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MC145425L

Description
IC,ISDN LINE INTERFACE,BASIC,CMOS,DIP,24PIN,CERAMIC
CategoryWireless rf/communication    Telecom circuit   
File Size868KB,14 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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MC145425L Overview

IC,ISDN LINE INTERFACE,BASIC,CMOS,DIP,24PIN,CERAMIC

MC145425L Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNXP
package instructionDIP, DIP24,.6
Reach Compliance Codeunknow
data rate160 Mbps
ISDN access rateBASIC
JESD-30 codeR-XDIP-T24
JESD-609 codee0
Number of terminals24
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Minimum output high voltage2.5 V
Maximum output low current0.0035 A
Maximum output low voltage0.8 V
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.6
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Certification statusNot Qualified
reference pointS/T
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

MC145425L Related Products

MC145425L MC145421L
Description IC,ISDN LINE INTERFACE,BASIC,CMOS,DIP,24PIN,CERAMIC IC,ISDN LINE INTERFACE,BASIC,CMOS,DIP,24PIN,CERAMIC
Is it Rohs certified? incompatible incompatible
Maker NXP NXP
package instruction DIP, DIP24,.6 DIP, DIP24,.6
Reach Compliance Code unknow unknow
data rate 160 Mbps 160 Mbps
ISDN access rate BASIC BASIC
JESD-30 code R-XDIP-T24 R-XDIP-T24
JESD-609 code e0 e0
Number of terminals 24 24
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Minimum output high voltage 2.5 V 2.5 V
Maximum output low current 0.0035 A 0.0035 A
Maximum output low voltage 0.8 V 0.8 V
Package body material CERAMIC CERAMIC
encapsulated code DIP DIP
Encapsulate equivalent code DIP24,.6 DIP24,.6
Package shape RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE
power supply 5 V 5 V
Certification status Not Qualified Not Qualified
reference point S/T S/T
Nominal supply voltage 5 V 5 V
surface mount NO NO
technology CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm
Terminal location DUAL DUAL
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