Microprocessor, 32-Bit, 800MHz, CMOS, CBGA783, 29 X 29 MM, 1 MM PITCH, CERAMIC, BGA-783
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | e2v technologies |
Parts packaging code | BGA |
package instruction | BGA, BGA783,28X28,40 |
Contacts | 783 |
Reach Compliance Code | compli |
ECCN code | 3A001.A.3 |
Other features | ALSO REQUIRES 2.5V OR 3.3V SUPPLY |
Address bus width | 64 |
bit size | 32 |
boundary scan | YES |
maximum clock frequency | 66 MHz |
External data bus width | 64 |
Format | FLOATING POINT |
Integrated cache | YES |
JESD-30 code | S-CBGA-B783 |
length | 29 mm |
low power mode | YES |
Humidity sensitivity level | 1 |
Number of terminals | 783 |
Maximum operating temperature | 110 °C |
Minimum operating temperature | -40 °C |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | BGA |
Encapsulate equivalent code | BGA783,28X28,40 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 225 |
power supply | 1.1 V |
Certification status | Not Qualified |
Maximum seat height | 3.38 mm |
speed | 800 MHz |
Maximum supply voltage | 1.155 V |
Minimum supply voltage | 1.045 V |
Nominal supply voltage | 1.1 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 29 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR |