FIFO, 512X9, 20ns, Asynchronous, CMOS, CDFP28, CERPACK-28
Parameter Name | Attribute value |
Maker | Rochester Electronics |
package instruction | DFP, |
Reach Compliance Code | unknow |
ECCN code | EAR99 |
Maximum access time | 20 ns |
Other features | RETRANSMIT |
period time | 30 ns |
JESD-30 code | R-GDFP-F28 |
JESD-609 code | e0 |
length | 18.288 mm |
memory density | 4608 bi |
memory width | 9 |
Number of functions | 1 |
Number of terminals | 28 |
word count | 512 words |
character code | 512 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 512X9 |
Exportable | NO |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DFP |
Package shape | RECTANGULAR |
Package form | FLATPACK |
Parallel/Serial | PARALLEL |
Maximum seat height | 2.286 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | TIN LEAD |
Terminal form | FLAT |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
width | 9.144 mm |
IDT7201LA20XE | |
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Description | FIFO, 512X9, 20ns, Asynchronous, CMOS, CDFP28, CERPACK-28 |
Maker | Rochester Electronics |
package instruction | DFP, |
Reach Compliance Code | unknow |
ECCN code | EAR99 |
Maximum access time | 20 ns |
Other features | RETRANSMIT |
period time | 30 ns |
JESD-30 code | R-GDFP-F28 |
JESD-609 code | e0 |
length | 18.288 mm |
memory density | 4608 bi |
memory width | 9 |
Number of functions | 1 |
Number of terminals | 28 |
word count | 512 words |
character code | 512 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
organize | 512X9 |
Exportable | NO |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DFP |
Package shape | RECTANGULAR |
Package form | FLATPACK |
Parallel/Serial | PARALLEL |
Maximum seat height | 2.286 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | TIN LEAD |
Terminal form | FLAT |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
width | 9.144 mm |