Memory Circuit, 32KX8, CMOS, PBGA48, 8 X 8 MM, 0.75 MM PITCH, ROHS COMPLIANT, FBGA-48
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Everspin Technologies |
Parts packaging code | BGA |
package instruction | LFBGA, BGA48,6X8,30 |
Contacts | 48 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Maximum access time | 45 ns |
JESD-30 code | S-PBGA-B48 |
length | 8 mm |
memory density | 262144 bit |
Memory IC Type | MEMORY CIRCUIT |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 48 |
word count | 32768 words |
character code | 32000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 32KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | LFBGA |
Encapsulate equivalent code | BGA48,6X8,30 |
Package shape | SQUARE |
Package form | GRID ARRAY, LOW PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum seat height | 1.35 mm |
Maximum standby current | 0.008 A |
Maximum slew rate | 0.065 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | BALL |
Terminal pitch | 0.75 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 40 |
width | 8 mm |