The HI10387 is designed for general-purpose amplifier and low-speed switching
applications.
TO-251
Absolute Maximum Ratings
(T
A
=25°C)
•
Maximum Temperatures
Storage Temperature ............................................................................................................................. -55~+150
°C
Junction Temperature ...................................................................................................................... 150°C Maximum
•
Maximum Power Dissipation
Total Power Dissipation (T
C
=25°C) .................................................................................................................... 65 W
Total Power Dissipation (T
A
=25°C) ...................................................................................................................... 2 W
•
Maximum Voltages and Currents (T
A
=25°C)
V
CBO
Collector to Base Voltage ........................................................................................................................... 80 V
V
CEO
Collector to Emitter Voltage ........................................................................................................................ 80 V
V
EBO
Emitter to Base Voltage ................................................................................................................................ 5 V
I
C
Collector Current ............................................................................................................................................. 10 A
Electrical Characteristics
(T
A
=25°C)
Symbol
BV
CEO
I
CBO
I
EBO
I
CEO
I
CEV
V
CE(sat)1
V
CE(sat)2
V
CE(sat)3
V
BE(sat)
VBE(on)1
V
BE(on)2
V
FEC
h
FE1
h
FE2
Min.
80
-
-
-
-
-
-
-
-
-
-
-
2
100
Typ.
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Max.
-
100
2
1
300
2
3
1.5
2
2.8
4.5
3
20
-
Unit
V
uA
mA
mA
uA
V
V
V
V
V
V
V
K
I
C
=200mA
V
CB
=160V
V
EB
=5V
V
CE
=80V
V
CE
=80V, V
BE(Off)
=1.5V
I
C
=5A, I
B
=10mA
I
C
=10A, I
B
=100mA
I
C
=5A, I
B
=2.5mA
I
C
=5A, I
B
=5mA
VCE=3V, IC=5A
V
CE
=3V, I
C
=10A
I
C
=5A
I
C
=5A, V
CE
=3V
V
CE
=3V, I
C
=10A
Test Conditions
Classification Of VCE(sat)1
Rank
V
CE(sat)1
KA
<1.5, BV
CEO
>130V
KB
<1.1V
KC
<1.3V
NORMAL
<2V
HI10387
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
10000
10000
Spec. No. : HE9028
Issued Date : 1994.01.25
Revised Date : 2004.07.13
Page No. : 2/4
Saturation Voltage & Collector Current
hFE @ V
CE
=3V
Saturation Voltage (mV)
1000
hFE
100
1000
V
BE(sat)
@ I
C
=100I
B
V
CE(sat)
@ I
C
=100I
B
10
1
1
10
100
1000
10000
100
100
1000
10000
Collector Current (mA)
Collector Current (mA)
On Voltage & Collector Current
10000
Switching Time & Collector Current
10
V
CC
=30 V, I
C
=250I
B1
=-250I
B2
Switching Times (us)
On Voltage (mV)
Tstg
1000
V
BE(on)
@ V
CE
=3V
1
Tf
Ton
100
10
100
1000
10000
0.1
1
10
Collector Current (mA)
Collector Current (A)
Capacitance & Reverse-Biased Voltage
1000
10000
Safe Operating Area
P
T
=1ms
P
T
=100ms
1000
Collector Current (mA)
Capacitance (pF)
P
T
=1s
100
100
Cob
10
10
0.1
1
10
100
1
1
10
100
Reverse-Biased Voltage (V)
Forward Voltage (V)
HI10387
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-251 Dimension
A
Tab
Spec. No. : HE9028
Issued Date : 1994.01.25
Revised Date : 2004.07.13
Page No. : 3/4
M
F
a1
Marking:
Pb Free Mark
Pb-Free: "
.
"
(Note)
H
Normal: None
I
C
G
Date Code
1 0 3 8 7
Control Code
Note: Green label is used for pb-free packing
1
2
3
Pin Style: 1.Base 2/Tab.Collector 3.Emitter
Material:
•
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
C
F
G
H1
K
K1
L
M
a1
a2
Min.
6.35
4.80
1.30
5.40
6.75
0.50
0.40
0.90
2.20
0.40
-
Max.
6.80
5.50
1.70
6.25
8.00
0.90
0.90
1.50
2.40
0.65
*2.30
L
K
K1
H1
a1
*: Typical, Unit: mm
a2
a2
3-Lead TO-251
Plastic Package
HSMC Package Code: I
A
B
C
D
a1
E
G
Marking:
M
F
y1
a1
Pb Free Mark
Pb-Free: "
.
