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K8S5515EBC-FC1D0

Description
Flash, 16MX16, 100ns, PBGA44, 7.70 X 6.20 MM, 1 MM HEIGHT, 0.50 MM PITCH, FBGA-44
Categorystorage    storage   
File Size1MB,65 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
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K8S5515EBC-FC1D0 Overview

Flash, 16MX16, 100ns, PBGA44, 7.70 X 6.20 MM, 1 MM HEIGHT, 0.50 MM PITCH, FBGA-44

K8S5515EBC-FC1D0 Parametric

Parameter NameAttribute value
MakerSAMSUNG
Parts packaging codeBGA
package instructionVFBGA,
Contacts44
Reach Compliance Codecompli
ECCN codeEAR99
Maximum access time100 ns
Other featuresBOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
startup blockBOTTOM
JESD-30 codeR-PBGA-B44
memory density268435456 bi
Memory IC TypeFLASH
memory width16
Number of functions1
Number of terminals44
word count16777216 words
character code16000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize16MX16
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Programming voltage1.8 V
Certification statusNot Qualified
Maximum seat height1 mm
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formBALL
Terminal pitch0.5 mm
Terminal locationBOTTOM
typeNOR TYPE

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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