AT27C020-90TU datasheet, PDF - EEWORLD Datasheet

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AT27C020-90TU: Description256K X 8 OTPROM, 55 ns, PQCC32; Categorystorage storage; File Size281KB，14 Pages; ManufacturerAtmel (Microchip); Environmental Compliance

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AT27C020-90TU Overview

256K X 8 OTPROM, 55 ns, PQCC32

AT27C020-90TU Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Atmel (Microchip)
Parts packaging code	TSOP1
package instruction	8 X 20 MM, GREEN, PLASTIC, MO-142BD, TSOP1-32
Contacts	32
Reach Compliance Code	unknow
ECCN code	EAR99
Is Samacsys	N
Maximum access time	90 ns
I/O type	COMMON
JESD-30 code	R-PDSO-G32
JESD-609 code	e3
length	18.4 mm
memory density	2097152 bi
Memory IC Type	OTP ROM
memory width	8
Humidity sensitivity level	3
Number of functions	1
Number of terminals	32
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP1
Encapsulate equivalent code	TSSOP32,.8,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	5 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum standby current	0.0001 A
Maximum slew rate	0.025 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	8 mm
Base Number Matches	1

AT27C020-90TU Related Products

	AT27C020-90TU	AT27C020-55PU	AT27C020-90JA	AT27C020-90JU
Description	256K X 8 OTPROM, 55 ns, PQCC32	256K X 8 OTPROM, 55 ns, PDIP32	256K X 8 OTPROM, 55 ns, PQCC32	256K X 8 OTPROM, 90 ns, PQCC32
Is it Rohs certified?	conform to	conform to	incompatible	conform to
Parts packaging code	TSOP1	DIP	QFJ	QFJ
package instruction	8 X 20 MM, GREEN, PLASTIC, MO-142BD, TSOP1-32	0.600 INCH, GREEN, PLASTIC, DIP-32	QCCJ, LDCC32,.5X.6	QCCJ, LDCC32,.5X.6
Contacts	32	32	32	32
Reach Compliance Code	unknow	unknow	compli	unknow
ECCN code	EAR99	EAR99	EAR99	EAR99
Maximum access time	90 ns	55 ns	90 ns	90 ns
I/O type	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PDSO-G32	R-PDIP-T32	R-PQCC-J32	R-PQCC-J32
JESD-609 code	e3	e3	e0	e3
length	18.4 mm	42.037 mm	13.97 mm	13.97 mm
memory density	2097152 bi	2097152 bi	2097152 bi	2097152 bi
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8
Humidity sensitivity level	3	1	2	2
Number of functions	1	1	1	1
Number of terminals	32	32	32	32
word count	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	125 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
organize	256KX8	256KX8	256KX8	256KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP1	DIP	QCCJ	QCCJ
Encapsulate equivalent code	TSSOP32,.8,20	DIP32,.6	LDCC32,.5X.6	LDCC32,.5X.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	IN-LINE	CHIP CARRIER	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	260	245	225	245
power supply	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	4.826 mm	3.556 mm	3.556 mm
Maximum standby current	0.0001 A	0.0001 A	0.0001 A	0.0001 A
Maximum slew rate	0.025 mA	0.025 mA	0.025 mA	0.025 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	YES	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	AUTOMOTIVE	INDUSTRIAL
Terminal surface	Matte Tin (Sn)	Matte Tin (Sn)	Tin/Lead (Sn/Pb)	Matte Tin (Sn)
Terminal form	GULL WING	THROUGH-HOLE	J BEND	J BEND
Terminal pitch	0.5 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	QUAD	QUAD
Maximum time at peak reflow temperature	30	NOT SPECIFIED	30	40
width	8 mm	15.24 mm	11.43 mm	11.43 mm
Base Number Matches	1	1	-	1

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