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AS8F2M32Q-120/XT

Description
Flash Module, 2MX32, 120ns, CQFP68
Categorystorage    storage   
File Size1012KB,11 Pages
ManufacturerMicross
Websitehttps://www.micross.com
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AS8F2M32Q-120/XT Overview

Flash Module, 2MX32, 120ns, CQFP68

AS8F2M32Q-120/XT Parametric

Parameter NameAttribute value
MakerMicross
package instructionQFP-68
Reach Compliance Codecompli
ECCN code3A001.A.2.C
Maximum access time120 ns
Data pollingYES
JESD-30 codeS-CQFP-G68
length22.352 mm
memory density67108864 bi
Memory IC TypeFLASH MODULE
memory width32
Number of functions1
Number of departments/size32
Number of terminals68
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize2MX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Encapsulate equivalent codeQFP68,.99SQ,50
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
power supply5 V
Programming voltage5 V
Certification statusNot Qualified
Filter levelMIL-STD-883 Class C
Maximum seat height3.556 mm
Department size64K
Maximum standby current0.004 A
Maximum slew rate0.24 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationQUAD
switch bitYES
typeNOR TYPE
width22.352 mm
AUSTIN SEMICONDUCTOR, INC.
Austin Semiconductor, Inc.
2M x 32 FLASH
FLASH MEMORY MODULE
AVAILABLE AS MILITARY
SPECIFICATIONS
• Military Processing (MIL-STD-883C para 1.2.2)
Temperature Range -55C to 125C
AS8F2M32
FLASH
FIGURE 1: PIN ASSIGNMENT
(Top View)
68 Lead CQFP
FEATURES
• Fast access times of 90ns, 120ns, and 150ns
• 5.0V ±10%, single power supply operation
• Low power consumption(TYP): 4µA CMOS stand-by
* TYP ICC(active) <120mA for READ/WRITE
• 20 year DATA RETENTION
• 100,000 program/erase cycles
• 32 equal sectors of 64 Kbytes each
• Any combination of Sectors can be Erased
• Group Sector Protection
• Supports FULL Chip Erase
• Compatible with JEDEC standards
• Embedded Erase and Program Algorithms
• Data\ Polling and Toggle bits for detection of program or erase
cycle completion.
• Erase Suspend/Resume
• Hardware Reset pin (RESET\)
• Built in Decoupling Caps and Multiple Ground Pins for Low Noise
Operation
• Separate Power and Ground Plnes to improve noise immunity
GENERAL DESCRIPTION
The Austin Semiconductor, Inc. AS8F2M32 is a 64 Mbit, 5.0 volt-
only Flash memory. This device is designed to be programmed in-
system with the standard system 5.0 volt VCC supply. The AS8F2M32
offers an access time of 90ns, allowing high-speed microprocessors to
operate without wait states. To eliminate bus contention, the device has
separate chip enable (CE\), write enable (WE\) and output enable (OE\)
controls.
The device requires only a single 5.0 volt power supply for both
read and write functions. internally generated and regulated voltages
are provided for the program and erase operations.
The device is entirely command set compatible with the JEDEC
single-power-supply FLASH standard. Commands are written to the
command register using standard microprocessor write timings.
Register contents serve as input to an internal state-matching that
controls the erase and programming circuitry. Write cycles also
internally latch addresses and data needed for the programming and
erase operations. Reaching data out of the device is similar to reading
from other FLASH or EPROM devices.
Device programming occurs by executing the program command
sequence. This initiates the Embedded Program algorithm - an internal
algorithm that automatically time the program pulse widths and verifies
proper cell margin.
Device erasure occurs by executing the erase command sequence.
This initiates the Embedded Erase algorithm - an internal algorithm that
automatically preprograms the array (if it is not already programmed)
before executing the erase operation. During erase, the device
automatically times the erase pulse widths and verifies proper cell
margin.
The host system can detect whether a program or erase operation is
complete by observing the RY/BY\ pin, or by reading the DQ7 (DATA\
Polling) and DQ6 (toggle) status bits. After a program or erase cycle
has been completed, the device is ready to read array data or accept
another command.
(continued on page 2)
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
OPTION
• Timing
90ns
120ns
150ns
• Packages
Ceramic Quad Flat Pack (0.88" sq)
- MAX height .140"
- Stand-off Height .035" min
MARKING
-90
-120
-150
QT
For more products and information
please visit our web site at
www.austinsemiconductor.com
AS8F2M32
Rev. 2.1 03/05
1

