Dual Wideband Video Op Amp
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | National Semiconductor(TI ) |
package instruction | DIP, |
Reach Compliance Code | unknow |
ECCN code | EAR99 |
Amplifier type | OPERATIONAL AMPLIFIER |
JESD-30 code | R-PDIP-T8 |
JESD-609 code | e0 |
length | 9.817 mm |
Number of functions | 2 |
Number of terminals | 8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
Maximum seat height | 5.08 mm |
surface mount | NO |
technology | BIPOLAR |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 7.62 mm |
Base Number Matches | 1 |
CLC412AJP | CLC412 | CLC412A8B | CLC412A8L-2A | CLC412AIB | CLC412AJE | CLC412AMC | |
---|---|---|---|---|---|---|---|
Description | Dual Wideband Video Op Amp | Dual Wideband Video Op Amp | Dual Wideband Video Op Amp | Dual Wideband Video Op Amp | Dual Wideband Video Op Amp | Dual Wideband Video Op Amp | Dual Wideband Video Op Amp |
Is it Rohs certified? | incompatible | - | incompatible | incompatible | - | incompatible | - |
Maker | National Semiconductor(TI ) | - | National Semiconductor(TI ) | National Semiconductor(TI ) | - | National Semiconductor(TI ) | - |
package instruction | DIP, | - | DIP, DIP8,.3 | LCC-20 | - | SOP, | - |
Reach Compliance Code | unknow | - | unknow | unknow | - | unknow | - |
ECCN code | EAR99 | - | EAR99 | EAR99 | - | EAR99 | - |
Amplifier type | OPERATIONAL AMPLIFIER | - | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | - | OPERATIONAL AMPLIFIER | - |
JESD-30 code | R-PDIP-T8 | - | R-GDIP-T8 | R-PQCC-N20 | - | R-PDSO-G8 | - |
JESD-609 code | e0 | - | e0 | e0 | - | e0 | - |
Number of functions | 2 | - | 2 | 2 | - | 2 | - |
Number of terminals | 8 | - | 8 | 20 | - | 8 | - |
Package body material | PLASTIC/EPOXY | - | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - |
encapsulated code | DIP | - | DIP | QCCN | - | SOP | - |
Package shape | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | - |
Package form | IN-LINE | - | IN-LINE | CHIP CARRIER | - | SMALL OUTLINE | - |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - |
Certification status | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified | - |
surface mount | NO | - | NO | YES | - | YES | - |
technology | BIPOLAR | - | BIPOLAR | BIPOLAR | - | BIPOLAR | - |
Temperature level | INDUSTRIAL | - | MILITARY | MILITARY | - | INDUSTRIAL | - |
Terminal surface | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - |
Terminal form | THROUGH-HOLE | - | THROUGH-HOLE | NO LEAD | - | GULL WING | - |
Terminal pitch | 2.54 mm | - | 2.54 mm | 1.27 mm | - | 1.27 mm | - |
Terminal location | DUAL | - | DUAL | QUAD | - | DUAL | - |
Maximum time at peak reflow temperature | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - |
Base Number Matches | 1 | - | 1 | 1 | - | 1 | - |