MD74SC238AC datasheet, PDF - EEWORLD Datasheet

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MD74SC238AC: DescriptionIC,DECODER/DEMUX,3-TO-8-LINE,SC-CMOS,DIP,16PIN,CERAMIC; Categorylogic logic; File Size159KB，5 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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MD74SC238AC Overview

IC,DECODER/DEMUX,3-TO-8-LINE,SC-CMOS,DIP,16PIN,CERAMIC

MD74SC238AC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Microsemi
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknow
ECCN code	EAR99
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
Logic integrated circuit type	OTHER DECODER/DRIVER
MaximumI(ol)	0.008 A
Number of functions	1
Number of terminals	16
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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MD74SC238AC Related Products

	MD74SC238AC	MD54SC237AC	MD54SC238AC	MD54SC239AC	MD74SC237AC	MD74SC237AE	MD74SC238AE	MD74SC239AC	MD74SC239AE
Description	IC,DECODER/DEMUX,3-TO-8-LINE,SC-CMOS,DIP,16PIN,CERAMIC	Decoder/Driver, CMOS, CDIP16,	Decoder/Driver, CMOS, CDIP16,	Decoder/Driver, CMOS, CDIP16,	IC,DECODER/DEMUX,3-TO-8-LINE,SC-CMOS,DIP,16PIN,CERAMIC	IC,DECODER/DEMUX,3-TO-8-LINE,SC-CMOS,DIP,16PIN,PLASTIC	IC,DECODER/DEMUX,3-TO-8-LINE,SC-CMOS,DIP,16PIN,PLASTIC	IC,DECODER/DEMUX,2-TO-4-LINE,SC-CMOS,DIP,16PIN,CERAMIC	IC,DECODER/DEMUX,2-TO-4-LINE,SC-CMOS,DIP,16PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	unknow	unknow	unknow	unknow	unknow	unknow	unknow	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
JESD-30 code	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-PDIP-T16	R-PDIP-T16	R-XDIP-T16	R-PDIP-T16
Logic integrated circuit type	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER
MaximumI(ol)	0.008 A	0.0065 A	0.0065 A	0.0065 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A
Number of functions	1	1	1	2	1	1	1	2	2
Number of terminals	16	16	16	16	16	16	16	16	16
Maximum operating temperature	70 °C	125 °C	125 °C	125 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	TTL	TTL
Temperature level	COMMERCIAL	MILITARY	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	Microsemi	Microsemi	Microsemi	Microsemi	Microsemi	Microsemi	Microsemi	-	-
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	-	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
JESD-609 code	e0	-	-	-	e0	e0	e0	e0	e0
Terminal surface	Tin/Lead (Sn/Pb)	-	-	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)

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