Field Programmable Gate Array, 1936 CLBs, 33000 Gates, 294MHz, 1936-Cell, CMOS, PBGA560, PLASTIC, BGA-560
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | XILINX |
Parts packaging code | BGA |
package instruction | PLASTIC, BGA-560 |
Contacts | 560 |
Reach Compliance Code | _compli |
Other features | CAN ALSO USE 100000 GATES |
maximum clock frequency | 294 MHz |
Combined latency of CLB-Max | 0.9 ns |
JESD-30 code | S-PBGA-B560 |
JESD-609 code | e0 |
length | 42.5 mm |
Humidity sensitivity level | 3 |
Configurable number of logic blocks | 1936 |
Equivalent number of gates | 33000 |
Number of entries | 352 |
Number of logical units | 1936 |
Output times | 352 |
Number of terminals | 560 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | |
organize | 1936 CLBS, 33000 GATES |
Package body material | PLASTIC/EPOXY |
encapsulated code | LBGA |
Encapsulate equivalent code | BGA560,33X33,50 |
Package shape | SQUARE |
Package form | GRID ARRAY, LOW PROFILE |
Peak Reflow Temperature (Celsius) | 225 |
power supply | 3.3 V |
Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY |
Certification status | Not Qualified |
Maximum seat height | 1.7 mm |
Maximum supply voltage | 3.6 V |
Minimum supply voltage | 3 V |
Nominal supply voltage | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | OTHER |
Terminal surface | Tin/Lead (Sn63Pb37) |
Terminal form | BALL |
Terminal pitch | 1.27 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |
width | 42.5 mm |