For resistors operated in ambient temperatures above 70°C, power rating must be derated in accordance with this curve.
1
1773269 CIS BI 06/2011
Dimensions are in millimeters
and inches unless otherwise
specified. Values in brackets
are standard equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
For email, phone or live chat, go to:
te.com/help
SMD Low Ohmic - Current Sense Resistors
Type RL73 Series
Characteristics - Environmental
Item
Temperature Coefficient
of Resistance (TCR):
Short Time Overload:
Insulation Resistance:
Endurance:
Damp Heat with Load:
Dry Heat:
Bending Strength:
Solderability:
Resistance to Soldering Heat:
Dielectric Withstand Voltage:
Thermal Shock:
Low Temperature Operation:
Reference Standards: MIL-STD-202, JIS-C 5201-1
Storage Temperature: 25±3°C; Humidity < 80%RH
Requirement
As spec
±0.5%
ΔR ±1% for high power rating
>1000MΩ
±1%
±0.5%
±0.5%
As spec
95% min. coverage
±0.5%
By type
±0.5%
±0.5%
Test Method
+25/-55/+25/+125/+25°C
RCWV*2.5 or Max. overload voltage for 5 seconds
Apply 100V
DC
for 1 minute
70 ±2°C, Max. working voltage for 1000hrs with
1.5hrs “ON” and 0.5hrs “OFF”
40 ±2°C, 90 - 95% R.H. max. working voltage
for 1000hrs with 1.5hrs “ON” and 0.5hrs “OFF”
at +155°C for 1000hrs
Bending amplitude 3mm for 10 seconds
245 ±5°C for 3 seconds
260 ±5°C for 10 seconds
Apply Max. overload voltage for 1 minute
-55°C to +150°C, 100 cycles
1 hour, -65°C, followed by 45 minutes of RCWV
Dimensions
D
L
W
t
1. Alumina Substrate
2. Bottom Electrode (Ag)
3. Top Electrode (Ag-Pd)
4. Edge Electrode (NiCr)
5. Barrier Layer (Ni)
6. External Electrode (Sn)
7. Resistor Layer (NiCr)
8. Overcoat (Epoxy)
9. Marking
C
Part Number
RL73 1H (0201)
RL73 1E (0402)
RL73 1J (0603)
RL73 2A (0805)
RL73 2B (1206)
RL73 2E (1210)
RL73 2H (2010)
RL73 3A (2512)
0.58
1.00
1.60
2.00
3.10
3.10
5.00
6.35
L
±0.05
±0.05
±0.10
±0.15
±0.10
±0.10
±0.20
±0.20
W
0.29 ±0.05
0.50 ±0.05
0.80 ±0.10
1.25 ±0.15
1.55 ±0.15
2.50 ±0.15
2.50 ±0.15
3.10 ±0.15
0.15
0.20
0.30
0.40
0.40
0.50
0.50
0.55
C
±0.05
±0.10
±0.20
±0.25
±0.25
±0.25
±0.25
±0.25
0.12
0.25
0.30
0.30
0.50
0.50
0.60
0.60
D
±0.05
±0.10
±0.20
±0.20
±0.30
±0.30
±0.30
±0.30
0.23
0.32
0.45
0.55
0.55
0.55
0.60
0.60
t
±0.05
±0.10
±0.10
±0.10
±0.10
±0.10
±0.15
±0.10
2
1773269 CIS BI 06/2011
Dimensions are in millimeters
and inches unless otherwise
specified. Values in brackets
are standard equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
For email, phone or live chat, go to:
te.com/help
SMD Low Ohmic - Current Sense Resistors
Type RL73 Series
Recommend Land Pattern
Type
RL73 1H (0201)
RL73 1E (0402)
RL73 1J (0603)
RL73 2A (0805)
RL73 2B (1206)
RL73 2E (1210)
RL73 2H (2010)
RL73 3A (2512)
A