AS8F2M32Q-120/XT Related Products

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Description Flash Module, 2MX32, 120ns, CQFP68 Flash Module, 2MX32, 120ns, CQFP68 Flash Module, 2MX32, 150ns, CQFP68, Flash Module, 2MX32, 150ns, CQFP68 Flash Module, 2MX32, 150ns, CQFP68 Flash Module, 2MX32, 120ns, CQFP68, Flash Module, 2MX32, 90ns, CQFP68 Flash Module, 2MX32, 90ns, CQFP68 Flash Module, 2MX32, 90ns, CQFP68
Maker Micross Micross Micross Micross Micross Micross Micross Micross Micross
package instruction QFP-68 QFP-68 QFP-68 QFP-68 QFP-68 QFP-68 QFP-68 QFP-68 QFP-68
Reach Compliance Code compli compliant compliant compliant compliant compli compli compli compli
Maximum access time 120 ns 120 ns 150 ns 150 ns 150 ns 120 ns 90 ns 90 ns 90 ns
Data polling YES YES YES YES YES YES YES YES YES
JESD-30 code S-CQFP-G68 S-CQFP-G68 S-CQFP-G68 S-CQFP-G68 S-CQFP-G68 S-CQFP-G68 S-CQFP-G68 S-CQFP-G68 S-CQFP-G68
length 22.352 mm 22.352 mm 22.352 mm 22.352 mm 22.352 mm 22.352 mm 22.352 mm 22.352 mm 22.352 mm
memory density 67108864 bi 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bi 67108864 bi 67108864 bi 67108864 bi
Memory IC Type FLASH MODULE FLASH MODULE FLASH MODULE FLASH MODULE FLASH MODULE FLASH MODULE FLASH MODULE FLASH MODULE FLASH MODULE
memory width 32 32 32 32 32 32 32 32 32
Number of functions 1 1 1 1 1 1 1 1 1
Number of departments/size 32 32 32 32 32 32 32 32 32
Number of terminals 68 68 68 68 68 68 68 68 68
word count 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words
character code 2000000 2000000 2000000 2000000 2000000 2000000 2000000 2000000 2000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
organize 2MX32 2MX32 2MX32 2MX32 2MX32 2MX32 2MX32 2MX32 2MX32
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code QFP QFP QFP QFP QFP QFP QFP QFP QFP
Encapsulate equivalent code QFP68,.99SQ,50 QFP68,.99SQ,50 QFP68,.99SQ,50 QFP68,.99SQ,50 QFP68,.99SQ,50 QFP68,.99SQ,50 QFP68,.99SQ,50 QFP68,.99SQ,50 QFP68,.99SQ,50
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Programming voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Filter level MIL-STD-883 Class C MIL-STD-883 Class C MIL-STD-883 Class C MIL-STD-883 Class C MIL-STD-883 Class C MIL-STD-883 Class C MIL-STD-883 Class C MIL-STD-883 Class C MIL-STD-883 Class C
Maximum seat height 3.556 mm 3.556 mm 3.556 mm 3.556 mm 3.556 mm 3.556 mm 3.556 mm 3.556 mm 3.556 mm
Department size 64K 64K 64K 64K 64K 64K 64K 64K 64K
Maximum standby current 0.004 A 0.004 A 0.004 A 0.004 A 0.004 A 0.004 A 0.004 A 0.004 A 0.004 A
Maximum slew rate 0.24 mA 0.24 mA 0.24 mA 0.24 mA 0.24 mA 0.24 mA 0.24 mA 0.24 mA 0.24 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
switch bit YES YES YES YES YES YES YES YES YES
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 22.352 mm 22.352 mm 22.352 mm 22.352 mm 22.352 mm 22.352 mm 22.352 mm 22.352 mm 22.352 mm
ECCN code 3A001.A.2.C - - - - 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C

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