PCX755BM8MG300LE datasheet, PDF

PCX755BM8MG300LE: DescriptionRISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255; CategoryThe embedded processor and controller Microcontrollers and processors; File Size533KB，35 Pages; ManufacturerAtmel (Microchip)

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PCX755BM8MG300LE Overview

RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255

Parameter Name	Attribute value
Maker	Atmel (Microchip)
Parts packaging code	BGA
package instruction	BGA,
Contacts	255
Reach Compliance Code	unknow
ECCN code	3A001.A.2.C
Address bus width	32
bit size	32
boundary scan	YES
maximum clock frequency	100 MHz
External data bus width	64
Format	FLOATING POINT
Integrated cache	YES
JESD-30 code	S-CBGA-B255
low power mode	YES
Number of terminals	255
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
Certification status	Not Qualified
Maximum seat height	3.164 mm
speed	300 MHz
Maximum supply voltage	2.1 V
Minimum supply voltage	1.9 V
Nominal supply voltage	2 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

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