0.25
0.5
0.8
1.0
2.0
2.0
3.6
4.9
B
0.3
0.5
1.0
1.0
1.15
1.15
1.4
1.6
C
0.40 ±0.2
0.60 ±0.2
0.90 ±0.2
1.35 ±0.2
1.70 ±0.2
2.50 ±0.2
2.50 ±0.2
3.10 ±0.2
Packaging Quantity & Reel Specifications
Type
RL73 1H (0402)
RL73 1E (0402)
RL73 1J (0603)
RL73 2A (0805)
RL73 2B (1206)
RL73 2E (1210)
RL73 2H (2010)
RL73 3A (2512)
øA
178.0 ±1.0
178.0 ±1.0
178.0 ±1.0
178.0 ±1.0
178.0 ±1.0
178.0 ±1.0
178.0 ±1.0
178.0 ±1.0
øB
60.0 +1.0
60.0 +1.0
60.0 +1.0
60.0 +1.0
60.0 +1.0
60.0 +1.0
60.0 +1.0
60.0 +1.0
øC
13.5 ±0.7
13.5 ±0.7
13.5 ±0.7
13.5 ±0.7
13.5 ±0.7
13.5 ±0.7
13.5 ±0.7
13.5 ±0.7
W
9.5 ±0.1
9.5 ±0.1
9.5 ±0.1
9.5 ±0.1
9.5 ±0.1
9.5 ±0.1
13.5 ±1.0
13.5 ±1.0
T
11.5 ±1.0
11.5 ±1.0
11.5 ±1.0
11.5 ±1.0
11.5 ±1.0
11.5 ±1.0
15.5 ±1.0
15.5 ±1.0
Paper
Tape
1000 / 5000
1000 / 5000
1000 / 5000
1000 / 5000
1000 / 5000
1000 / 5000
-
-
Embossed
Plastic Tape
-
-
-
-
-
-
1000 / 4000
1000 / 4000
3
1773269 CIS BI 06/2011
Dimensions are in millimeters
and inches unless otherwise
specified. Values in brackets
are standard equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
For email, phone or live chat, go to:
te.com/help
SMD Low Ohmic - Current Sense Resistors
Type RL73 Series
Paper Tape Specification
Type
RL73 1H
RL73 1E
RL73 1J
RL73 2A
RL73 2B
RL73 2E
A
0.38 ±0.05
0.65 ±0.10
1.10 ±0.10
1.60 ±0.10
1.90 ±0.10
2.90 ±0.10
B
0.68 ±0.05
1.15 ±0.10
1.90 ±0.10
2.40 ±0.20
3.50 ±0.20
3.50 ±0.20
W
8.0 ±0.20
8.0 ±0.20
8.0 ±0.20
8.0 ±0.20
8.0 ±0.20
8.0 ±0.20
E
1.75 ±0.10
1.75 ±0.10
1.75 ±0.10
1.75 ±0.10
1.75 ±0.10
1.75 ±0.10
F
3.50 ±0.05
3.50 ±0.05
3.50 ±0.05
3.50 ±0.05
3.50 ±0.05
3.50 ±0.05
P
0
4.00 ±0.10
4.00 ±0.10
4.00 ±0.10
4.00 ±0.10
4.00 ±0.10
4.00 ±0.10
P
1
2.00 ±0.05
2.00 ±0.05
4.00 ±0.05
4.00 ±0.05
4.00 ±0.05
4.00 ±0.05
P
2
øD
0
T
0.42 ±0.20
0.45 ±0.10
0.70 ±0.10
0.85 ±0.10
0.85 ±0.10
0.85 ±0.10
2.00 ±0.05 1.50+0.1,-0
2.00 ±0.05 1.50+0.1,-0
2.00 ±0.05 1.50+0.1,-0
2.00 ±0.05 1.50+0.1,-0
2.00 ±0.05 1.50+0.1,-0
2.00 ±0.05 1.50+0.1,-0
Embossed Plastic Tape Specifications
Type
RL73 2H
RL73 3A
A
2.80±0.10
3.50±0.10
B
5.50±0.10
6.70±0.10
W
12.0±0.10
12.0±0.10
E
1.75±0.10
1.75±0.10
F
5.5±0.05
5.5±0.05
P
0
4.00±0.05
4.00±0.05
P
1
4.00±0.10
4.00±0.10
P
2
2.00±0.05
2.00±0.05
øD
0
1.50+0.10
1.50+0.10
T
1.00±0.20
1.00±0.20
How to Order
RL73
Common Part
H
TCR
X -1000PPM
V - 600PPM
N - 300PPM
RL73
H - 100PPM
K - 200PPM
See above for
applicability
2A
Size
1H -0201
1E -0402
1J -0603
2A -0805
2B -1206
2E -1210
2H -2010
3A -2512
R10
Resistor Value
F
Tolerance
TG
Packaging
0.1 Ohm
(100milliOhm)
R10
0.91 Ohm
(910 milliOhm)
R91
TDF -1000 REEL
TD -5000 REEL
F - ±1%
TE -4000 REEL
J - ±5%
See above for
applicability
TE Connectivity, TE connectivity (logo) and TE (logo) are trademarks.
