Cache SRAM, 128KX36, 6.5ns, CMOS, PBGA165, TFBGA-165
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Integrated Silicon Solution ( ISSI ) |
Parts packaging code | BGA |
package instruction | TBGA, BGA165,11X15,40 |
Contacts | 165 |
Reach Compliance Code | compli |
ECCN code | 3A991.B.2.A |
Maximum access time | 6.5 ns |
Maximum clock frequency (fCLK) | 133 MHz |
I/O type | COMMON |
JESD-30 code | R-PBGA-B165 |
length | 15 mm |
memory density | 4718592 bi |
Memory IC Type | CACHE SRAM |
memory width | 36 |
Number of functions | 1 |
Number of terminals | 165 |
word count | 131072 words |
character code | 128000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 128KX36 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | TBGA |
Encapsulate equivalent code | BGA165,11X15,40 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, THIN PROFILE |
Parallel/Serial | PARALLEL |
power supply | 2.5 V |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
Maximum standby current | 0.08 A |
Minimum standby current | 2.38 V |
Maximum slew rate | 0.185 mA |
Maximum supply voltage (Vsup) | 2.625 V |
Minimum supply voltage (Vsup) | 2.375 V |
Nominal supply voltage (Vsup) | 2.5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
width | 13 mm |