IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,DIP,14PIN,CERAMIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | National Semiconductor(TI ) |
package instruction | DIP, DIP14,.3 |
Reach Compliance Code | unknow |
Control type | ENABLE LOW |
JESD-30 code | R-XDIP-T14 |
JESD-609 code | e0 |
Logic integrated circuit type | BUS DRIVER |
MaximumI(ol) | 0.012 A |
Number of digits | 4 |
Number of functions | 1 |
Number of terminals | 14 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Output characteristics | 3-STATE |
Output polarity | TRUE |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP14,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Maximum supply current (ICC) | 20 mA |
Prop。Delay @ Nom-Su | 18 ns |
Certification status | Not Qualified |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | TTL |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
DM54LS125AJ | DM54LS125AW | |
---|---|---|
Description | IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,DIP,14PIN,CERAMIC | IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,FP,14PIN,CERAMIC |
Is it Rohs certified? | incompatible | incompatible |
Maker | National Semiconductor(TI ) | National Semiconductor(TI ) |
package instruction | DIP, DIP14,.3 | DFP, FL14,.3 |
Reach Compliance Code | unknow | compli |
Control type | ENABLE LOW | ENABLE LOW |
JESD-30 code | R-XDIP-T14 | R-XDFP-F14 |
JESD-609 code | e0 | e0 |
Logic integrated circuit type | BUS DRIVER | BUS DRIVER |
MaximumI(ol) | 0.012 A | 0.012 A |
Number of digits | 4 | 4 |
Number of functions | 1 | 1 |
Number of terminals | 14 | 14 |
Maximum operating temperature | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C |
Output characteristics | 3-STATE | 3-STATE |
Output polarity | TRUE | TRUE |
Package body material | CERAMIC | CERAMIC |
encapsulated code | DIP | DFP |
Encapsulate equivalent code | DIP14,.3 | FL14,.3 |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | FLATPACK |
power supply | 5 V | 5 V |
Maximum supply current (ICC) | 20 mA | 20 mA |
Prop。Delay @ Nom-Su | 18 ns | 18 ns |
Certification status | Not Qualified | Not Qualified |
Nominal supply voltage (Vsup) | 5 V | 5 V |
surface mount | NO | YES |
technology | TTL | TTL |
Temperature level | MILITARY | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | FLAT |
Terminal pitch | 2.54 mm | 1.27 mm |
Terminal location | DUAL | DUAL |