IC,ISDN LINE INTERFACE,BASIC,CMOS,DIP,24PIN,CERAMIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | NXP |
package instruction | DIP, DIP24,.6 |
Reach Compliance Code | unknow |
data rate | 160 Mbps |
ISDN access rate | BASIC |
JESD-30 code | R-XDIP-T24 |
JESD-609 code | e0 |
Number of terminals | 24 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Minimum output high voltage | 2.5 V |
Maximum output low current | 0.0035 A |
Maximum output low voltage | 0.8 V |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP24,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Certification status | Not Qualified |
reference point | S/T |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
MC145425L | MC145421L | |
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Description | IC,ISDN LINE INTERFACE,BASIC,CMOS,DIP,24PIN,CERAMIC | IC,ISDN LINE INTERFACE,BASIC,CMOS,DIP,24PIN,CERAMIC |
Is it Rohs certified? | incompatible | incompatible |
Maker | NXP | NXP |
package instruction | DIP, DIP24,.6 | DIP, DIP24,.6 |
Reach Compliance Code | unknow | unknow |
data rate | 160 Mbps | 160 Mbps |
ISDN access rate | BASIC | BASIC |
JESD-30 code | R-XDIP-T24 | R-XDIP-T24 |
JESD-609 code | e0 | e0 |
Number of terminals | 24 | 24 |
Maximum operating temperature | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C |
Minimum output high voltage | 2.5 V | 2.5 V |
Maximum output low current | 0.0035 A | 0.0035 A |
Maximum output low voltage | 0.8 V | 0.8 V |
Package body material | CERAMIC | CERAMIC |
encapsulated code | DIP | DIP |
Encapsulate equivalent code | DIP24,.6 | DIP24,.6 |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE |
power supply | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified |
reference point | S/T | S/T |
Nominal supply voltage | 5 V | 5 V |
surface mount | NO | NO |
technology | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL |