|
NTD15N06 |
NTD15N06T4 |
NTD15N06-1 |
NTD15N06-001 |
Description |
Power MOSFET 15 Amps, 60 Volts |
Power MOSFET 15 Amps, 60 Volts |
Power MOSFET 15 Amps, 60 Volts |
MOSFET N-CH 60V 15A IPAK |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
- |
Maker |
ON Semiconductor |
ON Semiconductor |
ON Semiconductor |
- |
package instruction |
CASE 369C-01, DPAK-3 |
CASE 369C-01, DPAK-3 |
IN-LINE, R-PSIP-T3 |
- |
Contacts |
3 |
3 |
3 |
- |
Manufacturer packaging code |
CASE 369C-01 |
CASE 369C-01 |
CASE 369D-01 |
- |
Reach Compliance Code |
_compli |
_compli |
compli |
- |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
- |
Avalanche Energy Efficiency Rating (Eas) |
61 mJ |
61 mJ |
61 mJ |
- |
Shell connection |
DRAIN |
DRAIN |
DRAIN |
- |
Configuration |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
- |
Minimum drain-source breakdown voltage |
60 V |
60 V |
60 V |
- |
Maximum drain current (Abs) (ID) |
15 A |
15 A |
15 A |
- |
Maximum drain current (ID) |
15 A |
15 A |
15 A |
- |
Maximum drain-source on-resistance |
0.09 Ω |
0.09 Ω |
0.09 Ω |
- |
FET technology |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
- |
JESD-30 code |
R-PSSO-G2 |
R-PSSO-G2 |
R-PSIP-T3 |
- |
JESD-609 code |
e0 |
e0 |
e0 |
- |
Number of components |
1 |
1 |
1 |
- |
Number of terminals |
2 |
2 |
3 |
- |
Operating mode |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
- |
Maximum operating temperature |
175 °C |
175 °C |
175 °C |
- |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
- |
Package form |
SMALL OUTLINE |
SMALL OUTLINE |
IN-LINE |
- |
Peak Reflow Temperature (Celsius) |
235 |
240 |
NOT SPECIFIED |
- |
Polarity/channel type |
N-CHANNEL |
N-CHANNEL |
N-CHANNEL |
- |
Maximum power dissipation(Abs) |
1.5 W |
1.5 W |
1.5 W |
- |
Maximum pulsed drain current (IDM) |
45 A |
45 A |
45 A |
- |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
- |
surface mount |
YES |
YES |
NO |
- |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
TIN LEAD |
- |
Terminal form |
GULL WING |
GULL WING |
THROUGH-HOLE |
- |
Terminal location |
SINGLE |
SINGLE |
SINGLE |
- |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
30 |
NOT SPECIFIED |
- |
transistor applications |
SWITCHING |
SWITCHING |
SWITCHING |
- |
Transistor component materials |
SILICON |
SILICON |
SILICON |
- |