Flash, 16MX16, 100ns, PBGA44, 7.70 X 6.20 MM, 1 MM HEIGHT, 0.50 MM PITCH, FBGA-44
Parameter Name | Attribute value |
Maker | SAMSUNG |
Parts packaging code | BGA |
package instruction | VFBGA, |
Contacts | 44 |
Reach Compliance Code | compli |
ECCN code | EAR99 |
Maximum access time | 100 ns |
Other features | BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
startup block | BOTTOM |
JESD-30 code | R-PBGA-B44 |
memory density | 268435456 bi |
Memory IC Type | FLASH |
memory width | 16 |
Number of functions | 1 |
Number of terminals | 44 |
word count | 16777216 words |
character code | 16000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 16MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | VFBGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
Programming voltage | 1.8 V |
Certification status | Not Qualified |
Maximum seat height | 1 mm |
Maximum supply voltage (Vsup) | 1.95 V |
Minimum supply voltage (Vsup) | 1.7 V |
Nominal supply voltage (Vsup) | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | BALL |
Terminal pitch | 0.5 mm |
Terminal location | BOTTOM |
type | NOR TYPE |