XLE46HC64P3-55 datasheet, PDF - EEWORLD Datasheet

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XLE46HC64P3-55: DescriptionEEPROM, 8KX8, 55ns, Parallel, CMOS, PDIP24,; Categorystorage storage; File Size206KB，7 Pages; ManufacturerExel Microelectronics Inc

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XLE46HC64P3-55 Overview

EEPROM, 8KX8, 55ns, Parallel, CMOS, PDIP24,

XLE46HC64P3-55 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Exel Microelectronics Inc
package instruction	DIP, DIP24,.3
Reach Compliance Code	unknow
ECCN code	EAR99
Maximum access time	55 ns
command user interface	NO
Data polling	NO
JESD-30 code	R-PDIP-T24
JESD-609 code	e0
memory density	65536 bi
Memory IC Type	EEPROM
memory width	8
Number of terminals	24
word count	8192 words
character code	8000
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	8KX8
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
switch bit	NO

XLE46HC64P3-55 Related Products

	XLE46HC64P3-55	XLE46HC64P3-70	XLE46HC64P3-85	XLE46HC64LP3-85	XLE46HC64P3-45
Description	EEPROM, 8KX8, 55ns, Parallel, CMOS, PDIP24,	EEPROM, 8KX8, 70ns, Parallel, CMOS, PDIP24,	EEPROM, 8KX8, 85ns, Parallel, CMOS, PDIP24,	EEPROM, 8KX8, 85ns, Parallel, CMOS, PDIP24,	EEPROM, 8KX8, 45ns, Parallel, CMOS, PDIP24,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Exel Microelectronics Inc	Exel Microelectronics Inc	Exel Microelectronics Inc	Exel Microelectronics Inc	Exel Microelectronics Inc
package instruction	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3
Reach Compliance Code	unknow	unknown	unknown	unknown	unknow
Maximum access time	55 ns	70 ns	85 ns	85 ns	45 ns
command user interface	NO	NO	NO	NO	NO
Data polling	NO	NO	NO	NO	NO
JESD-30 code	R-PDIP-T24	R-PDIP-T24	R-PDIP-T24	R-PDIP-T24	R-PDIP-T24
JESD-609 code	e0	e0	e0	e0	e0
memory density	65536 bi	65536 bit	65536 bit	65536 bit	65536 bi
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
memory width	8	8	8	8	8
Number of terminals	24	24	24	24	24
word count	8192 words	8192 words	8192 words	8192 words	8192 words
character code	8000	8000	8000	8000	8000
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	8KX8	8KX8	8KX8	8KX8	8KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
switch bit	NO	NO	NO	NO	NO

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