EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

0603CG8R2C9B300

Description
Ceramic Capacitor, Multilayer, Ceramic, 50V, 3.05% +Tol, 3.05% -Tol, C0G, 30ppm/Cel TC, 0.0000082uF, Surface Mount, 0603, CHIP
CategoryPassive components    capacitor   
File Size277KB,18 Pages
ManufacturerYAGEO
Websitehttp://www.yageo.com/
Download Datasheet Parametric View All

0603CG8R2C9B300 Overview

Ceramic Capacitor, Multilayer, Ceramic, 50V, 3.05% +Tol, 3.05% -Tol, C0G, 30ppm/Cel TC, 0.0000082uF, Surface Mount, 0603, CHIP

0603CG8R2C9B300 Parametric

Parameter NameAttribute value
MakerYAGEO
package instruction, 0603
Reach Compliance Codecompli
ECCN codeEAR99
capacitance0.0000082 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
JESD-609 codee3
Manufacturer's serial numberNP0
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance3.05%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTR, PAPER, 13 INCH
positive tolerance3.05%
Rated (DC) voltage (URdc)50 V
size code0603
surface mountYES
Temperature characteristic codeC0G
Temperature Coefficient-/+30ppm/Cel ppm/°C
Terminal surfaceTIN
Terminal shapeWRAPAROUND
How to convert levels in DSP system design?
[size=4]1) It is inevitable that there is a 5V/3.3V mixed power supply phenomenon in the DSP system;[/size] [size=4]2) For DSPs with 3.3V I/O power supply, the input signal level is not allowed to exc...
Jacktang DSP and ARM Processors
China's space dream: a thousand years of desire, fifty years of planning, and thirty years of struggle! Watch 4 short documentaries on space travel
There are only two words that can describe my feelings: proud and moved.Share with everyone:Space station launch process:Space station development history:Tianhe core module:Robotic Arm:...
okhxyyo Talking
What are the differences between 1206 and 0805 chip resistor packages besides size and power?
What are the differences between 1206 and 0805 chip resistor packages besides size and power?...
electricor PCB Design
A simple pull-up and pull-down circuit causes the control chip to heat up!
The problem is this, in order to manually set the input level state of some pins of the STM32F103 series microcontroller (statement: because a certain function is to be completed, it is randomly set b...
燕园技术宅 Analog electronics
I would like some advice on how to import .brd files into DXP
I have a Cadence 16.6 BRD file. After importing it using the AD13 version Import Wizard, it shows blank. I don’t know what’s going on. Can anyone help me convert it to a format that can be opened by D...
srzm PCB Design
【BLE 5.3 wireless MCU CH582】12. MounRiver IDE usage record
Series of articles: 【BLE 5.3 wireless MCU CH582】1. Getting to know the CH582 development board (unboxing) 【BLE 5.3 wireless MCU CH582】2. MounRiver IDE first experience 【BLE 5.3 wireless MCU CH582】3. N...
freeelectron Domestic Chip Exchange

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号