EEWORLDEEWORLDEEWORLD

Part Number

Search

HDAF11-08.0-S-13-2

Description
Board Stacking Connector, 143 Contact(s), 13 Row(s), Female, Straight, 0.079 inch Pitch, Surface Mount Terminal, Locking, Black Insulator, ROHS COMPLIANT
CategoryThe connector    The connector   
File Size795KB,1 Pages
ManufacturerSAMTEC
Websitehttp://www.samtec.com/
Environmental Compliance
Download Datasheet Parametric Compare View All

HDAF11-08.0-S-13-2 Overview

Board Stacking Connector, 143 Contact(s), 13 Row(s), Female, Straight, 0.079 inch Pitch, Surface Mount Terminal, Locking, Black Insulator, ROHS COMPLIANT

HDAF11-08.0-S-13-2 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSAMTEC
package instructionROHS COMPLIANT
Reach Compliance Codecompli
ECCN codeEAR99
Other featuresFINAL INCH, HD MEZZ
Board mount optionsPEG
body width0.886 inch
subject depth0.414 inch
body length1.572 inch
Connector typeBOARD STACKING CONNECTOR
Contact to complete cooperationGOLD (30) OVER NICKEL (50)
Contact completed and terminatedMatte Tin (Sn) - with Nickel (Ni) barrie
Contact point genderFEMALE
Contact materialCOPPER ALLOY
contact modeRECTANGULAR
Contact resistance15 mΩ
DIN complianceNO
Dielectric withstand voltage700VAC V
Durability100 Cycles
Filter functionNO
IEC complianceNO
Insulation resistance5000000000 Ω
Insulator colorBLACK
insulator materialLIQUID CRYSTAL POLYMER (LCP)
JESD-609 codee3
MIL complianceNO
Plug contact pitch0.079 inch
Plug informationMULTIPLE MATING PARTS AVAILABLE
Mixed contactsNO
Installation option 1LOCKING
Installation methodSTRAIGHT
Installation typeBOARD
Number of connectorsONE
PCB row number13
Number of rows loaded13
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
OptionsGENERAL PURPOSE
PCB contact patternRECTANGULAR
PCB contact row spacing1.1938 mm
Plating thickness30u inch
Rated current (signal)1.8 A
GuidelineUL
reliabilityCOMMERCIAL
Terminal pitch2 mm
Termination typeSURFACE MOUNT
Total number of contacts143
F-211
(2,00mm) .0787"
HDAM, HDAF SERIES
MEZZ
HDAM–11–12.0–S–13–2
HDAF–11–08.0–S–13–2
RUGGED ELEVATED HIGH DENSITY ARRAY
HDAM Mates with:
HDAF
HDAF Mates with:
HDAM
HDAM
NO. OF PINS
PER ROW
LEAD
STYLE
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
OTHER
OPTION
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?HDAM or
www.samtec.com?HDAF
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Current Rating:
2.3A @ 80°C ambient
Operating Temp Range:
-55°C to +125°C
(2,00)
Plating:
.0787
Au or Sn over
1A
50µ" (1,27µm) Ni
Contact Resistance:
19 mΩ max
Working Voltage:
200 VAC
Mated Cycles:
100
fina
RoHS Compliant:
l
i
nch.com
Y
es
Lead-Free Solderable:
Y
es
®
–S
–11, –15, –23
Specify
LEAD
STYLE
from
chart
= 30µ"
(0,76µm)
Gold on
contact area,
Matte Tin
on tails and
guide pins
A
–13
–2
= Lead-Free
Tin Alloy
95.5% Sn/
3.8% Ag/0.7% Cu
Solder Charge
–P
= Pick &
Place Pad
(22,50)
.886
1M
No. of
Pins
Per
Row
x
(2,00)
.0787
+
(16,06)
.632
No. of
Pins
Per
Row
x
(2,00)
.0787
+
(11,55)
.455
LEAD
STYLE
A
(14,41)
.567
(19,41)
.764
–12.0
–17.0
• Integrated guide
posts
(1,20)
.0472
DIFFERENTIAL
APPLICATIONS
(1,20)
.0472
(5,09)
.200
Rated @ 3dB
Insertion Loss*
Single-Ended Signaling
9.0 GHz / 18.0 Gbps
Differential Pair Signaling
9.0 GHz / 18.0 Gbps
*Data based on simulations using Final Inch
®
design.
Performance data for other stack heights and complete
test data available at www.samtec.com?HDAM,
www.samtec.com?HDAF or contact sig@samtec.com
35mm Stack Height
(2,00)
.0787
HDAF
NO. OF PINS
PER ROW
LEAD
STYLE
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
OTHER
OPTION
PAIR
ARRAY COUNT*
44
11x13
60
15x13
92
23x13
*2:1 S:G Ratio
–11, –15, –23
(22,50) .886
Specify
LEAD
STYLE
from
chart
No.
of
Pins
Per
Row
x
(2,00)
.0787
+
(11,55)
.455
–S
= 30µ"
(0,76µm)
Gold on
contact area,
Matte Tin
on tails and
weld tabs
No.
of
Pins
Per
Row
x
(2,00)
.0787
+
(17,92)
.706
–13
–2
= Lead-Free
Tin Alloy
95.5% Sn/
3.8% Ag/
0.7% Cu
Solder Charge
–P
= Pick &
Place Pad
ALSO AVAILABLE
Tin-Lead Solder Charge.
Call Samtec.
Note:
Other Gold plating
options available.
Contact Samtec.
Note:
HD Mezz is a trademark
of Molex Incorporated
Note:
Some lengths, styles
and options are non-standard,
non-returnable.
(2,00)
.0787
1A
1M
LEAD
STYLE
A
(10,51)
.414
(20,51)
.807
–08.0
–18.0
(1,20)
.0472
• Integrated guide
posts
A
WWW.SAMTEC.COM

