JANTX1N6050A datasheet, PDF - EEWORLD Datasheet

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JANTX1N6050A: DescriptionTrans Voltage Suppressor Diode, 1500W, 25V V(RWM), Bidirectional, 1 Element, Silicon; CategoryDiscrete semiconductor diode; File Size76KB，14 Pages; ManufacturerSemicon Components Inc

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Trans Voltage Suppressor Diode, 1500W, 25V V(RWM), Bidirectional, 1 Element, Silicon

JANTX1N6050A Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Semicon Components Inc
package instruction	O-XALF-W2
Reach Compliance Code	unknow
ECCN code	EAR99
Maximum breakdown voltage	31.5 V
Minimum breakdown voltage	28.5 V
Breakdown voltage nominal value	30 V
Shell connection	CATHODE
Maximum clamping voltage	41.4 V
Configuration	SINGLE
Diode component materials	SILICON
Diode type	TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 code	O-XALF-W2
JESD-609 code	e0
Maximum non-repetitive peak reverse power dissipation	1500 W
Number of components	1
Number of terminals	2
Maximum operating temperature	175 °C
Minimum operating temperature	-65 °C
Package body material	UNSPECIFIED
Package shape	ROUND
Package form	LONG FORM
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
polarity	BIDIRECTIONAL
Maximum power dissipation	1 W
Certification status	Not Qualified
Guideline	MIL-19500/507
Maximum repetitive peak reverse voltage	25 V
Maximum reverse current	5 µA
surface mount	NO
technology	AVALANCHE
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	WIRE
Terminal location	AXIAL
Maximum time at peak reflow temperature	NOT SPECIFIED

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The documentation and process conversion

measures necessary to comply with this revision

shall be completed by 12 December 1999.

INCH-POUND

MIL-PRF-19500/507C

12 September 1999

SUPERSEDING

MIL-S-19500/507B

9 December 1992

PERFORMANCE SPECIFICATION SHEET

SEMICONDUCTOR DEVICE, DIODE, SILICON, BIPOLAR TRANSIENT

VOLTAGE SUPPRESSOR TYPES 1N6036A THROUGH 1N6072A

JAN, JANTX, JANTXV, AND JANS

This specification is approved for use by all Depart-

ments and Agencies of the Department of Defense.

1. SCOPE

1.1 Scope. This specification covers the performance requirements for 1500 watt, peak, pulse power, silicon, transient, voltage

suppressor diodes. Four levels of product assurance are provided for each device as specified in MIL-PRF-19500.

1.2 Physical dimensions. See figure 1 (similar to DO – 13).

1.3 Maximum ratings. Maximum ratings are as shown in columns 5 through 8 of table III herein, and as follows:

= 1500 W (see figure 3) at t

= 1.0 ms.

M(AV)

= 1.0 W (derate at 6.67 mW/°C above T

= +25°C) (see 6.4).

-55°C

≤

+175°C (ambient), -55°C

≤

STG

≤

+175°C (ambient).

1.4 Primary electrical characteristics at T

= +25°C. Primary electrical characteristics are shown in columns 2 and 4 of table III herein.

2. APPLICABLE DOCUMENTS

2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include

documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has

been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements documents

cited in section 3 and 4 of this specification, whether or not they are listed.

2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to

the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of

Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2).

SPECIFICATION

DEPARTMENT OF DEFENSE

MIL-PRF-19500

STANDARD

MILITARY

MIL-STD-750

- Test Methods for Semiconductor Devices.

- Semiconductor Devices, General Specification for.

(Unless otherwise indicated, copies of federal and military specifications, standards, and handbooks are available from the

Standardization Documents Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document

should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAC, 3990 East Broad St., Columbus, OH

43216-5000, by using the addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this

document or by letter.

AMSC N/A

DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.

FSC 5961

MIL-PRF-19500/507C

2.2 Order of precedence. In the event of a conflict between the text of this specification and the references cited herein, the text of this

document shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific

exemption has been obtained.

3. REQUIREMENTS

3.1 Associated detail specification. The individual item requirements shall be in accordance with MIL-PRF-19500 and as specified

herein.

3.2 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as specified in MIL-

PRF-19500.

3.3 Interface requirements and physical dimensions. The interface requirements and physical dimensions shall be as specified in MIL-

PRF-19500 and on figure 1 (similar to DO-13) herein.

3.3.1 Metallurgical bond construction. Metallurgically bonded construction is required. The bonding flow shall have flow points above

260°C.

3.3.2 Lead finish. Unless otherwise specified, lead finish shall be solderable in accordance with MIL-STD-750, MIL-PRF-19500, and

herein. Where a choice of lead finish is desired, it shall be specified in the acquisition requirements (see 6.2).

3.4 Marking. Devices shall be marked in accordance with MIL-PRF-19500.

3.5 Electrical performance characteristics. Unless otherwise specified, the electrical performance characteristics are as specified in 1.3,

1.4, and table I herein.

3.6 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table I herein.

4. VERIFICATION

4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:

Qualification inspection (see 4.2).

Screening (see 4.3).

Conformance inspection (see 4.4).

4.1.1 Sampling and inspection. Sampling and inspection shall be in accordance with MIL-PRF-19500, and as specified herein except,

lot accumulation shall be 3-months in lieu of 6-weeks.

4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and 6.3 herein.

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