BZX84C5V6M datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Discrete semiconductor> BZX84C5V6M

BZX84C5V6M: DescriptionZener diode; CategoryDiscrete semiconductor; File Size736KB，2 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

Download Datasheet View All

BZX84C5V6M Overview

Zener diode

Features

Product Name: Zener Diode

Product model: BZX84C5V6M

product features:

Planar Die Construction

100mW Power Dissipation

Zener Voltages from 2.4 – 39V

Product parameters:

Pd power dissipation: 100mW

Vz stable voltage: Nom=5.6V Min=5.2V Max=6.0V

Zzt breakdown impedance: 40Ω

Zzk breakdown impedance: 480Ω

IR reverse current: 1uA

Vf forward voltage drop: 0.9V

Package: SOT-723

Recommended Resources

Snowflake BD-110, BD-80A refrigerator circuit

Linear Adjustable Regulator Diagram

Frequency voltage converter circuit diagram

Senlan BT12S connection method for unified frequency conversion

Aoda FS22-40 computer controlled floor fan circuit diagram

Computer motherboard circuit diagram 815 5_06

Inventory of diodes and eight major circuit protection components: Circuit protection components have a wide range of applications. As long as there is electricity, there is a need to install circuit protection components, such as various household appliances, home a...; 鬼谷清泉 Analog electronics

[Qinheng RISC-V core CH582] 5-SPI drive OLED: [i=s]This post was last edited by manhuami2007 on 2022-3-13 20:20[/i]The SPI provided by CH582 supports mode 0 and mode 3, can be configured as 3-wire or 2-wire mode, supports master and slave modes, ...; manhuami2007 Domestic Chip Exchange

The correct way to open the Qixi Festival for electricians: It's the Chinese Valentine's Day again, I wish all lovers in the world to finally get married! Netizens, how are you spending this Chinese Valentine's Day? Let's take a look at this Chinese Valentine'...; okhxyyo Talking

Are there any PIC related reference designs?: PIC seems to be rarely used. Why is it not easy to use and why do people not want to use it? Does anyone have PIC related reference designs, such as software, design videos, etc. that can be downloade...; zongheng Microchip MCU

Vajra Gong and Longevity Gong: I often stayed up late some time ago, my weight increased, my athletic ability decreased, and my health became worse and worse. I saw Daoye's video sharing of Vajra Kungfu and Longevity Kungfu on Bili...; Demmo Talking

Basic structure, parameters and correct use of microwave magnetron: Basic structure, parameters and correct use of microwave magnetrons 　Contents 0 Overview 1 Anode 2 Cathode and its leads 3 Energy output device 4 Magnetic circuit system 5 Correct use of magnetrons 　0...; JasonYoo RF/Wirelessly

Popular Components