"
(Note)
H
Normal: None
I
1 0 3 8 7
Date Code
Control Code
I
H
y1
y1
Note: Green label is used for pb-free packing
Pin Style: 1.Base 2.Collector 3.Emitter
Material:
•
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
J
K
K1
H1
a2
y2
a2
y2
a1
DIM
A
B
C
D
E
F
G
H
H1
I
J
K
K1
M
a1
a2
y1
y2
Min.
6.40
-
5.04
-
0.40
0.50
5.90
-
-
-
-
-
-
2.20
0.40
2.10
-
-
Max.
6.80
6.00
5.64
*4.34
0.80
0.90
6.30
*1.80
*9.30
*16.10
*0.80
0.96
*0.76
2.40
0.60
2.50
5
o
3
o
3-Lead TO-251
Plastic Package
HSMC Package Code: I
*: Typical, Unit: mm
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
•
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
[size=4][color=#000000][backcolor=white]What electronic knowledge should electronic beginners focus on? What learning methods should be adopted to learn electronic technology well? [/backcolor][/color...
Core saturation is equivalent to an air-core coil on the primary side of the transformer (equivalent to a short circuit). The current will be very large and will continue to rise until the transformer...
The previous evaluation could not be compiled successfully due to the CMSIS core problem in the Keil environment. I tried many new methods but none of them worked. I guess the inability to access fore...
Developing on 32-bit ARM systems often requires juggling multiple operations at once—in these situations, a real-time operating system (RTOS) comes in handy.
MSP432 MCUs offer compatibility with sever...
From large commercial buildings to your own home, the Internet of Things can deliver a range of energy efficiency benefits. In this third of a five-part series on the Internet of Things, Cees Links fr...
Synopsys and Xinyaohui jointly announced that the two parties have reached a multi-year strategic cooperation. Synopsys authorized Xinyaohui to use Synopsys' 12-28 nanometer process technology and De...[Details]
A photovoltaic company announced a total layoff on the last day of 2019. According to media reports, on December 31, 2019, Jiujiang Xuyang Optoelectronics Technology Co., Ltd. (hereinafter referred...[Details]
According to foreign media reports on December 14, after TSMC started construction of its US$12 billion Arizona factory, Samsung Electronics also announced that it will build a new semiconductor fact...[Details]
GaN power semiconductor supplier Transphorm has responded to recent news that China has imposed export restrictions. China's Ministry of Commerce announced on Monday, July 3, 2023, that it would rest...[Details]
MagnaChip announced that it has launched a new MOSFET for wireless headphones to prevent overcharging of batteries. The MOSFET is designed to control excessive current flowing into wireless headphone...[Details]
October 2020 was a big month for startups across the automotive space, with significant funding coming in all areas. Three startups from China each received more than $100 million in investments in A...[Details]
Recently, the DPU chip M18120 independently developed by Nebula Intelligent Technology was successfully lit within ten minutes after being recycled, and the flow verification was completed within 18 ...[Details]
By Kevin Brown, Vice President of Brand and Marketing at Digi-Key Digi-Key Electronics' success is the result of the hard work, commitment and entrepreneurial spirit of more than 4,000 employees wo...[Details]
According to news on February 27, U.S. Secretary of Commerce Gina Raimondo delivered a speech at the Center for Strategic and International Studies in Washington yesterday (February 26), announcing p...[Details]
Last June, UMC announced that it would spend tens of billions of yen to purchase all the shares of Mie Fujitsu Semiconductor Co., Ltd. (MIFS), a 12-inch wafer fab jointly owned by UMC and Fujitsu Sem...[Details]
The global spread of the new crown pneumonia is affecting chip sales. On the one hand, it has had a negative impact on certain industry sectors such as smartphone chips, but it has had a positive imp...[Details]
The rapid development of China's economy and science and technology has put great pressure on the United States. For this reason, the United States has repeatedly tightened its policies. Since the an...[Details]
Texas Instruments announced that Haviv Ilan has been promoted to executive vice president and chief operating officer. Ilan, 52, has been with the company for more than 21 years, most recently leadin...[Details]
Technicians are screening for the production of chip atomic clocks. Photo provided by the interviewed unit "Tick", "tick"... In daily life, the accuracy of the clock depends on the regular swing of ...[Details]
Hydrogen fuel cells convert hydrogen into electricity, with only water vapor as a byproduct, making them an attractive green alternative for portable power sources, especially for vehicles. However, ...[Details]
Analogue and Mixed Signal
京公网安备 11010802033920号
EEWORLD
