AS8F2M32Q-90/XT datasheet, PDF

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AS8F2M32Q-90/XT: DescriptionFlash Module, 2MX32, 90ns, CQFP68; Categorystorage storage; File Size1012KB，11 Pages; ManufacturerMicross; Websitehttps://www.micross.com

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AS8F2M32Q-90/XT Overview

Flash Module, 2MX32, 90ns, CQFP68

AS8F2M32Q-90/XT Parametric

Parameter Name	Attribute value
Maker	Micross
package instruction	QFP-68
Reach Compliance Code	compli
ECCN code	3A001.A.2.C
Maximum access time	90 ns
Data polling	YES
JESD-30 code	S-CQFP-G68
length	22.352 mm
memory density	67108864 bi
Memory IC Type	FLASH MODULE
memory width	32
Number of functions	1
Number of departments/size	32
Number of terminals	68
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	2MX32
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QFP
Encapsulate equivalent code	QFP68,.99SQ,50
Package shape	SQUARE
Package form	FLATPACK
Parallel/Serial	PARALLEL
power supply	5 V
Programming voltage	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883 Class C
Maximum seat height	3.556 mm
Department size	64K
Maximum standby current	0.004 A
Maximum slew rate	0.24 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	QUAD
switch bit	YES
type	NOR TYPE
width	22.352 mm

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AUSTIN SEMICONDUCTOR, INC.

Austin Semiconductor, Inc.

2M x 32 FLASH

FLASH MEMORY MODULE

AVAILABLE AS MILITARY

SPECIFICATIONS

• Military Processing (MIL-STD-883C para 1.2.2)

•

Temperature Range -55C to 125C

AS8F2M32

FLASH

FIGURE 1: PIN ASSIGNMENT

(Top View)

68 Lead CQFP

FEATURES

• Fast access times of 90ns, 120ns, and 150ns

• 5.0V ±10%, single power supply operation

• Low power consumption(TYP): 4µA CMOS stand-by

* TYP ICC(active) <120mA for READ/WRITE

• 20 year DATA RETENTION

• 100,000 program/erase cycles

• 32 equal sectors of 64 Kbytes each

• Any combination of Sectors can be Erased

• Group Sector Protection

• Supports FULL Chip Erase

• Compatible with JEDEC standards

• Embedded Erase and Program Algorithms

• Data\ Polling and Toggle bits for detection of program or erase

cycle completion.

• Erase Suspend/Resume

• Hardware Reset pin (RESET\)

• Built in Decoupling Caps and Multiple Ground Pins for Low Noise

Operation

• Separate Power and Ground Plnes to improve noise immunity

GENERAL DESCRIPTION

The Austin Semiconductor, Inc. AS8F2M32 is a 64 Mbit, 5.0 volt-

only Flash memory. This device is designed to be programmed in-

system with the standard system 5.0 volt VCC supply. The AS8F2M32

offers an access time of 90ns, allowing high-speed microprocessors to

operate without wait states. To eliminate bus contention, the device has

separate chip enable (CE\), write enable (WE\) and output enable (OE\)

controls.

The device requires only a single 5.0 volt power supply for both

read and write functions. internally generated and regulated voltages

are provided for the program and erase operations.

The device is entirely command set compatible with the JEDEC

single-power-supply FLASH standard. Commands are written to the

command register using standard microprocessor write timings.

controls the erase and programming circuitry. Write cycles also

internally latch addresses and data needed for the programming and

erase operations. Reaching data out of the device is similar to reading

from other FLASH or EPROM devices.

Device programming occurs by executing the program command

sequence. This initiates the Embedded Program algorithm - an internal

algorithm that automatically time the program pulse widths and verifies

proper cell margin.

Device erasure occurs by executing the erase command sequence.

This initiates the Embedded Erase algorithm - an internal algorithm that

automatically preprograms the array (if it is not already programmed)

before executing the erase operation. During erase, the device

automatically times the erase pulse widths and verifies proper cell

margin.

The host system can detect whether a program or erase operation is

complete by observing the RY/BY\ pin, or by reading the DQ7 (DATA\

Polling) and DQ6 (toggle) status bits. After a program or erase cycle

has been completed, the device is ready to read array data or accept

another command.

(continued on page 2)

Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.

