CKR14BX183KR datasheet, PDF - EEWORLD Datasheet

CKR14BX183KR: DescriptionCeramic Capacitor, Multilayer, Ceramic, 100V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.018uF, Through Hole Mount, AXIAL LEADED; CategoryPassive components capacitor; File Size1MB，15 Pages; ManufacturerKEMET; Websitehttp://www.kemet.com

Download Datasheet Parametric View All

CKR14BX183KR Overview

Ceramic Capacitor, Multilayer, Ceramic, 100V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.018uF, Through Hole Mount, AXIAL LEADED

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	KEMET
package instruction	,
Reach Compliance Code	_compli
ECCN code	EAR99
capacitance	0.018 µF
Capacitor type	CERAMIC CAPACITOR
diameter	3.56 mm
dielectric materials	CERAMIC
JESD-609 code	e0
length	9.91 mm
Manufacturer's serial number	CKR14
Installation features	THROUGH HOLE MOUNT
multi-layer	Yes
negative tolerance	10%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	TUBULAR PACKAGE
Package form	Axial
method of packing	BULK
positive tolerance	10%
Rated (DC) voltage (URdc)	100 V
Guideline	MIL-PRF-39014/05
series	C(SIZE)T
surface mount	NO
Temperature characteristic code	X7R
Temperature Coefficient	15% ppm/°C
Terminal surface	Tin/Lead (Sn/Pb)
Terminal shape	WIRE

Why is it sufficient to represent a scalar field with F(X,Y,Z), while a vector field requires three functions: P(X,Y,Z) Q(X,Y,Z) R(X,Y,Z): [i=s]This post was last edited by Shenzhen Xiaohua on 2021-12-17 10:55[/i]Why can a scalar field be represented by just one function F(X,Y,Z), while a vector field needs three functions P(X,Y,Z) Q(X,Y...; 深圳小花 MCU

CC2640R2F Bluetooth debugging - change device name: Debug CC2640R2F, based on TI's official simple_peripheral routine, change the Bluetooth name searched by the mobile phone. 1. What is the difference between searching for Bluetooth names on Android an...; Jacktang Wireless Connectivity

Selection of external memory for DSP: In order to ensure the running speed of DSP, the external memory needs to have a certain speed, otherwise the DSP needs to add a waiting cycle when accessing the external memory.1) For C2000 series: C...; 灞波儿奔 DSP and ARM Processors

How can I simulate the signal receiving process of the 125KHZ card reader/writer circuit?: How can I simulate the signal receiving process of the 125KHZ card reader/writer module circuit? The circuit is shown in the figure below. Is there a simulation signal source to add signal to the ante...; 深圳小花 MCU

STM32 MLX90614 infrared temperature sensor engineering code: [i=s]This post was last edited by littleshrimp on 2021-3-5 11:57[/i]MLX90614 is a high-precision infrared temperature sensor. The MLX90614XXX-BCF has a field of view of 10 degrees. It integrates ADC a...; littleshrimp Sensor

Ultrasonic transducer impedance matching problem: Hello everyone, I recently encountered an impedance matching problem about ultrasonic transducers. The equivalent circuit of the ultrasonic transducer is shown in Figure 1.Figure 1 Equivalent model of...; 榆枫 Analog electronics

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components