Standard SRAM, 64KX1, 10ns, CMOS, CDIP22, 0.300 INCH, CERDIP-22
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | LOGIC Devices |
Parts packaging code | DIP |
package instruction | DIP, DIP22,.3 |
Contacts | 22 |
Reach Compliance Code | unknow |
ECCN code | EAR99 |
Maximum access time | 10 ns |
Other features | AUTOMATIC POWER-DOWN |
I/O type | SEPARATE |
JESD-30 code | R-GDIP-T22 |
JESD-609 code | e0 |
length | 27.178 mm |
memory density | 65536 bi |
Memory IC Type | STANDARD SRAM |
memory width | 1 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 22 |
word count | 65536 words |
character code | 64000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 64KX1 |
Output characteristics | 3-STATE |
Exportable | NO |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DIP |
Encapsulate equivalent code | DIP22,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 5.08 mm |
Maximum standby current | 0.00025 A |
Minimum standby current | 2 V |
Maximum slew rate | 0.13 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 7.62 mm |