CAPACITOR, CERAMIC, 50V, CH, 0.0000027uF, THROUGH HOLE MOUNT, AXIAL LEADED
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Taiyo Yuden |
package instruction | AXIAL LEADED |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
capacitance | 0.0000027 µF |
Capacitor type | CERAMIC CAPACITOR |
dielectric materials | CERAMIC |
Manufacturer's serial number | P |
Installation features | THROUGH HOLE MOUNT |
multi-layer | 0 |
negative tolerance | 10% |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -25 °C |
Package shape | TUBULAR PACKAGE |
method of packing | BULK |
positive tolerance | 10% |
Rated (DC) voltage (URdc) | 50 V |
surface mount | NO |
Temperature characteristic code | CH |
Temperature Coefficient | 60ppm/Cel ppm/°C |
Terminal surface | NOT SPECIFIED |
Terminal shape | WIRE |
UP050CH2R7K-NAC | UP050B471K-B-B | |
---|---|---|
Description | CAPACITOR, CERAMIC, 50V, CH, 0.0000027uF, THROUGH HOLE MOUNT, AXIAL LEADED | Ceramic Capacitor, Ceramic, 50V, 10% +Tol, 10% -Tol, B, 10% TC, 0.00047uF, Through Hole Mount, AXIAL LEADED, ROHS COMPLIANT |
Is it lead-free? | Lead free | Lead free |
Is it Rohs certified? | conform to | conform to |
Maker | Taiyo Yuden | Taiyo Yuden |
Reach Compliance Code | unknown | unknow |
ECCN code | EAR99 | EAR99 |
capacitance | 0.0000027 µF | 0.00047 µF |
Capacitor type | CERAMIC CAPACITOR | CERAMIC CAPACITOR |
dielectric materials | CERAMIC | CERAMIC |
Installation features | THROUGH HOLE MOUNT | THROUGH HOLE MOUNT |
negative tolerance | 10% | 10% |
Maximum operating temperature | 85 °C | 85 °C |
Minimum operating temperature | -25 °C | -25 °C |
Package shape | TUBULAR PACKAGE | TUBULAR PACKAGE |
method of packing | BULK | AMMO PACK |
positive tolerance | 10% | 10% |
Rated (DC) voltage (URdc) | 50 V | 50 V |
surface mount | NO | NO |
Temperature characteristic code | CH | B |
Temperature Coefficient | 60ppm/Cel ppm/°C | 10% ppm/°C |
Terminal surface | NOT SPECIFIED | NOT SPECIFIED |
Terminal shape | WIRE | WIRE |