|
M27V101-200L1TR |
M27V101-200L6TR |
M27V101-100L6 |
M27V101-100L6TR |
M27V101-90L1 |
M27V101-90L1TR |
M27V101-120L1TR |
M27V101-120L1 |
Description |
128KX8 UVPROM, 200ns, CQCC32, WINDOWED, CERAMIC, LCC-32 |
128KX8 UVPROM, 200ns, CQCC32, WINDOWED, CERAMIC, LCC-32 |
128KX8 UVPROM, 100ns, CQCC32, WINDOWED, CERAMIC, LCC-32 |
128KX8 UVPROM, 100ns, CQCC32, WINDOWED, CERAMIC, LCC-32 |
128KX8 UVPROM, 90ns, CQCC32, WINDOWED, CERAMIC, LCC-32 |
128KX8 UVPROM, 90ns, CQCC32, WINDOWED, CERAMIC, LCC-32 |
128KX8 UVPROM, 120ns, CQCC32, WINDOWED, CERAMIC, LCC-32 |
128KX8 UVPROM, 120ns, CQCC32, WINDOWED, CERAMIC, LCC-32 |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
Parts packaging code |
QFJ |
QFJ |
QFJ |
QFJ |
QFJ |
QFJ |
QFJ |
QFJ |
package instruction |
WINDOWED, CERAMIC, LCC-32 |
WINDOWED, CERAMIC, LCC-32 |
WINDOWED, CERAMIC, LCC-32 |
WINDOWED, CERAMIC, LCC-32 |
WINDOWED, CERAMIC, LCC-32 |
WINDOWED, CERAMIC, LCC-32 |
WINDOWED, CERAMIC, LCC-32 |
WINDOWED, CERAMIC, LCC-32 |
Contacts |
32 |
32 |
32 |
32 |
32 |
32 |
32 |
32 |
Reach Compliance Code |
_compli |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
_compli |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Maximum access time |
200 ns |
200 ns |
100 ns |
100 ns |
90 ns |
90 ns |
120 ns |
120 ns |
I/O type |
COMMON |
COMMON |
COMMON |
COMMON |
COMMON |
COMMON |
COMMON |
COMMON |
JESD-30 code |
R-CQCC-N32 |
R-CQCC-N32 |
R-CQCC-N32 |
R-CQCC-N32 |
R-CQCC-N32 |
R-CQCC-N32 |
R-CQCC-N32 |
R-CQCC-N32 |
JESD-609 code |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
length |
13.97 mm |
13.97 mm |
13.97 mm |
13.97 mm |
13.97 mm |
13.97 mm |
13.97 mm |
13.97 mm |
memory density |
1048576 bi |
1048576 bit |
1048576 bit |
1048576 bit |
1048576 bit |
1048576 bit |
1048576 bit |
1048576 bi |
Memory IC Type |
UVPROM |
UVPROM |
UVPROM |
UVPROM |
UVPROM |
UVPROM |
UVPROM |
UVPROM |
memory width |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
32 |
32 |
32 |
32 |
32 |
32 |
32 |
32 |
word count |
131072 words |
131072 words |
131072 words |
131072 words |
131072 words |
131072 words |
131072 words |
131072 words |
character code |
128000 |
128000 |
128000 |
128000 |
128000 |
128000 |
128000 |
128000 |
Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
Maximum operating temperature |
70 °C |
85 °C |
85 °C |
85 °C |
70 °C |
70 °C |
70 °C |
70 °C |
organize |
128KX8 |
128KX8 |
128KX8 |
128KX8 |
128KX8 |
128KX8 |
128KX8 |
128KX8 |
Output characteristics |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
Package body material |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
encapsulated code |
WQCCN |
WQCCN |
WQCCN |
WQCCN |
WQCCN |
WQCCN |
WQCCN |
WQCCN |
Encapsulate equivalent code |
LCC32,.45X.55 |
LCC32,.45X.55 |
LCC32,.45X.55 |
LCC32,.45X.55 |
LCC32,.45X.55 |
LCC32,.45X.55 |
LCC32,.45X.55 |
LCC32,.45X.55 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
CHIP CARRIER, WINDOW |
CHIP CARRIER, WINDOW |
CHIP CARRIER, WINDOW |
CHIP CARRIER, WINDOW |
CHIP CARRIER, WINDOW |
CHIP CARRIER, WINDOW |
CHIP CARRIER, WINDOW |
CHIP CARRIER, WINDOW |
Parallel/Serial |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
power supply |
3.3/5 V |
3.3/5 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
2.28 mm |
2.28 mm |
2.28 mm |
2.28 mm |
2.28 mm |
2.28 mm |
2.28 mm |
2.28 mm |
Maximum standby current |
0.00002 A |
0.00002 A |
0.00002 A |
0.00002 A |
0.00002 A |
0.00002 A |
0.00002 A |
0.00002 A |
Maximum slew rate |
0.03 mA |
0.03 mA |
0.03 mA |
0.03 mA |
0.03 mA |
0.03 mA |
0.03 mA |
0.03 mA |
Maximum supply voltage (Vsup) |
3.63 V |
3.63 V |
3.63 V |
3.63 V |
3.63 V |
3.63 V |
3.63 V |
3.63 V |
Minimum supply voltage (Vsup) |
2.97 V |
2.97 V |
2.97 V |
2.97 V |
2.97 V |
2.97 V |
2.97 V |
2.97 V |
Nominal supply voltage (Vsup) |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
COMMERCIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
Terminal pitch |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
Terminal location |
QUAD |
QUAD |
QUAD |
QUAD |
QUAD |
QUAD |
QUAD |
QUAD |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
11.43 mm |
11.43 mm |
11.43 mm |
11.43 mm |
11.43 mm |
11.43 mm |
11.43 mm |
11.43 mm |
Maker |
STMicroelectronics |
- |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |