|
HD74BC574AT |
HD74BC574ARP |
HD74BC574AP |
Description |
BCT/FBT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, TTP-20DA |
BCT/FBT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, FP-20DB |
BCT/FBT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDIP20, DP-20N |
Maker |
Renesas Electronics Corporation |
Renesas Electronics Corporation |
Renesas Electronics Corporation |
Parts packaging code |
SOIC |
SOIC |
DIP |
package instruction |
TSSOP, |
SOP, |
DIP, |
Contacts |
20 |
20 |
20 |
Reach Compliance Code |
unknow |
compliant |
compliant |
series |
BCT/FBT |
BCT/FBT |
BCT/FBT |
JESD-30 code |
R-PDSO-G20 |
R-PDSO-G20 |
R-PDIP-T20 |
length |
6.5 mm |
12.8 mm |
24.5 mm |
Logic integrated circuit type |
BUS DRIVER |
BUS DRIVER |
BUS DRIVER |
Number of digits |
8 |
8 |
8 |
Number of functions |
1 |
1 |
1 |
Number of ports |
2 |
2 |
2 |
Number of terminals |
20 |
20 |
20 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
Output characteristics |
3-STATE |
3-STATE |
3-STATE |
Output polarity |
TRUE |
TRUE |
TRUE |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TSSOP |
SOP |
DIP |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE |
IN-LINE |
propagation delay (tpd) |
10 ns |
10 ns |
10 ns |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1.1 mm |
2.65 mm |
5.08 mm |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
4.5 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
surface mount |
YES |
YES |
NO |
technology |
BICMOS |
BICMOS |
BICMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
GULL WING |
GULL WING |
THROUGH-HOLE |
Terminal pitch |
0.65 mm |
1.27 mm |
2.54 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
width |
4.4 mm |
7.5 mm |
7.62 mm |