|
STLC5412P |
STLC5412 |
STLC5412FN |
Description |
2B1Q U INTERFACE DEVICE ENHANCED WITH DECT MODE |
2B1Q U INTERFACE DEVICE ENHANCED WITH DECT MODE |
2B1Q U INTERFACE DEVICE ENHANCED WITH DECT MODE |
Is it lead-free? |
Contains lead |
- |
Contains lead |
Is it Rohs certified? |
incompatible |
- |
conform to |
Parts packaging code |
DIP |
- |
LCC |
package instruction |
PLASTIC, DIP-28 |
- |
PLASTIC, LCC-44 |
Contacts |
28 |
- |
44 |
Reach Compliance Code |
_compli |
- |
compli |
data rate |
160 Mbps |
- |
160 Mbps |
ISDN access rate |
BASIC |
- |
BASIC |
JESD-30 code |
R-PDIP-T28 |
- |
S-PQCC-J44 |
JESD-609 code |
e0 |
- |
e0 |
length |
36.83 mm |
- |
16.5862 mm |
Number of functions |
1 |
- |
1 |
Number of terminals |
28 |
- |
44 |
Maximum operating temperature |
85 °C |
- |
85 °C |
Minimum operating temperature |
-40 °C |
- |
-40 °C |
Minimum output high voltage |
2.4 V |
- |
2.4 V |
Maximum output low current |
0.007 A |
- |
0.007 A |
Maximum output low voltage |
0.4 V |
- |
0.4 V |
Package body material |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
encapsulated code |
DIP |
- |
QCCJ |
Encapsulate equivalent code |
DIP28,.6 |
- |
LDCC44,.7SQ |
Package shape |
RECTANGULAR |
- |
SQUARE |
Package form |
IN-LINE |
- |
CHIP CARRIER |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
- |
NOT SPECIFIED |
power supply |
5 V |
- |
5 V |
Certification status |
Not Qualified |
- |
Not Qualified |
reference point |
U |
- |
U |
standard |
ANSI T1.601 |
- |
ANSI T1.601 |
Nominal supply voltage |
5 V |
- |
5 V |
surface mount |
NO |
- |
YES |
technology |
CMOS |
- |
CMOS |
Telecom integrated circuit types |
DIGITAL SLIC |
- |
DIGITAL SLIC |
Temperature level |
INDUSTRIAL |
- |
INDUSTRIAL |
Terminal surface |
Tin/Lead (Sn/Pb) |
- |
TIN LEAD |
Terminal form |
THROUGH-HOLE |
- |
J BEND |
Terminal pitch |
2.54 mm |
- |
1.27 mm |
Terminal location |
DUAL |
- |
QUAD |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
- |
NOT SPECIFIED |
width |
15.24 mm |
- |
16.5862 mm |
Base Number Matches |
1 |
- |
1 |