M27V101-90L1 datasheet, PDF - EEWORLD Datasheet

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M27V101-90L1: Description128KX8 UVPROM, 90ns, CQCC32, WINDOWED, CERAMIC, LCC-32; Categorystorage storage; File Size620KB，16 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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M27V101-90L1 Overview

128KX8 UVPROM, 90ns, CQCC32, WINDOWED, CERAMIC, LCC-32

M27V101-90L1 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	STMicroelectronics
Parts packaging code	QFJ
package instruction	WINDOWED, CERAMIC, LCC-32
Contacts	32
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	90 ns
I/O type	COMMON
JESD-30 code	R-CQCC-N32
JESD-609 code	e0
length	13.97 mm
memory density	1048576 bit
Memory IC Type	UVPROM
memory width	8
Number of functions	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX8
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	WQCCN
Encapsulate equivalent code	LCC32,.45X.55
Package shape	RECTANGULAR
Package form	CHIP CARRIER, WINDOW
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	2.28 mm
Maximum standby current	0.00002 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	3.63 V
Minimum supply voltage (Vsup)	2.97 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	11.43 mm

M27V101-90L1 Related Products

	M27V101-90L1	M27V101-200L6TR	M27V101-100L6	M27V101-100L6TR	M27V101-90L1TR	M27V101-120L1TR	M27V101-120L1	M27V101-200L1TR
Description	128KX8 UVPROM, 90ns, CQCC32, WINDOWED, CERAMIC, LCC-32	128KX8 UVPROM, 200ns, CQCC32, WINDOWED, CERAMIC, LCC-32	128KX8 UVPROM, 100ns, CQCC32, WINDOWED, CERAMIC, LCC-32	128KX8 UVPROM, 100ns, CQCC32, WINDOWED, CERAMIC, LCC-32	128KX8 UVPROM, 90ns, CQCC32, WINDOWED, CERAMIC, LCC-32	128KX8 UVPROM, 120ns, CQCC32, WINDOWED, CERAMIC, LCC-32	128KX8 UVPROM, 120ns, CQCC32, WINDOWED, CERAMIC, LCC-32	128KX8 UVPROM, 200ns, CQCC32, WINDOWED, CERAMIC, LCC-32
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	QFJ	QFJ	QFJ	QFJ	QFJ	QFJ	QFJ	QFJ
package instruction	WINDOWED, CERAMIC, LCC-32	WINDOWED, CERAMIC, LCC-32	WINDOWED, CERAMIC, LCC-32	WINDOWED, CERAMIC, LCC-32	WINDOWED, CERAMIC, LCC-32	WINDOWED, CERAMIC, LCC-32	WINDOWED, CERAMIC, LCC-32	WINDOWED, CERAMIC, LCC-32
Contacts	32	32	32	32	32	32	32	32
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	_compli	_compli
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	90 ns	200 ns	100 ns	100 ns	90 ns	120 ns	120 ns	200 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-CQCC-N32	R-CQCC-N32	R-CQCC-N32	R-CQCC-N32	R-CQCC-N32	R-CQCC-N32	R-CQCC-N32	R-CQCC-N32
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
length	13.97 mm	13.97 mm	13.97 mm	13.97 mm	13.97 mm	13.97 mm	13.97 mm	13.97 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bi	1048576 bi
Memory IC Type	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM
memory width	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32	32	32
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	85 °C	85 °C	85 °C	70 °C	70 °C	70 °C	70 °C
organize	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	WQCCN	WQCCN	WQCCN	WQCCN	WQCCN	WQCCN	WQCCN	WQCCN
Encapsulate equivalent code	LCC32,.45X.55	LCC32,.45X.55	LCC32,.45X.55	LCC32,.45X.55	LCC32,.45X.55	LCC32,.45X.55	LCC32,.45X.55	LCC32,.45X.55
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER, WINDOW	CHIP CARRIER, WINDOW	CHIP CARRIER, WINDOW	CHIP CARRIER, WINDOW	CHIP CARRIER, WINDOW	CHIP CARRIER, WINDOW	CHIP CARRIER, WINDOW	CHIP CARRIER, WINDOW
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3.3 V	3.3/5 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.28 mm	2.28 mm	2.28 mm	2.28 mm	2.28 mm	2.28 mm	2.28 mm	2.28 mm
Maximum standby current	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A
Maximum slew rate	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA
Maximum supply voltage (Vsup)	3.63 V	3.63 V	3.63 V	3.63 V	3.63 V	3.63 V	3.63 V	3.63 V
Minimum supply voltage (Vsup)	2.97 V	2.97 V	2.97 V	2.97 V	2.97 V	2.97 V	2.97 V	2.97 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	11.43 mm	11.43 mm	11.43 mm	11.43 mm	11.43 mm	11.43 mm	11.43 mm	11.43 mm
Maker	STMicroelectronics	-	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics

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