OPTION

• Timing

90ns

120ns

150ns

• Packages

Ceramic Quad Flat Pack (0.88" sq)

- MAX height .140"

- Stand-off Height .035" min

MARKING

-90

-120

-150

For more products and information

please visit our web site at

www.austinsemiconductor.com

AS8F2M32

Rev. 2.1 03/05

AS8F2M32Q-90/XT Related Products

	AS8F2M32Q-90/XT	AS8F2M32Q-120/MIL	AS8F2M32Q-150/IT	AS8F2M32Q-150/XT	AS8F2M32Q-150/MIL	AS8F2M32Q-120/IT	AS8F2M32Q-120/XT	AS8F2M32Q-90/IT	AS8F2M32Q-90/MIL
Description	Flash Module, 2MX32, 90ns, CQFP68	Flash Module, 2MX32, 120ns, CQFP68	Flash Module, 2MX32, 150ns, CQFP68,	Flash Module, 2MX32, 150ns, CQFP68	Flash Module, 2MX32, 150ns, CQFP68	Flash Module, 2MX32, 120ns, CQFP68,	Flash Module, 2MX32, 120ns, CQFP68	Flash Module, 2MX32, 90ns, CQFP68	Flash Module, 2MX32, 90ns, CQFP68
Maker	Micross	Micross	Micross	Micross	Micross	Micross	Micross	Micross	Micross
package instruction	QFP-68	QFP-68	QFP-68	QFP-68	QFP-68	QFP-68	QFP-68	QFP-68	QFP-68
Reach Compliance Code	compli	compliant	compliant	compliant	compliant	compli	compli	compli	compli
Maximum access time	90 ns	120 ns	150 ns	150 ns	150 ns	120 ns	120 ns	90 ns	90 ns
Data polling	YES	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 code	S-CQFP-G68	S-CQFP-G68	S-CQFP-G68	S-CQFP-G68	S-CQFP-G68	S-CQFP-G68	S-CQFP-G68	S-CQFP-G68	S-CQFP-G68
length	22.352 mm	22.352 mm	22.352 mm	22.352 mm	22.352 mm	22.352 mm	22.352 mm	22.352 mm	22.352 mm
memory density	67108864 bi	67108864 bit	67108864 bit	67108864 bit	67108864 bit	67108864 bi	67108864 bi	67108864 bi	67108864 bi
Memory IC Type	FLASH MODULE	FLASH MODULE	FLASH MODULE	FLASH MODULE	FLASH MODULE	FLASH MODULE	FLASH MODULE	FLASH MODULE	FLASH MODULE
memory width	32	32	32	32	32	32	32	32	32
Number of functions	1	1	1	1	1	1	1	1	1
Number of departments/size	32	32	32	32	32	32	32	32	32
Number of terminals	68	68	68	68	68	68	68	68	68
word count	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words
character code	2000000	2000000	2000000	2000000	2000000	2000000	2000000	2000000	2000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	2MX32	2MX32	2MX32	2MX32	2MX32	2MX32	2MX32	2MX32	2MX32
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP	QFP
Encapsulate equivalent code	QFP68,.99SQ,50	QFP68,.99SQ,50	QFP68,.99SQ,50	QFP68,.99SQ,50	QFP68,.99SQ,50	QFP68,.99SQ,50	QFP68,.99SQ,50	QFP68,.99SQ,50	QFP68,.99SQ,50
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK	FLATPACK
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Programming voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	MIL-STD-883 Class C	MIL-STD-883 Class C	MIL-STD-883 Class C	MIL-STD-883 Class C	MIL-STD-883 Class C	MIL-STD-883 Class C	MIL-STD-883 Class C	MIL-STD-883 Class C	MIL-STD-883 Class C
Maximum seat height	3.556 mm	3.556 mm	3.556 mm	3.556 mm	3.556 mm	3.556 mm	3.556 mm	3.556 mm	3.556 mm
Department size	64K	64K	64K	64K	64K	64K	64K	64K	64K
Maximum standby current	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A
Maximum slew rate	0.24 mA	0.24 mA	0.24 mA	0.24 mA	0.24 mA	0.24 mA	0.24 mA	0.24 mA	0.24 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
switch bit	YES	YES	YES	YES	YES	YES	YES	YES	YES
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
width	22.352 mm	22.352 mm	22.352 mm	22.352 mm	22.352 mm	22.352 mm	22.352 mm	22.352 mm	22.352 mm
ECCN code	3A001.A.2.C	-	-	-	-	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C

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