SFM
www.vishay.com
Vishay Electro-Films
Thin Film Top-Contact Resistor
FEATURES
• Wire bondable
• Small size: 0.020 inches square
• Case: 0202
• Resistance range: 1.0
to 1 M
Product may not be to scale
• DC power rating: 250 mW
• Oxidized silicon substrate for good power dissipation
• Resistor material tantalum nitride, self passivating
• Moisture resistant
• Material categorization: For definitions of compliance
please see
www.vishay.com/doc?99912
The SFM series single-value resistor chips offer a small size,
wide ohmic value range and excellent power capacity.
The SFMs tantalum nitride resistor material offers excellent
resistance to high moisture environments.
The SFMs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology. The SFMs are 100 % electrically tested and
visually inspected to MIL-STD-883.
APPLICATIONS
Vishay EFI SFM top-contact resistor chips are designed to
handle substantial power loads in many types of hybrid
packages. They are ideally suited for this purpose because
of their small size.
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES, AND TOLERANCES
PARAMETER
Total Resistance Range
Standard Tolerances
TCR
1%
0.5 %
VALUE
1 to 1M
± 0.1, ± 0.5, ± 1
± 25, ± 50, ± 100, ± 250
Tightest Standard Tolerance Available
0.1 %
± 25 ppm/°C
± 50 ppm/°C
± 100 ppm/°C
± 250 ppm/°C
UNIT
%
ppm/°C
1
Ω
10
Ω
30
Ω
100
Ω
200 kΩ 360 kΩ 620 kΩ 1 MΩ
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Noise, MIL-STD-202, Method 308
100
to 250 k
< 100
or > 251 k
Moisture Resistance, MIL-STD-202 Method 106
Stability, 1000 h, + 125 °C, 125 mW
Operating Temperature Range
Thermal Shock, MIL-STD-202, Method 107, Test Condition F
High Temperature Exposure, + 150 °C, 100 h
Dielectric Voltage Breakdown
Insulation Resistance
Operating Voltage
DC Power Rating at + 70 °C (Derated to zero at + 175 °C)
5 x Rated Power Short-Time Overload, + 25 °C, 5 s
VALUE
- 35 typ.
- 20 typ.
± 0.5 max.
R/R
± 0.25 max.
R/R
- 55 to + 150
± 0.25 max.
R/R
± 0.5 max.
R/R
200
10
12
min.
100 max.
0.250
± 0.25 max.
R/R
UNIT
dB
%
%
°C
%
%
V
V
W
%
Revision: 25-Feb-13
Document Number: 61017
1
For technical questions, contact:
efi@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
SFM
www.vishay.com
CONFIGURATIONS
in inches
0.004
0.020
0.020
Vishay Electro-Films
0.007
0.020
0.016
0.006
0.004
0.004
0.004
0.016
TYPICAL RANGE
1
Ω
to 29
Ω
TYPICAL RANGE
30
Ω
to 819
Ω
TYPICAL RANGE
820
Ω
to 1 MΩ
SCHEMATIC
MECHANICAL SPECIFICATIONS
PARAMETER
Chip Size
Chip Thickness
Chip Substrate Material
Resistor Material
Bonding Pad Size
Number of Pads
Pad Material
Backing
VALUE
0.020" x 0.020" ± 0.003" (0.5 mm x 0.5 mm ± 0.076 mm)
0.010" ± 0.002" (0.254 mm ± 0.05 mm)
Oxidized silicon, 10 kÅ minimum SiO
2
Tantalum nitride, self-passivating
0.004" x 0.004" (0.10 mm x 0.10 mm)
2
25 kÅ minimum aluminum
None, lapped semiconductor silicon
GLOBAL PART NUMBER INFORMATION
Global Part Number: SFM50000FKANHWS
Global Part Number Description: SFM 5K 1 %, 100 ppm/°C, Al, no back metal, class H, WS
S
F
M
5
0
0
0
0
TCR
(ppm/°C)
E
= ± 25
C
= ± 50
K
= ± 100
M
= ± 250
R
= 0/- 250
F
K
A
N
BACK
METAL
H
VISUAL
CLASS
W
S
PACKAGING
CODE
MODEL
SFM
RESISTANCE
First 4 digits are
significant figures
of resistance
RESISTANCE
MULTIPLIER
CODE
C
= 0.001
B
= 0.01
A
= 0.1
0
=1
1
= 10
2
= 100
3
= 1000
TOLERANCE
CODE
(%)
B
= 0.1
C
= 0.25
D
= 0.5
F
= 1.0
G
= 2.0
H
= 2.5
J
= 5.0
K
= 10
TERMINATION
G
= Au
A
= Al
G
= Au
H
= Class H
WS
= Waffle pack
N
= None
K
= Class K 100 min, 1 mult
Historical Part Number: WSFM04550000F (will continue to be accepted)
Revision: 25-Feb-13
Document Number: 61017
2
For technical questions, contact:
efi@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
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RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
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the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
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product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
1
Document Number: 91000