Other logos, product and Company names mentioned herein may be trademarks of their respective owners.
4
While TE has made every reasonable effort to ensure the accuracy of the information in this datasheet, TE does not guarantee that it is error-free, nor does TE make any other
representation, warranty or guarantee that the information is accurate, correct, reliable or current. TE reserves the right to make any adjustments to the information contained herein
at any time without notice. TE expressly disclaims all implied warranties regarding the information contained herein, including, but not limited to, any implied warranties of merchantability
or fitness for a particular purpose. The dimensions in this datasheet are for reference purposes only and are subject to change without notice. Specifications are subject to change
without notice. Consult TE for the latest dimensions and design specifications.
I'm learning about TI's msp430 recently. I installed the CCS10.04 version downloaded from the official website, but found that I couldn't create a Grace project. I don't know how to install Grace on C...
When designing Cadence PCB, after setting the large cross cursor, the cursor cannot be seen. When setting it to a small cursor, it is normal. What is the reason?...
Currently, many wearable devices on the market are facing problems with data accuracy and connection stability. Inaccurate detection data and unstable connection will affect the user experience and ev...
I haven't posted for a long time. I am very happy to have the opportunity to develop and evaluate the GD32L233C-START. I would like to express my gratitude to GigaDevice and EE!
Let's take a look at t...
Headhunting position [Suzhou] Job responsibilities: 1. Design framework solutions according to requirements; 2. Be responsible for embedded Linux software development and testing; 3. Write related com...
Shanxi Guorun Energy Storage Technology Co., Ltd. is booming and in urgent need of outstanding talents as the cornerstone and source of power. We sincerely invite people with lofty ideals to join u...[Details]
China Energy Storage Network:
The essence of energy internet lies in user demand-centered and low-carbonization of the entire industry chain. Under the intensive catalysis of multiple policie...[Details]
In 2018, my country's cumulative installed capacity of renewable energy power generation exceeded 350 million kilowatts, ranking first in the world for six consecutive years and twice that of the s...[Details]
"The pine oil lamp is retired"
——State Grid Tibet Power helps the snowy plateau win the battle against poverty
"We have clearly defined the work ideas and plans to fully serve the fight a...[Details]
People in the IC design industry said that since new production capacity will not be opened in large quantities until 2023, wafer foundries will have to maintain upward profit performance under limit...[Details]
Direct torque control (DTC) AC speed regulation technology is a new type of high-performance variable frequency speed regulation technology developed after vector control frequency conversion. DTC ...[Details]
IQE plc (IQE or the Group), a leading global supplier of compound semiconductor wafer products and advanced materials solutions
, has announced the signing of a multi-year agreement with Macr...[Details]
In any switching power supply design, the physical design of the PCB board is the last link. If the design method is not appropriate, the PCB may radiate too much electromagnetic interference, caus...[Details]
1. Protues new project Open Protues, open the ISIS icon on the homepage, and draw the circuit diagram Enter the following drawing interface Chips, resistors, capacitors, etc. in the circuit can a...[Details]
Humanoid robots have become one of the hot spots for development that the world is optimistic about. With the efforts of both policies and industries, the industrialization of Chinese humanoid robo...[Details]
Due to the continued spread of the new coronavirus pandemic around the world, the International Consumer Electronics Show (CES 2021) opened online for the first time. On the opening day (11th), in th...[Details]
Since the infrared radiation energy on the surface of the inspected electrical equipment is transmitted to the infrared detection instrument through the atmosphere, it will be attenuated by the absorp...[Details]
The digital transformation of the power grid is a common point of excitement for the two networks. Power grid practitioners are particularly encouraged and excited by the potential for change broug...[Details]
The process of PLC control is generally as follows:
Figure 1.1 Typical PLC startup process
Input refresh - run the user program again - output refresh - input refresh again - ...[Details]
Preface
The automotive industry is currently at a very challenging historical moment. With the ever-changing application scenarios such as electrification, intelligence, networking and sharing...[Details]
TI Technology Forum
京公网安备 11010802033920号
EEWORLD
