Who is holding back Moore's Law?

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Who is holding back Moore's Law? [Copy link]

In response to recent accusations that back-end equipment lags behind Moore's Law , a senior executive at a chip equipment manufacturer insisted that the development speed of wire-bonding technology equipment is ahead of Moore's Law, and it is IC testing and other equipment that are holding back Moore's Law.

Earlier, senior executives at Philips Semiconductors warned that the back-end industry, including IC packaging and automatic test equipment ( ATE ) providers, is lagging behind the pace of Moore's Law and the entire industry has yet to be formed.

At the recent Semicon West trade show, Scott Kulicke, chairman and CEO of Kulicke & Soffa Industries (K&S), responded to Philips's statement and insisted that wire bonding technology is ahead of the pace of Moore's Law and can therefore provide new chip packaging services. According to the company, K&S is one of the world's largest suppliers of wire bonding equipment, and it actively follows the development of the latest IC technology to provide machines with higher throughput and pad density.

"I think we are ahead of the promise of Moore's Law," Kulicke said. "We have reduced our production costs by a factor of two; we have high production rates even for the next 15 to 18 months. Unfortunately, the average selling price (ASP) is showing another trend."

At the same time, Kulicke admitted that the real problem in the back end is not the wire bonding equipment running at full capacity; the problem is other back-end installation equipment, such as dicing equipment, die bonding equipment and automatic test equipment (ATE) are lagging behind.

“Testing is a big problem, and the cost is increasing,” Kulicke said.

Source: EE Times

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Haha, I don't agree. Laws are used to describe and summarize phenomena and rules. How can we say that phenomena lag behind laws? It doesn't make sense.