EEWORLDEEWORLDEEWORLD

Part Number

Search

0402J2001P60BQT

Description
Ceramic Capacitor, Multilayer, Ceramic, 200V, 6.25% +Tol, 6.25% -Tol, C0G, 30ppm/Cel TC, 0.0000016uF, Surface Mount, 0402, CHIP, ROHS COMPLIANT
CategoryPassive components    capacitor   
File Size695KB,2 Pages
ManufacturerSyfer
Environmental Compliance  
Download Datasheet Parametric View All

0402J2001P60BQT Overview

Ceramic Capacitor, Multilayer, Ceramic, 200V, 6.25% +Tol, 6.25% -Tol, C0G, 30ppm/Cel TC, 0.0000016uF, Surface Mount, 0402, CHIP, ROHS COMPLIANT

0402J2001P60BQT Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerSyfer
package instruction, 0402
Reach Compliance Codecompli
ECCN codeEAR99
capacitance0.0000016 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high0.6 mm
JESD-609 codee3
length1 mm
Manufacturer's serial number0402
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance6.25%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Package formSMT
method of packingTR, 7 INCH
positive tolerance6.25%
Rated (DC) voltage (URdc)200 V
seriesSIZE(HIGH Q)
size code0402
surface mountYES
Temperature characteristic codeC0G
Temperature Coefficient-/+30ppm/Cel ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrie
Terminal shapeWRAPAROUND
width0.5 mm
High Q
Capacitors
MS Range
The Syfer MS range offers a
very stable, High Q material
system that provides excellent,
low loss performance in
systems below 3GHz. The
range is available in 0402 to
3640 case sizes with various
termination options including
FlexiCap™. This range of high
frequency capacitors is suitable
for many applications where
economical, high performance
is required.
Specification
Capacitance Values
See Capacitance table overleaf
Mechanical
Termination Material
See Ordering Information overleaf
Solderability
IEC 60068-2-58
Printing
Consult sales office
Lead Free Soldering
Termination codes J and Y ranges are
fully compliant with the RoHS and WEEE
directives and parts are compatible
with lead free solders.
Climatic Category
55/125/56
Reeled Quantities
See Capacitance table overleaf
Electrical
Operating Temperature
-55°C to +125°C
Temperature Coefficient
(Typical)
0 ± 30 ppm/°C
Insulation resistance at +25°C
>100GΩ
Insulation resistance at +125°C
>10GΩ
Ageing rate
None
Piezoelectric Effects
None
Dielectric Absorption
None
Dimensions
L1
T
SA
AR MPLE
REF E AVA KITS
IL
E
OR R TO ABLE
S
S
FOR YFER ALES
DET .COM
AIL
S
W
L2
Size
0402
0505
0603
0805
1206
1111
1210
1812
2220
2225
38/09
3640
Length (L1)
mm (inches)
1.00 ± 0.10 (0.039 ± 0.004)
1.40 ± 0.38 (0.055 ± 0.015)
1.60 ± 0.20 (0.063 ± 0.008)
2.00 ± 0.30 (0.080 ± 0.012)
3.20 ± 0.30 (0.126 ± 0.012)
2.79 +0.51 -0.25 (0.11 +0.02 -0.01)
3.20 ± 0.30 (0.126 ± 0.012)
4.50 ± 0.35 (0.180 ± 0.014)
5.70 ± 0.40 (0.225 ± 0.016)
5.70 ± 0.40 (0.225 ± 0.016)
9.15 ± 0.50 (0.360 ± 0.020)
Width (W)
mm (inches)
0.50 ± 0.10 (0.020 ± 0.004)
1.40 ± 0.25 (0.055 ± 0.010)
0.80 ± 0.20 (0.031 ± 0.008)
1.27 ± 0.20 (0.050 ± 0.008)
1.60 ± 0.20 (0.063 ± 0.008)
2.79 ± 0.38 (0.110 ± 0.015)
2.50 ± 0.30 (0.100 ± 0.012)
3.20 ± 0.30 (0.126 ± 0.012)
5.00 ± 0.40 (0.197 ± 0.016)
6.30 ± 0.40 (0.250 ± 0.016)
10.16 ± 0.50 (0.400 ± 0.020)
Thickness (T)
mm (inches)
Termination Band (L2)
mm (inches)
min
max
0.40 (0.016)
0.50 (0.020)
0.40 (0.016)
0.75 (0.030)
0.75 (0.030)
0.63 (0.025)
0.75 (0.030)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.50 (0.059)
0.10 (0.004)
0.13 (0.005)
0.10 (0.004)
0.13 (0.005)
0.25 (0.010)
0.13 (0.005)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.50 (0.020)
0.60 max (0.024 max)
1.27 max (0.050 max)
0.80 max (0.031 max)
1.30 max (0.051 max)
1.70 max (0.067 max)
2.54 max (0.100 max)
2.00 max (0.079 max)
2.50 max (0.098 max)
2.50 max (0.098 max)
2.50 max (0.098 max)
2.50 max (0.098 max)
Who is holding back Moore's Law?
In response to recent accusations that back-end equipment lags behind Moore's Law , a senior executive at a chip equipment manufacturer insisted that the development speed of wire-bonding technology e...
leslie PCB Design
Summary of DSP boot mode / boot loader / power-on sequence / online upgrade and other issues
Device used: TI DSP C2000 2837X 1. DSP power-on process, boot mode and boot loader1) dsp power-on sequence,For a dual-core system, its power-on startup sequence is as follows:After the system is reset...
fish001 DSP and ARM Processors
【Silicon Labs BG22-EK4108A Bluetooth Development Evaluation】 III. Modify the example project to achieve dual-channel PWM output
[i=s]This post was last edited by zhang1gong on 2022-1-11 20:38[/i]Silicon Labs provides many example projects in SSv5 (Simplicity Studio 5) IDE. Many actual projects we need to implement can be expan...
zhang1gong Development Kits Review Area
Does anyone have the routine for balancing a ball? It's a ping-pong ball sliding on a round flat surface and never falling off.
Does anyone have the routine for the ball balance? It's a ping-pong ball sliding on a round plate and never falling off~ Or his program idea is also fine~...
hd666666 PCB Design
micropython update: 2020.5
Updated May 2020py/parse: Support constant folding of power operator for integers. esp32/partitions: Update comments in files regarding offset. esp32: Improve support for OTA updates. docs/library: Fi...
dcexpert MicroPython Open Source section
IPC-TM-650 Test Method Manual CN Chinese Version 2020 Latest (104 Methods) Scanned Version
IPC-TM-650 Test Method Manual CN Chinese Version 2020 Latest (104 Methods) Scanned Version[ attach]565359[/attach]...
李强980702 Download Centre

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号