EEPROM, 8KX8, 45ns, Parallel, CMOS, PDIP24,
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Exel Microelectronics Inc |
package instruction | DIP, DIP24,.3 |
Reach Compliance Code | unknow |
ECCN code | EAR99 |
Maximum access time | 45 ns |
command user interface | NO |
Data polling | NO |
JESD-30 code | R-PDIP-T24 |
JESD-609 code | e0 |
memory density | 65536 bi |
Memory IC Type | EEPROM |
memory width | 8 |
Number of terminals | 24 |
word count | 8192 words |
character code | 8000 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 8KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP24,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Certification status | Not Qualified |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
switch bit | NO |
XLE46HC64P3-45 | XLE46HC64P3-70 | XLE46HC64P3-85 | XLE46HC64LP3-85 | XLE46HC64P3-55 | |
---|---|---|---|---|---|
Description | EEPROM, 8KX8, 45ns, Parallel, CMOS, PDIP24, | EEPROM, 8KX8, 70ns, Parallel, CMOS, PDIP24, | EEPROM, 8KX8, 85ns, Parallel, CMOS, PDIP24, | EEPROM, 8KX8, 85ns, Parallel, CMOS, PDIP24, | EEPROM, 8KX8, 55ns, Parallel, CMOS, PDIP24, |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Exel Microelectronics Inc | Exel Microelectronics Inc | Exel Microelectronics Inc | Exel Microelectronics Inc | Exel Microelectronics Inc |
package instruction | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 |
Reach Compliance Code | unknow | unknown | unknown | unknown | unknow |
Maximum access time | 45 ns | 70 ns | 85 ns | 85 ns | 55 ns |
command user interface | NO | NO | NO | NO | NO |
Data polling | NO | NO | NO | NO | NO |
JESD-30 code | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 |
memory density | 65536 bi | 65536 bit | 65536 bit | 65536 bit | 65536 bi |
Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
memory width | 8 | 8 | 8 | 8 | 8 |
Number of terminals | 24 | 24 | 24 | 24 | 24 |
word count | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
character code | 8000 | 8000 | 8000 | 8000 | 8000 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
organize | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | DIP | DIP | DIP |
Encapsulate equivalent code | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
switch bit | NO | NO | NO | NO | NO |