HM9-7687-5
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Renesas Electronics Corporation |
package instruction | DFP, FL20,.3 |
Reach Compliance Code | _compli |
ECCN code | EAR99 |
JESD-30 code | R-XDFP-F20 |
JESD-609 code | e0 |
memory density | 8192 bi |
Memory IC Type | OTP ROM |
memory width | 4 |
Number of terminals | 20 |
word count | 2048 words |
character code | 2000 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 2KX4 |
Package body material | CERAMIC |
encapsulated code | DFP |
Encapsulate equivalent code | FL20,.3 |
Package shape | RECTANGULAR |
Package form | FLATPACK |
Certification status | Not Qualified |
surface mount | YES |
technology | TTL |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | FLAT |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |