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WS128K32-35G2TIA

Description
SRAM Module, 128KX32, 35ns, CMOS, CQMA68, CERAMIC, QFP-68
Categorystorage    storage   
File Size509KB,10 Pages
ManufacturerWhite Electronic Designs Corporation
Websitehttp://www.wedc.com/
Download Datasheet Parametric View All

WS128K32-35G2TIA Overview

SRAM Module, 128KX32, 35ns, CMOS, CQMA68, CERAMIC, QFP-68

WS128K32-35G2TIA Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerWhite Electronic Designs Corporation
package instructionCERAMIC, QFP-68
Reach Compliance Codeunknown
Maximum access time35 ns
Other featuresUSER CONFIGURABLE AS 512K X 8
Spare memory width16
JESD-30 codeS-CQMA-G68
memory density4194304 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals68
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeSQUARE
Package formMICROELECTRONIC ASSEMBLY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
WS128K32-XXX
128Kx32 SRAM MODULE, SMD 5962-93187 & 5962-95595
FEATURES
n
n
Access Times of 15, 17, 20, 25, 35, 45, 55ns
n
MIL-STD-883 Compliant Devices Available
n
Low Power Data Retention - only available in G2T
package type
n
Commercial, Industrial and Military Temperature Ranges
n
5 Volt Power Supply
n
Low Power CMOS
n
TTL Compatible Inputs and Outputs
n
Built in Decoupling Caps and Multiple Ground Pins for
Packaging
• 66 pin, PGA Type, 1.075" square, Hermetic Ceramic
HIP (Package 400)
• 68 lead, 40mm CQFP (G4T)
1
, 3.56mm (0.140")
(Package 502).
• 68 lead, 22.4mm CQFP (G2T)
1
, 4.57mm (0.180"),
(Package 509)
• 68 lead, 23.9mm Low Profile CQFP (G1U), 3.57mm
(0.140"), (Package 519)
• 68 lead, 23.9mm Low Profile CQFP (G1T), 4.06 mm
(0.160"), (Package 524)
n
Organized as 128Kx32; User Configurable as 256Kx16
or 512Kx8
Low Noise Operation
n
Weight:
WS128K32-XG1UX - 5 grams typical
WS128K32-XG1TX - 5 grams typical
WS128K32-XG2TX
1
- 8 grams typical
WS128K32-XH1X - 13 grams typical
WS128K32-XG4TX
1
- 20 grams typical
n
All devices are upgradeable to 512Kx32
Note 1: Package Not Recommended For New Design
FIG. 1
P
IN
C
ONFIGURATION
F
OR
WS128K32N-XH1X
T
OP
V
IEW
P
IN
D
ESCRIPTION
I/O
0-31
Data Inputs/Outputs
A
0-16
WE
1-4
CS
1-4
OE
V
CC
GND
NC
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
B
LOCK
D
IAGRAM
November 2001 Rev. 9
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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