenced with the “ATC” prefix are interchangeable to parts
referenced without the “ATC” prefix. Customers are free to use either in
specifying or procuring parts from American Technical Ceramics.
For additional information and catalogs contact your ATC
representative or call direct at (631) 622-4700.
Consult factory for additional performance data.
C E R A M I C S
ATC North America
631-622-4700
•
sales@atceramics.com
A M E R I C A N
ATC Europe
+46 8 6830410
•
sales@atceramics-europe.com
T E C H N I C A L
ATC Asia
86-755-2396-8759
•
sales@atceramics-asia.com
2
w w w . a t c e r a m i c s . c o m
ATC 800 E Capacitors: Mechanical Configurations
ATC
SERIES
& CASE
SIzE
ATC
CASE SIzE
TERM. & TYPECASE SIzE
CODE
& TYPE
OUTLINES
W/T IS A
TERMINATION SURFACE
Y
BODY DIMENSIONS
INCHES (mm)
LENGTH
(L)
.380
+.015 -.010
(9.65
+0.38 -0.25)
TL
LEAD AND TERMINATION
DIMENSIONS AND MATERIALS
OVERLAP
(Y)
.040 (1.02)
max.
MATERIALS
WIDTH
(W)
THICKNESS
(T)
800 E
T
E
Solderable Nickel
Barrier
E
W
L
T
Tin Plated over
Nickel Barrier Termination
RoHS Compliant
LL
WL
W
L
800 E
MS
Microstrip
E
T
LL
WL
W
L
TL
800 E
AR
Axial Ribbon
.380
+.015 -.010 .190 (4.83)
(9.65
max.
.380
+.035 -.010 +0.38 -0.25)
(9.65
+0.89
-0.25)
N/A.
T
LL = .750 (19.05) min.
WL = .350 ±.010
(8.89 ±0.25)
TL = .010 ±.005
(0.25 ±0.13)
Leads are Attached with
High Temperature Solder
High Purity
Silver Leads
Custom lead styles and lengths are available; consult factory. All leads are high purity silver attached with high temperature solder and are
RoHS
compliant.
ATC 800 E Non-Magnetic Capacitors: Mechanical Configurations
ATC
SERIES
& CASE
SIzE
ATC
TERM.
CODE
CASE SIzE
& TYPE
OUTLINES
W/T IS A
TERMINATION SURFACE
Y
BODY DIMENSIONS
INCHES (mm)
WIDTH
(W)
LEAD AND TERMINATION
DIMENSIONS AND MATERIALS
OVERLAP
(Y)
.040 (1.02)
max.
MATERIALS
LENGTH
(L)
.380
+.015 -.010
(9.65
+0.38
-0.25)
THICKNESS
(T)
800 E
TN
Non-Mag
Solderable Barrier
E
E
RoHS Compliant
Tin Plated over
Non-Magnetic
Barrier Termination
W
L
T
TL
LL
800 E
MN
Non-Mag
Microstrip
E
WL
L
W
T
LL
WL
W
L
TL
800 E
AN
Non-Mag
Axial Ribbon
.380
+.015 -.010 .190 (4.83)
(9.65
max.
.380
+.035 -.010 +0.38 -0.25)
(9.65
+0.89
-0.25)
N/A.
T
LL = .750 (19.05) min.
WL = .350 ±.010
(8.89 ±0.25)
TL = .010 ±.005
(0.25 ±0.13)
Leads are Attached with
High Temperature Solder.
High Purity
Silver Leads
Custom lead styles and lengths are available; consult factory. All leads are high purity silver attached with high temperature solder and are
RoHS
compliant.
ATC 800 E Capacitors: Suggested Mounting Pad Dimensions
L
L
2
T
W
W
2
0
T
220J
Horizontal
Electrode Orientation
B
J
Case E
Pad Size
A Min.
.205
.185
.405
.385
B Min.
.050
.030
.050
.030
C Min.
.325
.325
.325
.325
D Min.
