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XLE46HC64P3-45

Description
EEPROM, 8KX8, 45ns, Parallel, CMOS, PDIP24,
Categorystorage    storage   
File Size206KB,7 Pages
ManufacturerExel Microelectronics Inc
Download Datasheet Parametric Compare View All

XLE46HC64P3-45 Overview

EEPROM, 8KX8, 45ns, Parallel, CMOS, PDIP24,

XLE46HC64P3-45 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerExel Microelectronics Inc
package instructionDIP, DIP24,.3
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum access time45 ns
command user interfaceNO
Data pollingNO
JESD-30 codeR-PDIP-T24
JESD-609 codee0
memory density65536 bi
Memory IC TypeEEPROM
memory width8
Number of terminals24
word count8192 words
character code8000
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize8KX8
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.3
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
switch bitNO

XLE46HC64P3-45 Related Products

XLE46HC64P3-45 XLE46HC64P3-70 XLE46HC64P3-85 XLE46HC64LP3-85 XLE46HC64P3-55
Description EEPROM, 8KX8, 45ns, Parallel, CMOS, PDIP24, EEPROM, 8KX8, 70ns, Parallel, CMOS, PDIP24, EEPROM, 8KX8, 85ns, Parallel, CMOS, PDIP24, EEPROM, 8KX8, 85ns, Parallel, CMOS, PDIP24, EEPROM, 8KX8, 55ns, Parallel, CMOS, PDIP24,
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
Maker Exel Microelectronics Inc Exel Microelectronics Inc Exel Microelectronics Inc Exel Microelectronics Inc Exel Microelectronics Inc
package instruction DIP, DIP24,.3 DIP, DIP24,.3 DIP, DIP24,.3 DIP, DIP24,.3 DIP, DIP24,.3
Reach Compliance Code unknow unknown unknown unknown unknow
Maximum access time 45 ns 70 ns 85 ns 85 ns 55 ns
command user interface NO NO NO NO NO
Data polling NO NO NO NO NO
JESD-30 code R-PDIP-T24 R-PDIP-T24 R-PDIP-T24 R-PDIP-T24 R-PDIP-T24
JESD-609 code e0 e0 e0 e0 e0
memory density 65536 bi 65536 bit 65536 bit 65536 bit 65536 bi
Memory IC Type EEPROM EEPROM EEPROM EEPROM EEPROM
memory width 8 8 8 8 8
Number of terminals 24 24 24 24 24
word count 8192 words 8192 words 8192 words 8192 words 8192 words
character code 8000 8000 8000 8000 8000
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
organize 8KX8 8KX8 8KX8 8KX8 8KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP DIP DIP DIP
Encapsulate equivalent code DIP24,.3 DIP24,.3 DIP24,.3 DIP24,.3 DIP24,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
switch bit NO NO NO NO NO

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