HDAF11-08.0-S-13-2 Related Products

HDAF11-08.0-S-13-2 HDAF11-18.0-S-13-2 HDAF15-08.0-S-13-2 HDAF15-18.0-S-13-2 HDAF23-08.0-S-13-2
Description Board Stacking Connector, 143 Contact(s), 13 Row(s), Female, Straight, 0.079 inch Pitch, Surface Mount Terminal, Locking, Black Insulator, ROHS COMPLIANT Board Stacking Connector, 143 Contact(s), 13 Row(s), Female, Straight, 0.079 inch Pitch, Surface Mount Terminal, Locking, Black Insulator, ROHS COMPLIANT Board Stacking Connector, 195 Contact(s), 13 Row(s), Female, Straight, 0.079 inch Pitch, Surface Mount Terminal, Locking, Black Insulator, ROHS COMPLIANT Board Stacking Connector, 195 Contact(s), 13 Row(s), Female, Straight, 0.079 inch Pitch, Surface Mount Terminal, Locking, Black Insulator, ROHS COMPLIANT Board Stacking Connector, 299 Contact(s), 13 Row(s), Female, Straight, 0.079 inch Pitch, Surface Mount Terminal, Locking, Black Insulator, ROHS COMPLIANT
Is it Rohs certified? conform to conform to conform to conform to conform to
Maker SAMTEC SAMTEC SAMTEC SAMTEC SAMTEC
package instruction ROHS COMPLIANT ROHS COMPLIANT ROHS COMPLIANT ROHS COMPLIANT ROHS COMPLIANT
Reach Compliance Code compli compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99
Other features FINAL INCH, HD MEZZ FINAL INCH, HD MEZZ FINAL INCH, HD MEZZ FINAL INCH, HD MEZZ FINAL INCH, HD MEZZ
Board mount options PEG PEG PEG PEG PEG
body width 0.886 inch 0.886 inch 0.886 inch 0.886 inch 0.886 inch
subject depth 0.414 inch 0.807 inch 0.414 inch 0.807 inch 0.414 inch
body length 1.572 inch 1.572 inch 1.887 inch 1.887 inch 2.517 inch
Connector type BOARD STACKING CONNECTOR BOARD STACKING CONNECTOR BOARD STACKING CONNECTOR BOARD STACKING CONNECTOR BOARD STACKING CONNECTOR
Contact to complete cooperation GOLD (30) OVER NICKEL (50) GOLD (30) OVER NICKEL (50) GOLD (30) OVER NICKEL (50) GOLD (30) OVER NICKEL (50) GOLD (30) OVER NICKEL (50)
Contact completed and terminated Matte Tin (Sn) - with Nickel (Ni) barrie Matte Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier
Contact point gender FEMALE FEMALE FEMALE FEMALE FEMALE
Contact material COPPER ALLOY COPPER ALLOY COPPER ALLOY COPPER ALLOY COPPER ALLOY
contact mode RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Contact resistance 15 mΩ 15 mΩ 15 mΩ 15 mΩ 15 mΩ
DIN compliance NO NO NO NO NO
Dielectric withstand voltage 700VAC V 700VAC V 700VAC V 700VAC V 700VAC V
Durability 100 Cycles 100 Cycles 100 Cycles 100 Cycles 100 Cycles
Filter function NO NO NO NO NO
IEC compliance NO NO NO NO NO
Insulation resistance 5000000000 Ω 5000000000 Ω 5000000000 Ω 5000000000 Ω 5000000000 Ω
Insulator color BLACK BLACK BLACK BLACK BLACK
insulator material LIQUID CRYSTAL POLYMER (LCP) LIQUID CRYSTAL POLYMER (LCP) LIQUID CRYSTAL POLYMER (LCP) LIQUID CRYSTAL POLYMER (LCP) LIQUID CRYSTAL POLYMER (LCP)
JESD-609 code e3 e3 e3 e3 e3
MIL compliance NO NO NO NO NO
