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M27V101-200L1TR

Description
128KX8 UVPROM, 200ns, CQCC32, WINDOWED, CERAMIC, LCC-32
Categorystorage    storage   
File Size620KB,16 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
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M27V101-200L1TR Overview

128KX8 UVPROM, 200ns, CQCC32, WINDOWED, CERAMIC, LCC-32

M27V101-200L1TR Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSTMicroelectronics
Parts packaging codeQFJ
package instructionWINDOWED, CERAMIC, LCC-32
Contacts32
Reach Compliance Code_compli
ECCN codeEAR99
Maximum access time200 ns
I/O typeCOMMON
JESD-30 codeR-CQCC-N32
JESD-609 codee0
length13.97 mm
memory density1048576 bi
Memory IC TypeUVPROM
memory width8
Number of functions1
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize128KX8
Output characteristics3-STATE
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeWQCCN
Encapsulate equivalent codeLCC32,.45X.55
Package shapeRECTANGULAR
Package formCHIP CARRIER, WINDOW
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3/5 V
Certification statusNot Qualified
Maximum seat height2.28 mm
Maximum standby current0.00002 A
Maximum slew rate0.03 mA
Maximum supply voltage (Vsup)3.63 V
Minimum supply voltage (Vsup)2.97 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width11.43 mm

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Description 128KX8 UVPROM, 200ns, CQCC32, WINDOWED, CERAMIC, LCC-32 128KX8 UVPROM, 200ns, CQCC32, WINDOWED, CERAMIC, LCC-32 128KX8 UVPROM, 100ns, CQCC32, WINDOWED, CERAMIC, LCC-32 128KX8 UVPROM, 100ns, CQCC32, WINDOWED, CERAMIC, LCC-32 128KX8 UVPROM, 90ns, CQCC32, WINDOWED, CERAMIC, LCC-32 128KX8 UVPROM, 90ns, CQCC32, WINDOWED, CERAMIC, LCC-32 128KX8 UVPROM, 120ns, CQCC32, WINDOWED, CERAMIC, LCC-32 128KX8 UVPROM, 120ns, CQCC32, WINDOWED, CERAMIC, LCC-32
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code QFJ QFJ QFJ QFJ QFJ QFJ QFJ QFJ
package instruction WINDOWED, CERAMIC, LCC-32 WINDOWED, CERAMIC, LCC-32 WINDOWED, CERAMIC, LCC-32 WINDOWED, CERAMIC, LCC-32 WINDOWED, CERAMIC, LCC-32 WINDOWED, CERAMIC, LCC-32 WINDOWED, CERAMIC, LCC-32 WINDOWED, CERAMIC, LCC-32
Contacts 32 32 32 32 32 32 32 32
Reach Compliance Code _compli not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant _compli
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 200 ns 200 ns 100 ns 100 ns 90 ns 90 ns 120 ns 120 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-CQCC-N32 R-CQCC-N32 R-CQCC-N32 R-CQCC-N32 R-CQCC-N32 R-CQCC-N32 R-CQCC-N32 R-CQCC-N32
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0
length 13.97 mm 13.97 mm 13.97 mm 13.97 mm 13.97 mm 13.97 mm 13.97 mm 13.97 mm
memory density 1048576 bi 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bi
Memory IC Type UVPROM UVPROM UVPROM UVPROM UVPROM UVPROM UVPROM UVPROM
memory width 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 32 32 32 32 32 32 32 32
word count 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words
character code 128000 128000 128000 128000 128000 128000 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 85 °C 85 °C 85 °C 70 °C 70 °C 70 °C 70 °C
organize 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code WQCCN WQCCN WQCCN WQCCN WQCCN WQCCN WQCCN WQCCN
Encapsulate equivalent code LCC32,.45X.55 LCC32,.45X.55 LCC32,.45X.55 LCC32,.45X.55 LCC32,.45X.55 LCC32,.45X.55 LCC32,.45X.55 LCC32,.45X.55
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER, WINDOW CHIP CARRIER, WINDOW CHIP CARRIER, WINDOW CHIP CARRIER, WINDOW CHIP CARRIER, WINDOW CHIP CARRIER, WINDOW CHIP CARRIER, WINDOW CHIP CARRIER, WINDOW
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 3.3/5 V 3.3/5 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.28 mm 2.28 mm 2.28 mm 2.28 mm 2.28 mm 2.28 mm 2.28 mm 2.28 mm
Maximum standby current 0.00002 A 0.00002 A 0.00002 A 0.00002 A 0.00002 A 0.00002 A 0.00002 A 0.00002 A
Maximum slew rate 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA
Maximum supply voltage (Vsup) 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V 3.63 V
Minimum supply voltage (Vsup) 2.97 V 2.97 V 2.97 V 2.97 V 2.97 V 2.97 V 2.97 V 2.97 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 11.43 mm 11.43 mm 11.43 mm 11.43 mm 11.43 mm 11.43 mm 11.43 mm 11.43 mm
Maker STMicroelectronics - STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics

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