.425
.385
.425
.385
Normal
High Density
Normal
High Density
Vertical
Electrode Orientation
B
Vertical Mount
Horizontal Mount
A
C
D
ATC North America
631-622-4700
•
sales@atceramics.com
A M E R I C A N
ATC Europe
+46 8 6830410
•
sales@atceramics-europe.com
T E C H N I C A L
ATC Asia
86-755-2396-8759
•
sales@atceramics-asia.com
C E R A M I C S
w w w . a t c e r a m i c s . c o m
3
ATC 800 E Performance Data
800 E ESR vs. Frequency
100
ESR (MilliOhms)
10
10 pF
12 pF
39 pF
47 pF
ESR (MilliOhms)
220 pF
330 pF
750 pF
5100 pF
(Typical)
1
1
10
100
1000
Frequency (MHz)
10000
800 E FSR vs. Capacitance
1000
Frequency (MHz)
100
(Typical)
10
1
10
100
1000
10000
Capacitance (pF)
ATC North America
631-622-4700
•
sales@atceramics.com
A M E R I C A N
ATC Europe
+46 8 6830410
•
sales@atceramics-europe.com
T E C H N I C A L
ATC Asia
86-755-2396-8759
•
sales@atceramics-asia.com
C E R A M I C S
4
w w w . a t c e r a m i c s . c o m
ATC 800 E Performance Data
100
800E Current Ratings vs. Capacitance
The current is based on a 65
o
C mounting surface and a
device thermal resistance of 12
o
C/W. A power dissipation
of 5 W will result in a case temperature of 125
o
C
10
RMS Current (Amps)
30 MHz
10 MHz
1
2 MHz
(Typical)
0
1
10
100
Dotted line = Power dissipation
limit
Solid line = Voltage limit
(Vrms/Xc
Solid line = Voltage limit
(Vrms/Xc)
)
1000
10000
Capacitance (pF)
1
0.8
0.6
0.4
TCC= 0 ±30 PPM/C
800E Capacitance Change vs. Temperature
% Change in Capacitance
0.2
0
-0.2
-0.4
-0.6
-0.8
-1
-55
-35
-15
5
25
45
65
85
105
125
Temperature (Degrees C)
Sales of ATC products are subject to the terms and conditions contained in American Technical Ceramics Corp. Terms and Conditions of Sale (ATC document
#001-992 Rev. B; 12/05). Copies of these terms and conditions will be provided upon request. They may also be viewed on ATC's website at www.atceramics.
com/productfinder/default.asp. Click on the link for Terms and Conditions of Sale.
ATC has made every effort to have this information as accurate as possible. However, no responsibility is assumed by ATC for its use, nor for any infringements of
rights of third parties which may result from its use. ATC reserves the right to revise the content or modify its product without prior notice.
Actually, this function should have been implemented in yesterday's post, but I went astray. I always wanted to use the existing functions to implement it. After reading the posts of forum friends, I ...
A fan remote control circuit, the power supply is 4.7V, the control part uses MD2722PB. The fan starts as soon as the power is turned on, and there is no response when it is manually or strictly contr...
I missed the N32G45XVL last time, but the N32L43X I applied for this time was finally approved... The momentum of Guomin in domestic MCU is very strong... The super high cost performance has ushered i...
Here's the thing. Recently, a project used Bluetooth and the NRF series Bluetooth chip, and found a strange problem. There are five devices in total: device 1 Bluetooth Dongle , device 2 Bluetooth dev...
In recent times, the autonomous driving market has cooled significantly. There are layoffs, bankruptcies, and companies whose market values have plummeted. Under the seemingly depressed and chillin...[Details]
With the continuous expansion of the domestic chip design market and the urgent need for domestic substitution, semiconductor IP and design service providers have also achieved rapid development. Amo...[Details]
Wind power has been limited in urban areas due to high installation costs and city regulations. However, Aerovironment has developed a new approach to urban wind power. It involves a series of smal...[Details]
Qorvo Biotechnologies and Zomedica Sign Long-Term License Agreement to Transfer Control of TRUFORMA Product Line
BEIJING, China, February 7, 2023 -- Qorvo®, Inc., a leading provide...[Details]
The growing popularity of brushless DC (BLDC) motors is due to the use of electronic commutation. This replaces the traditional mechanism of brushes rubbing against a commutator to energize the win...[Details]
The consumer electronics market (especially the LED driver market) has developed rapidly in recent years. These markets require power supplies/drivers with low power consumption, small size and ult...[Details]
This project uses an
LM3915
bar graph IC driving two sets of 30dB range of 10 LEDs. This circuit is unique because it has an automatic gain control providing 20dB of extra range to make it very...[Details]
On February 24, PreAct Technologies, a near-field flash lidar technology developer in Oregon, USA, announced the launch of its industry's first software-defined sensor, the T30P flash lidar, and has ...[Details]
On the evening of January 12, Lenovo Group issued an announcement on the Hong Kong Stock Exchange stating that the company submitted an announcement to the Hong Kong Stock Exchange Limited today, ann...[Details]
After Biden entered the White House in January this year, the trade war and technology war with China, especially the "chip war", has not subsided. What does the US's technological containment of Chi...[Details]
The temperature characteristics of digital potentiometers differ from those of traditional mechanical potentiometers. The effects of temperature on the absolute resistance of the potentiometer must be...[Details]
element14 now sells NI's latest Test Workflow software Subscription package gives engineers easy access to multiple test software with a single software license Shanghai, China, July 14, 2022 – ...[Details]
At CES 2020, Qualcomm released its new autonomous driving platform Snapdragon Ride, which includes a secure system-on-chip, a security accelerator, and an autonomous driving software stack (Autonomou...[Details]
Abstract: The CAP system is an organic combination of pure hardware MCU processor and programmable logic device by Jingwei Yager, which can provide high-performance processor (enhanced 8051) and flex...[Details]
The motor controller of new energy vehicles is the brain that controls the core power of new energy vehicles, and the core power system of new energy vehicles is the IGBT semiconductor power device...[Details]