Plug contact pitch 0.079 inch 0.079 inch 0.079 inch 0.079 inch 0.079 inch
Plug information MULTIPLE MATING PARTS AVAILABLE MULTIPLE MATING PARTS AVAILABLE MULTIPLE MATING PARTS AVAILABLE MULTIPLE MATING PARTS AVAILABLE MULTIPLE MATING PARTS AVAILABLE
Mixed contacts NO NO NO NO NO
Installation option 1 LOCKING LOCKING LOCKING LOCKING LOCKING
Installation method STRAIGHT STRAIGHT STRAIGHT STRAIGHT STRAIGHT
Installation type BOARD BOARD BOARD BOARD BOARD
Number of connectors ONE ONE ONE ONE ONE
PCB row number 13 13 13 13 13
Number of rows loaded 13 13 13 13 13
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C
Options GENERAL PURPOSE GENERAL PURPOSE GENERAL PURPOSE GENERAL PURPOSE GENERAL PURPOSE
PCB contact pattern RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
PCB contact row spacing 1.1938 mm 1.1938 mm 1.1938 mm 1.1938 mm 1.1938 mm
Plating thickness 30u inch 30u inch 30u inch 30u inch 30u inch
Rated current (signal) 1.8 A 1.8 A 1.8 A 1.8 A 1.8 A
Guideline UL UL UL UL UL
reliability COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal pitch 2 mm 2 mm 2 mm 2 mm 2 mm
Termination type SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT
Total number of contacts 143 143 195 195 299
[liklon plays with GD32F350] 4. SPI0 reads and writes spiflash
In the subsequent development, a spiflash is needed, so we start to debug the SPI function of GD32. Currently, the board resources provided by GD are really few, and it can be said that there is nothi...
liklon GD32 MCU
Selling ZYNQ 7020 and other idle development boards
[i=s]This post was last edited by awarenessxie on 2018-11-19 12:58[/i] ZYNQ 7020 development board, complete information. Just powered on a few times. Brand new. 600 yuan NRF52832 Bluetooth 5.0 develo...
awarenessxie Buy&Sell
How to add relative path of header file in ccs?
First, under Project->Properties->Build, click Variables to add a variable, then you can use ${} to reference the variable under Project->Properties->Build->C2000 Compiler->Include Options. The system...
Aguilera Microcontroller MCU
Different types of pin headers
Could you please tell me what the naming convention is for pin headers? Common 2.54mm pitch HDR, what does HDR mean? The 1.27 seems to be MHDR, the 5.08 seems to be HDRX, what is the 2.0mm one?...
sfcsdc PCB Design
The efficiency has little to do with IC.
The efficiency curve of the BUCK buck board (36V, 48V, 60V to 12V 15A) using ON Semiconductor's (actually it has nothing to do with ON Semiconductor, other companies are also fine) UC3843 is measured....
PowerAnts Power technology
Display technologies for IoT devices
Consider IoT devices such as the environmental sensors mentioned above. For these devices, minimizing their power usage to extend operating time between charging cycles is critical. These devices don’...
灞波儿奔 Wireless Connectivity

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号